• 제목/요약/키워드: Thermal Analysis Model

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열해석 모델 간략화 및 동적특성에 관한 연구 (A STUDY ON THERMAL MODEL REDUCTION AND DYNAMIC RESPONSE)

  • 전형열;김정훈
    • 한국전산유체공학회지
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    • 제19권4호
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    • pp.37-44
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    • 2014
  • A detailed satellite panel thermal model composed of more than thousands nodes can not be directly integrated into a spacecraft thermal model due to its node size and the limitation of commercial satellite thermal analysis programs. For the integration of the panel into the satellite thermal model, a reduced thermal model having proper accuracy is required. A thermal model reduction method was developed and validated by using a geostationary satellite panel. The temperature differences of main components between the detailed and the reduced thermal model were less than $1^{\circ}C$ in steady state analysis. Also, the dynamic responses of the detailed and the reduced thermal model show very similar trends. Thus, the developed reduction method can be applicable to actual satellite thermal design and analysis with resonable accuracy and convenience.

Thermal stress analysis around a cavity on a bimetal

  • Baytak, Tugba;Bulut, Osman
    • Structural Engineering and Mechanics
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    • 제69권1호
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    • pp.69-75
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    • 2019
  • The plates made of two materials joined to each other having the different coefficient of thermal expansions are frequently encountered in the industrial applications. The stress analysis of these members under the effect of high-temperature variation has great importance in design. In this study, the stress analysis of the experimental model developed for the problem considered here was performed by the method of photothermoelasticity. The thermal strains were formed by the mechanical way and these were fixed by the strain freezing method. For the stress measurements, the method of slicing is applied which provides three-dimensional stress analysis. The analytical solution in the literature was compared with the related stress distribution obtained from the model. Moreover, the axisymmetric finite element model developed for the problem was solved by ABAQUS and the results obtained here compared with those of the experimental model and the analytical solution. As a result of this study, this experimental method and numerical model can be used for these type of thermal stress problems which have not been comprehensively analyzed yet.

다중열원모델의 열모드기반 열변위오차 예측 (Investigation of the Thermal Mode-based Thermal Error Prediction for the Multi-heat Sources Model)

  • 한준안;김규하;이선규
    • 한국정밀공학회지
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    • 제30권7호
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    • pp.754-761
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    • 2013
  • Thermal displacement is an important issue in machine tool systems. During the last several decades, thermal error compensation technology has significantly reduced thermal distortion error; this success has been attributed to the development of a precise, robust thermal error model. A major advantage of using the thermal error model is instant compensation for the control variables during the modeling process. However, successful application of thermal error modeling requires correct determination of the temperature sensor placement. In this paper, a procedure for predicting thermal-mode-based thermal error is introduced. Based on this thermal analysis, temperature sensors were positioned for multiple heat-source models. The performance of the sensors based on thermal-mode error analysis, was compared with conventional methods through simulation and experiments, for the case of a slide table in a transient state. Our results show that for predicting thermal error the proposed thermal model is more accurate than the conventional model.

저궤도위성 광학탑재체의 열진공시험 결과를 이용한 열해석 모델 보정 (The Correlation of Thermal Analysis Model using Results of LEO Satellite Optical Payload's Thermal Vacuum Test)

  • 김민재;허환일;김상호;장수영;이덕규;이승훈;최해진
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2010년도 제35회 추계학술대회논문집
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    • pp.620-621
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    • 2010
  • 우주공간에서 임무를 수행하는 인공위성이 궤도상에서 원활하게 작동할 수 있도록 열모델의 보정과정을 통하여 열해석 모델을 검증하는 과정이 이루어진다. 본 연구에서는 열해석 모델을 검증하는 과정으로 지상 열진공시험결과를 이용하여 요구조건을 충족시키기 위하여 열모델의 보정을 수행하였다.

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히트 파이프가 장착된 정지궤도 위성 패널 열해석 프로그램 개발 (DEVELOPMENT OF THERMAL ANALYSIS PROGRAM FOR HEAT PIPE INSTALLED PANEL OF GEOSTATIONARY SATELLITE)

  • 전형열;기정훈;한조영;채종원
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 2010년 춘계학술대회논문집
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    • pp.416-421
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    • 2010
  • The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat dissipation of electronics units and utilize several heat pipe networks to control the temperatures of units and the satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary design stage so several thousands of nodes of more are utilized in order to perform thermal analysis of panel. Generating a large number of nodes(meshes) of the panel takes time and is tedious work because the mesh can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required in order to generate detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of panel thermal analysis program with ist main modules and its main functions.

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정지궤도위성 위성체패널 열해석 프로그램 개발 (DEVELOPMENT OF THERMAL ANALYSIS PROGRAM FOR GEOSTATIONARY SATELLITE PANEL)

  • 전형열;김정훈;한조영;채종원
    • 한국전산유체공학회지
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    • 제15권3호
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    • pp.66-72
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    • 2010
  • The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat and utilize several heat pipe networks to control the temperatures of units and the main structures of satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary satellite design stage, so several thousands of nodes or more are utilized in order to perform detailed thermal analysis of panel. Generating a large number of panel nodes takes time and is tedious work because the nodes can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required to generate a detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of the panel thermal analysis program with its main modules and functions.

저궤도 인공위성 열-구조 모델 열진공시험 결과를 활용한 열모델 보정 (The Correlation of Satellite Thermal Mathematical Model using Results of Thermal Vacuum Test on Structure-Thermal Model)

  • 이장준;김희경;현범석
    • 한국항공우주학회지
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    • 제37권9호
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    • pp.916-922
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    • 2009
  • 우주공간에서 임무를 수행하는 인공위성의 열설계는 열모델을 활용한 열해석 결과를 바탕으로 수행되므로, 열모델의 정확성은 매우 중요하며 이것은 보정과정을 통하여 향상된다. 열모델의 보정은 인공위성이 열진공 챔버에 장착된 형상을 모사하는 모델링에서 시작하여 실제형상과 열모델간의 일치성에 대한 검증, 거시적 변수에서부터 미시적 변수에 이르기까지 열모델 변수에 대한 조정 등을 거쳐 주어진 성공 조건을 만족할 때까지 열모델을 지속적으로 수정하는 과정으로 이루어진다. 본 연구에서는 열모델 보정의 성공 기준을 수립하고 인공위성 열-구조 모델 열진공 시험결과를 활용한 열모델 보정을 수행하여 보정 기준을 충족시켰다. 본 연구에서 보정이 완료된 열모델은 저궤도 인공위성 상세 열설계에 적용될 수 있었다.

전자장비 회로기판의 열응력해석 (Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages)

  • 권영주;김진안
    • 한국CDE학회논문집
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    • 제9권4호
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

열전지 성능 시뮬레이션을 위한 기초 모델에 대한 연구 (A Study on the Basic Model for Simulating Performance of Thermal-Batteries)

  • 지현진
    • 한국군사과학기술학회지
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    • 제11권1호
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    • pp.102-111
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    • 2008
  • This paper describes the basic model and simulation results of thermal battery. Voltage and thermal analysis is a critical part of thermal-battery design because of the need to maintain the inner temperature above the electrolyte melting point. Traditionally, battery design has depended on an empirical approach, in which prototype batteries are outfitted with thermocouples and the design of subsequent batteries is refined accordingly. We have developed the basic model that allows the design engineer to configure or modify a battery, quickly conduct a thermal analysis, and efficiently review the results. Based on performance tests, the thermal-battery model was established and the effect of design parameters on battery performance was analyzed.

지구관측 소형위성 비행모델의 열제어계 개발 및 성능 검증 (Development and Performance Validation of Thermal Control Subsystem for Earth Observation Small Satellite Flight Model)

  • 장진수;정연황;김병진
    • 한국항공우주학회지
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    • 제36권12호
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    • pp.1222-1228
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    • 2008
  • ㈜쎄트렉아이는 UAE의 EIAST와 함께 2008년 발사를 목표로 SI-200 표준버스시스템을 기반으로 하는 DubaiSat-1 비행모델을 개발하였다. DubaiSat-1 비행모델의 열제어계는 전력 소비의 최소화를 위해 수동 열제어를 기반으로 하되, 주요 부품에는 히터를 이용한 능동 열제어가 이뤄지도록 설계되었다. 또한 열해석 모델을 작성하여 DubaiSat-1의 임무궤도에 대해 열해석을 수행하였으며, 해석 결과를 토대로 모든 구성품이 설계 요구조건을 만족시킬 수 있도록 설계 보정 작업을 진행하였다. 또한 우주환경을 모사한 열진공시험을 수행하여 DubaiSat-1 비행모델의 열제어 성능에 대해 검토하였으며, 시험 결과와 해석 결과의 비교를 통한 열해석 모델의 보정 작업을 완료하였다.