• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.8 no.6
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• pp.939-946
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• 2018

In this work, we present simple schematics for a three-terminal graphene-based nanoelectromechanical switch with the vertical electrode, and we investigated their operational dynamics via classical molecular dynamics simulations. The main structure is both the vertical pin electrode grown in the center of the square hole and the graphene covering on the hole. The potential difference between the bottom gate of the hole and the graphene of the top cover is applied to deflect the graphene. By performing classical molecular dynamic simulations, we investigate the nanoelectromechanical properties of a three-terminal graphene-based nanoelectromechanical switch with vertical pin electrode, which can be switched by the externally applied force. The elastostatic energy of the deflected graphene is also very important factor to analyze the three-terminal graphene-based nanoelectromechanical switch. This simulation work explicitly demonstrated that such devices are applicable to nanoscale sensors and quantum computing, as well as ultra-fast-response switching devices.

• Pediatric Gastroenterology, Hepatology & Nutrition
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• v.20 no.3
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• pp.204-209
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• 2017

Ingestion of foreign body in children is a relatively common problem among paediatric population. The foreign bodies mostly pass spontaneously through the gastrointestinal tract. However, complications can occur according to its anatomical location, the characteristics of the foreign body, and delays in management. Although the cases of ingested button batteries or sharp objects impacted at the gastrointestinal tract can be very serious, there have been very only a few cases have reported colonoscopic removal of these dangerous foreign bodies in adults, and there have been no case reports in children. We report one case of a button battery and one case of an open safety pin, both impacted in the terminal ileum that had moved from the stomach within a few hours of ingestion and were eventually managed by colonoscopy without any complications.

• Journal of the Korea Safety Management & Science
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• v.20 no.3
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• pp.21-26
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• 2018

This paper describes result of a study on safety against a fire of charging cable for mobile phone for vehicle. Combustion on the USB cable in the car was happened while driving. Gas coming from the burning USB cable could be a reason which can make a secondary car accident since the driver also can be embarrassed while driving. In order to prevent a secondary car accident connected on the road, to research a reason why USB cable can emit gas and be burned in charging. We did simulation test with abnormal fault condition for the electronic component on the board in the USB cable. So we get the result from abnormal fault condition simulation test, for instance, shorted test for output terminal of 8 pin switch, shorted test for chip resistor after thermal aging in the condition $25^{\circ}C$, 93 % RH during 48 hours. To analysis the result of all test, Combustion on the USB cable was not the 8 pin but other electrical component such as a chip resistor. Therefore we guess that the reason for USB cable combustion in charging in a car was not 8 pin and a LED but another defective component.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1073-1076
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• 2003

This paper shows the performance as a photodetector of InP/InGaAs HPT operated with a base bias and forntside optical injection through the emitter. InP/InGaAs HPT produced the high optical gain of about 16.2 where HPT is biased at Vc=1V, I$_{B}$=20$\mu$A with an input optical power of 2.4$\mu$W. And we examined that the optical gain of HPTs becomes larger when operating in 3-terminal configuration rather than 2-terminal with the floating base. The optical performance of InP/InGaAs HPT is an attractive to the PIN Photodetector for use in long wavelength optical receivers.s.

• Journal of Sensor Science and Technology
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• v.3 no.3
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• pp.16-21
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• 1994

A 3-terminal pin-type photosensor with gate contrail is fabricated using standard silicon CMOS IC process. The photosensor of a $100{\mu}m{\times}120{\mu}m$ size has dark current less than 1nA and its breakdown voltage is -14V with a depletion capacitance 0.75 pF at -5V reverse bias. Responsivity at 0V gate voltage is 0.25A/W at $0.633{\mu}m$ wavelength, 0.19A/W at $0.805{\mu}m$. Responsivity increases with increasing gate voltage. The integrated circuit of photosensor and CMOS inverter shows $22K{\Omega}$ transimpedance and photocurrent of $90{\mu}A$ switchs the output state of digital inverter without additional amplifier.

• Journal of the Korean Society of Safety
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• v.28 no.3
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• pp.69-73
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• 2013

The purpose of this paper is to analyze the carbonization pattern and operation characteristics of an MCCB. The MCCB is consisted of the actuator lever, actuator mechanism, bimetallic strip, contacts, up and down operator, arc divider or extinguisher, metal operation pin, terminal part, etc. When the actuator lever of the MCCB is at the top or the internal metal operation pin is in contact with the front part, the MCCB is turned on or off. It means trip state if the actuator lever or the internal metal operation pin moves to back side. In the UL 94 vertical combustion test, white smoke occurred from the MCCB when an average of 17~24 seconds elapsed after the MCCB was ignited and black smoke occurred when an average of 45~50 seconds elapsed. It took 5~6 minutes for the MCCB surface to be half burnt and took an average of 8~9 minutes for the MCCB surface to be entirely burnt. In the UL 94 test, the MCCB trip device operated when an average 7~8 minutes elapsed. If the MCCB trip has occurred, it may have been caused by an electrical problem such as a short-circuit, overcurrent, etc., as well as fire heat. From the entire part combustion test according to KS C 3004, it was found that the metal operation pin could be moved to the MCCB trip position without any electrical problems.

• Design & Manufacturing
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• v.10 no.1
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• pp.36-40
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• 2016

Connectors transmit electric signals to different parts in compact mobile display products. As products that apply this have become lightweight and smaller in size, there are growing demands for smaller and more integrated connectors, which are internal parts of the products. As a measure to address these demands, there is the planar array connector that minimizes the part by arranging the single-direction BTB connectors to two directions. As connectors become smaller in size and more highly integrated, maintaining intensity to prevent defects during impact and maintaining adhesive force to smoothly transmit electric signals are growing in importance. Thus, in order to identify the impact of concave shaping on improving adhesive power in connector terminal pins as a method to increase the connecting power of planar array connector terminal pins, this study predicted and examined the concave shaping method, number of concave shapes, and the adhesive power according to the size of the concave shape through CAE. For concave shaping, the model that added concave shaping towards the lower part of the connector terminal pin and added spokes for the area pressed down by the concave shaping was 0.74 N, showing increased adhesive force compared to existing models. Furthermore, when applying two concave shaping, rather than just one, there was a tendency for adhesive force to increase. In the case of adhesive power trends according to the size of the concave shaping, adhesive power increased and the width of the concave shape decreased, and the biggest adhesive force trends were shown when the concave shaping depth was 0.01mm.

• ETRI Journal
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• v.35 no.2
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• pp.245-252
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• 2013

In this work, we study the physical layer solutions for 10-gigabit-capable passive optical networks (PONs), particularly for an optical link terminal (OLT) including a 10-Gbit/s electroabsorption modulated laser (EML) and a 2.5-Gbit/s burst mode receiver (BM-Rx) in a novel bidirectional optical subassembly (BOSA). As unique features, a bidirectional mini-flat package and a 9-pin TO package are developed for a 10-gigabit-capable PON OLT BOSA composed of a 1,577-nm EML and a 1,270-nm avalanche photodiode BM-Rx, including a single-chip burst mode integrated circuit that is integrated with a transimpedance and limiting amplifier. In the developed prototype, the 10-Gbit/s transmitter and 2.5-Gbit/s receiver characteristics are evaluated and compared with the physical media dependent (PMD) specifications in ITU-T G.987.2 for XG-PON1. By conducting the 10-Gbit/s downstream and 2.5-Gbit/s upstream transmission experiments, we verify that the developed 10-gigabitcapable PON PMD prototype can operate for extended network coverage of up to a 40-km fiber reach.

• Earthquakes and Structures
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• v.1 no.1
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• pp.129-146
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• 2010

This paper proposes an approximate procedure to estimate seismic displacement capacity - defined as yield displacement times the displacement ductility - of piles in marine oil terminals. It is shown that the displacement ductility of piles is relatively insensitive to most of the pile parameters within ranges typically applicable to most piles in marine oil terminals. Based on parametric studies, lower bound values of the displacement ductility of two types of piles commonly used in marine oil terminals - reinforced-concrete and hollow-steel - with either pin connection or full-moment-connection to the deck for two seismic design levels - Level 1 or Level 2 - and for two locations of the hinging in the pile - near the deck or below the ground - are proposed. The lower bound values of the displacement ductility are determined such that the material strain limits specified in the Marine Oil Terminal Engineering and Maintenance Standard (MOTEMS) are satisfied at each design level. The simplified procedure presented in this paper is intended to be used for preliminary design of piles or as a check on the results from the detailed nonlinear static pushover analysis procedure, with material strain control, specified in the MOTEMS.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.9
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• pp.3517-3523
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• 2010

Single exposure dual X-ray imaging can be used to separate soft and dense-material images for medical and industrial applications. This study keep focusing baggage inspection system(BIS) specifically. New detector modules for single exposure dual X-ray imaging are consisted of low energy detector (LED) and high energy detector (HED). First, the optimized thickness of copper filter coupled HED to separate low energy and high energy was simulated by the given X-ray energy (140 kVp, 1 mA) using Monte Carlo simulation codes, MCNPX. So as a result of simulation, the copper filter thickness is 0.7 mm. For the design of PIN photodiode, ATLAS device simulation tool was used. 16 channels PIN photodiode of 1.5 mm ${\times}$ 3.2 mm for Dual X-ray imaging detector was fabricated in the process of ETRI. And its dark current and quantum efficiency, terminal capacitance were measured. It was proven that the Lanex Fast B coupled HED were a sufficient candidate to replace the CsI(Tl) commerced in dual X-ray system, since these give a strong signal, overcoming system noise. Finally dual X-ray image was acquired through correction of the LED X-ray Image and the HED X-ray Image.