• Title/Summary/Keyword: Technology integration

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A Study on the Effect of Logistics Integration between Shipping Companies and Logistics Companies on Performance (해운기업 및 물류기업 간의 물류통합이 성과에 미치는 영향에 관한 연구)

  • Hyung-Jin Chun
    • Korea Trade Review
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    • v.46 no.4
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    • pp.77-93
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    • 2021
  • The results of this paper show that strategic and technical factors in the integration of logistics between shipping and logistics companies act as a synchronizing factor for internal and external logistics integration. In addition, internal integration of logistics is expanded to external integration, and internal and external logistics integration is shown to enhance the logistics performance of companies. In other words, the greater the strategic need for logistics integration and the higher the utilization of logistics technology, the stronger the motivation for logistics integration. Furthermore, both internal and external integration of logistics have a positive impact on companies' logistics costs and improvement of logistics services.

Timely Force Integration Method for Weapon System Using the Intelligence Technology (정보기술을 적용한 무기체계의 적기 전력화 방안)

  • 양병희
    • Journal of the military operations research society of Korea
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    • v.29 no.2
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    • pp.131-147
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    • 2003
  • The complexity of modern weapon systems using the intelligence technology demands that rapid and effective transition from force requirements to deployment and fielding. Thus this paper deals with the integration of development procedure, evolutionary acquisition, integrated test and evaluation, improvement of the requirements decision process, use of commercial products of high quality and low cost, specification deviation, and the effective use of dual use technology. In general, decision­makers, and military field users shall first consider the moving technology rapidly into use. This study is aimed to improve the defence acquisition management directive for timely force integration of weapon system.

Recent Progress of Hybrid Bonding and Packaging Technology for 3D Chip Integration (3D 칩 적층을 위한 하이브리드 본딩의 최근 기술 동향)

  • Chul Hwa Jung;Jae Pil Jung
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.4
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    • pp.38-47
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    • 2023
  • Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

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A Study on the Selection of Critical Technology Elements(CTEs) Using Integration Relations between Technologies or Components (기술통합관계를 이용한 핵심요소기술(CTEs) 선정방안 연구)

  • Bae, Yoon-Ho;Choi, Seok-Cheol
    • Journal of the Korea Institute of Military Science and Technology
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    • v.13 no.1
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    • pp.50-56
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    • 2010
  • Military technology transition is the process of transition from the science and technology environment to systems to supply effective weapon systems and support systems to the fighters. In case of technology transition decision, immatured technologies result in increasing acquisition cost and delaying schedule toward the objective system. In this paper, we proposed a method to identify and select critical technology elements by integration relations between technologies or components, for supporting technology transition and risk management of military R&D projects.

4S-Van: A Prototype Mobile Mapping System for GIS

  • Lee, Seung-Yong;Kim, Seong-Baek;Choi, Ji-Hoon;Lee, Jong-Hun
    • Korean Journal of Remote Sensing
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    • v.19 no.1
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    • pp.91-97
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    • 2003
  • The design of Graphic Information System(GIS) in various applications is suffering from the difficulty of data acquisition, which is labor-intensive and time consuming. In order to provide the spatial data rapidly and accurately, 4S-Van, a prototype mobile mapping system, has been developed. The 4S-Van consists of 1)Global Positioning System(GPS), Inertial Navigation System(INS) for estimating the geographic position and attitude of the moving van, i.e.,(x, y, z) and the direction of the Van, 2) Charge Coupled Device(CCD) camera and laser scanner for capturing images and for measuring depth from geographic objects, and 3) External Synchronization Device(ESD) and industrial PC for synchronizing data from GPS/INS/CCD camera and for storing the data. In this paper, we present the design and implementation of the proto-Dpe 4S-Van system for spatial data acquisition for various GIS applications.

Direct Geo-referencing for Laser Mapping System

  • Kim, Seong-Baek;Lee, Seung-yong;Kim, Min-Soo
    • Proceedings of the KSRS Conference
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    • 2002.10a
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    • pp.423-427
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    • 2002
  • Contrary to the traditional text-based information, 4S(GIS,GNSS,SIIS,ITS) information can contribute to the citizen's welfare in upcoming era. Recently, GSIS(Geo-Spatial Information System) has been applied and stressed out in various fields. As analyzed the data from GSIS arena, the position information of objects and targets is crucial and critical. Therefore, several methods of getting and knowing position are proposed and developed. From this perspective, Position collection and processing are the heart of 4S technology. We develop 4S-Van that enables real-time acquisition of position and attribute information and accurate image data in remote site. In this study, the configuration of 4S-Van equipped with GPS, INS, CCD and eye-safe laser scanner is shown and the merits of DGPS/INS integration approach for geo-referencing is briefly discussed. The algorithm of DGPS/INS integration fur determination of six parameters of motion is eccential in the 4S-Van to avoid or simplify the complicated computation such as photogrammetric triangulation. 4S-Van has the application of Laser-Mobile Mapping System for three-dimensional data acquisition that merges the texture information from CCD camera. The technique is also applied in the fields of virtual reality, car navigation, computer games, planning and management, city transportation, mobile communication, etc.

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A Study on the Establishment of Integrated Health Information Service Model of Public Libraries

  • Noh, Younghee;Baek, Min-Kyung;Ro, Ji-Yoon
    • International Journal of Knowledge Content Development & Technology
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    • v.12 no.2
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    • pp.57-75
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    • 2022
  • Currently, it is not easy for most domestic public libraries to collect and provide reliable health information services on their own. Health information is distributed or professional, making it inconvenient for users to use. Based on the implications derived from the case study, the Library Health Information Integration Service Model was proposed as a specialized information service. The model consists of a composition shared by librarians, health and medical experts, and users, focusing on library websites that provide integrated health information integration services, and has the following features. First, it provides health and medical information on a specialized subject. Second, it provides integrated health and medical information services provided in various ways. Third, librarians and health and medical experts work together to provide information services. Fourth, users can freely use health information integration services online and offline. The model presented in this study means that libraries can play a leading role in health information integration services to increase the utilization rate of public libraries and further contribute to librarians serving as experts in health information services.

The Effect of Dynamic Visual-Motor Integration Training on the Visual Perception Reaction Velocity (역동적 시각-운동 통합 훈련이 시지각 처리 속도에 미치는 영향)

  • Song, Minok;Lee, Eunsil;Park, Sungho
    • Journal of The Korean Society of Integrative Medicine
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    • v.3 no.4
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    • pp.37-42
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    • 2015
  • Purpose: This study was conducted to test the impact of The Dynamic Visual-Motor integration training has effect on the visual perception reaction velocity. Dynavision were used to measure data from the participating 24 students(K college). Method : The participants were the 24 students of 'K' College in Busan in there twenties. They were divided into the The Dynamic Visual-Motor integration training group and the control group. To know if the Dynamic Visual-Motor integration training has effect on the visual perception reaction velocity, the Dynamic Visual-Motor integration training was implemented triweekly for 4 weeks. In Dynamic Visual-Motor integration training the ball should be grasped with one hand and threw by an arm. Only the balls threw beyond the objective point were counted. The visual perception reaction velocity and the number of response were measured before and after experiment by Dynavision. Result : Firstly, the visual perception reaction velocity was increased in Dynamic Visual-Motor integration training group compared with control group. Secondly, the number of response was also increased in Dynamic Visual-Motor integration training group compared with control group. Conclusion : As a result of The Dynamic Visual-Motor integration training has an effect on the visual perception reaction velocity and the number of response. The Dynamic Visual-Motor integration training seems to be effective for cerebral apoplexy patient who has visual perceptional disability or cerebral palsy child in training for visual perceptional development or daily living activities development. Study participated by more detailed and practical patients in hospital is needed.

Integration Method in Different Kind of TM/TC System (이기종 물관리자동화시스템의 통합 방안)

  • Ko, Gwang-Don;Kwun, Soon-Kuk;Lim, Chang-Young;Kwak, Yeong-Cheol;Kim, Dong-Ju
    • Proceedings of the Korean Society of Agricultural Engineers Conference
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    • 2003.10a
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    • pp.231-234
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    • 2003
  • The Closed Control System, which uses exclusive network and protocol, have been adopted in TM/TC systems. However, the Closed Control System is known that it is not able to support the integration in the water management automation. There are two methods in integration solution in different types of TM/TC System. One solution is hardware system integration that is very expensive and impractical. The other solution is software system integration that uses OLE for Process Control(OPC). In this study, we recommend OPC solution, for KARICO water management, that is the practical and efficient. KARICO is using OPC technology in MMI(Man machine Interface) and water management program. Through this technology, the real-time status of reservoir, pumping station and canal can be achieved without difficulty.

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Advances in Package-on-Package Technology for Logic + Memory Integration

  • Scanlan Christopher
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2005.09a
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    • pp.111-129
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    • 2005
  • Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

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