• Title/Summary/Keyword: Te doped

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Properties of Te Fine Particle Doped SiO2 Gel by the Sol-Gel Method (졸-겔법에 의한 Te 미립자분산 SiO2 겔의 특성)

  • Mun, Shong-Soo;Jo, Bum-Rae;Kang, Bong-Sang
    • Korean Journal of Materials Research
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    • v.12 no.8
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    • pp.650-655
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    • 2002
  • $SiO_2$ gels containing dispersed fine Te metal particles have been prepared by the sol- gel method using a starting solution containing Tetraethoxy Silane (Si($OC_2$ $H_{5}$ )$_4$), $H_2$O, Ethylalchol ($C_2$$H_{5}$OH), Nitric Acid ($HNO_3$) and Tellurium Tetracholoride ($TeCl_4$) in a several molar ratio. Gelling time of sols was about 3 days and viscosity of solution was very low about 2~3 cP for 3 days. Heat-treatments of the gel have been performed at 500, 700, 900, 1100 and $1300^{\circ}C$ for 1 hour, respectively. We have investigated TG-DTA, X-ray diffraction patterns and SEM of heat-treatmented gels. The size of Te fine particles dispersed in $SiO_2$ gel was about 0.8~1 $\mu\textrm{m}$ and the shape was almost quadrangle.

Identification of native defects on the Te- and Bi-doped Bi2Te3 surface

  • Dugerjav, Otgonbayar;Duvjir, Ganbat;Kim, Jinsu;Lee, Hyun-Seong;Park, Minkyu;Kim, Yong-Sung;Jung, Myung-Wha;Phark, Soo-hyon;Hwang, Chanyong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.170.1-170.1
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    • 2016
  • $Bi_2Te_3$ has long been studied for its excellent thermoelectric characteristics. Recently, this material has been known as a topological insulator (TI). The surface states within the bulk band gap of a TI, which are protected by the time reversal symmetry, contribute to the conduction at the surface, while the bulk is in insulating state. In contrast to the bulk defects tuning the chemical potential to the Dirac energy, the native defects near the surface are expected not to change the shape of the Fermi surface and the related spin structure. Using scanning tunneling microscopy (STM), we have systematically characterized surface or near surface defects in p- and n- doped $Bi_2Te_3$, and identified their structure by first principles calculations. In addition, bias-polarity dependences of STM images revealed the electron donor/acceptor nature of each defect. A detailed theoretical study of the surface states near the Dirac energy reveals the robustness of the Dirac point, which verifies the effectiveness of the disturbance on the backscattering from various kinds of defects.

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Effect of n-type Dopants on CoSb3 Skutterudite Thermoelectrics Sintered by Spark Plasma Sintering (Spark Plasma Sintering 법으로 제조한 CoSb3 Skutterudite계 열전소재의 n형 첨가제 효과)

  • Lee, Jae-Ki;Choi, Soon-Mok;Lee, Hong-Lim;Seo, Won-Seon
    • Korean Journal of Materials Research
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    • v.20 no.6
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    • pp.326-330
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    • 2010
  • $CoSb_3$ Skutterudites materials have high potential for thermoelectric application at mid-temperature range because of their superior thermoelectric properties via control of charge carrier density and substitution of foreign atoms. Improvement of thermoelectric properties is expected for the ternary solid solution developed by substitution of foreign atoms having different valances into the $CoSb_3$ matrix. In this study, ternary solid solutions with a stoichiometry of $Co_{1-x}Ni_xSb_3$ x = 0.01, 0.05, 0.1, 0.2, $CoSb_{3-y}Te_y$, y = 0.1, 0.2, 0.3 were prepared by the Spark Plasma Sintering (SPS) system. Before the SPS synthesis, the ingots were synthesized by vacuum induction melting and followed by annealing. For phase analysis X-ray powder diffraction patterns were checked. All the samples were confirmed as single phase; however, with samples that were more doped than the solubility limit some secondary phases were detected. All the samples doped with Ni and Te atoms showed a negative Seebeck coefficient and their electrical conductivities increased with the doping amount up to the solubility limit. For the samples prepared by SPS the maximum value for dimensionless figure of merit reached 0.26, 0.42 for $Co_{0.9}Ni_{0.1}Sb_3$, $CoSb_{2.8}Te_{0.2}$ at 690 K, respectively. These results show that the SPS method is effective in this system and Ni/Te dopants are also effective for increasing thermoelectric properties of this system.

The Phase-change Memory Characteristics of Ge1Se1Te2 Thin Films for Sb Photo Doping (Sb 광도핑에 의한 Ge1Se1Te2 박막의 상변화 메모리 특성)

  • Nam, Ki-Hyun;Kim, Jang-Han;Chung, Hong-Bay
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.5
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    • pp.329-333
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    • 2012
  • For phase transition method, good record sensitivity, low heat radiation, fast crystallization and hi-resolution are essential. Also, a retention time is very important part for phase-transition. In our past papers, we chose composition of $Ge_1Se_1Te_2$ material to use a Se factor which has good optical sensitivity than conventional Sb. Sb/Ge-Se-Te thin films are fabricated and irradiated with UV light source to investigate a reversible phase change by Sb-doped condition. Because of Sb atoms, the Sb inserted sample showed better performance than conventional one. We should note that this novel one showed another possibility for phase-change random access memory.

Reduction of Contact Resistance Between Ni-InGaAs Alloy and In0.53Ga0.47As Using Te Interlayer

  • Li, Meng;Shin, Geon-Ho;Lee, Hi-Deok;Jun, Dong-Hwan;Oh, Jungwoo
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.5
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    • pp.253-256
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    • 2017
  • A thin Te interlayer was applied to a Ni/n-InGaAs contact to reduce the contact resistance between Ni-InGaAs and n-InGaAs. A 5-nm-thick Te layer was first deposited on a Si-doped n-type $In_{0.53}Ga_{0.47}As$ layer, followed by in situ deposition of a 30-nm-thick Ni film. After the formation of the Ni-InGaAs alloy by rapid thermal annealing at $300^{\circ}C$ for 30 s, the extracted specific contact resistivity (${\rho}_c$) reduced by more than one order of magnitude from $2.86{\times}10^{-4}{\Omega}{\cdot}cm^2$ to $8.98{\times}10^{-6}{\Omega}{\cdot}cm^2$ than that of the reference sample. A thinner Ni-InGaAs alloy layer with a better morphology was obtained by the introduction of the Te layer. The improved interface morphology and the graded Ni-InGaAs layer formed at the interface were believed to be responsible for ${\rho}_c$ reduction.

Thermoelectric Properties of Rapid Solidified p-type Bi2Te3 Alloy Fabricated by Spark Plasma Sintering(SPS) Process (방전 플라즈마 소결법(SPS)으로 제조된 급속응고 p-type Bi2Te3 합금의 소결 특성)

  • Moon, Chul-Dong;Hong, Soon-Jik;Kim, Do-Hyang;Kim, Taek-Soo
    • Journal of Powder Materials
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    • v.17 no.6
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    • pp.494-498
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    • 2010
  • The p-type thermoelectric compounds of $Bi_2Te_3$ based doped with 3wt% Te were fabricated by a combination of rapid solidification and spark plasma sintering (SPS) process. The effect of holding time during spark plasma sintering (SPS) on the microstructure and thermoelectric properties were investigated using scanning electron microscope (SEM), X-ray diffraction (XRD) and thermoelectric properties. The powders as solidified consisted of homogeneous thermoelectric phases. The thermoelectric figure of merit measured to be maximum ($3.41{\times}10^{-3}/K$) at the SPS temperature of $430^{\circ}C$.

Characteristics of $Ag_x(Ge_2Sb_2Te_5)_{1-x}$ (x= 0, 0.05, 0.1) thin films for PRAM (PRAM을 위한 $Ag_x(Ge_2Sb_2Te_5)_{1-x}$ (x= 0, 0.05, 0.1) 박막의 특성)

  • Kim, Sung-Won;Song, Ki-Ho;Lee, Hyun-Yong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.21-22
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    • 2008
  • In the paper, we report several experimental data capable of evaluating the phase transformation characteristics of $Ag_x(Ge_2Sb_2Te_5)_{1-x}$ (x =0, 0.05, 0.1) thin films. The $Ag_x(Ge_2Sb_2Te_5)_{1-x}$ phase change thin films have been prepared by thermal evaporation. The crystallization characteristics of amorphous$Ag_x(Ge_2Sb_2Te_5)_{1-x}$ thin films were investigated by using nano-pulse scanner with 658 nm laser diode (power; 1~17 mW, pulse duration; 10~460 ns) and XRD measurement. It was found that the more Ag is doped, the more crystallization speed was 50 improved. In comparision with $Ge_2Sb_2Te_5$ thin film, the sheet resistance$(R_{amor})$ of the amorphous $Ag_x(Ge_2Sb_2Te_5)_{1-x}$ thin films were found to be lager than that of $Ge_2Sb_2Te_5$ film($R_{amor}$ $\sim10^7\Omega/\square$ and $R_{cryst}$ 10 $\Omega/\square$). That is, the ratio of $R_{amor}/R_{cryst}$ was evaluates to be $\sim10^6$ This is very helpful to writing current reduction of phase-change random acess memory.

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