• Journal of Welding and Joining
• /
• v.19 no.1
• /
• pp.75-81
• /
• 2001

The metallurgical study of microconstituents in transient liquid phase bonded joints of Ni-base single crystal superalloys, CMSX-2 and CMSX-4 was investigated employing MBF-80 insert metal. TLP bonding of specimens was carried out at 1,373~1,523K for 0~19.6ks in vacuum. Three types of microconstituents ; needle-like constituent, dot-like constituent and abnormal shape constituent were formed in the bonded interlayer during TLP bonding operation. All these microconstituents were identified as boride. Microconstituents contain a large percentage of Cr in the early stage of bonding. As increasing the holding time, the amount of Cr was decreased and the amount of W, Co and Re were increased. From the analysis results of electron diffraction pattern by TEM, composition of elements in microconstituents were into MBlongrightarrowM$_{5}$B$_3$longrightarrowM$_2$B type with the increased in holding time. It can be explained by the fact that the relative amount of boron in microconstituents was decreased when the holding time was increased.d.

• Proceedings of the KWS Conference
• /
• 2003.05a
• /
• pp.48-51
• /
• 2003

No Abstract, See Full Text

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.231-233
• /
• 2006

• Proceedings of the KWS Conference
• /
• 2006.05a
• /
• pp.263-265
• /
• 2006

• Proceedings of the KWS Conference
• /
• 2001.05a
• /
• pp.265-267
• /
• 2001

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.17-25
• /
• 2017

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

• Journal of Welding and Joining
• /
• v.13 no.2
• /
• pp.132-138
• /
• 1995

Rene80 superalloy was liquid phase diffusion bonded by using boron(B) as an insert material, where B has high diffusivity and higher melting point as an insert material. Bonding procedure and bonding mechanism of Rene80/B/Rene80 joint were investigated. As results, liquid metal was produced by solid state reaction between base metal and insert material on bonding zone. The liquid metal was produced preferentially at the grain boundary. Except for production of liquid metal, other bonding procedure was nearly same as TLP(Transient Liquid Phase) bonding. Bonding time, however, was reduced compared to prior result of TLP bonding. By bonding S.4ks at l453K, Ren80/B/Rene80 joint was isothermally solidified and homogenized where thickness of insert material was 7.5.mu.m.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.1
• /
• pp.7-16
• /
• 2022

Recently, the automobile industry is rapidly changing due to technological development. Next-generation cars with high technology and new functions are on the market. It is essential to develop electronic devices to meet the condition of next-generation cars. In this study, the authors have reviewed recent trends of automotive electronics and packaging technology. Automotive electronics are used in harsh environments compared with other industries. Thus, it is important to improve the reliability of device junctions that directly affect electronics performance. Soldering, TLP (transient liquid phase bonding), and sintering are introduced for the bonding methods in car electronics.

• Proceedings of the KWS Conference
• /
• 2004.05a
• /
• pp.42-44
• /
• 2004

산업용 가스터빈의 버켓용 Ni기 초내열합금 GTD-111의 수리기술로서 천이액상확산접합법(Transcient Liquid Diffusion Bonding Process, 이하 TLP접차법)이 각광받고 있다. 그러나 이 방법은 등온응고 완료까지 장시간이 소요되므로 접합시간을 단축할 수 있는 공정 개발이 필요하다. (중략)

• Proceedings of the KWS Conference
• /
• 2004.05a
• /
• pp.48-50
• /
• 2004

TLP 접합 공정에서 모재와 삽입금속 사이에서의 확산을 통하여 액상 삽입금속은 고온에서 등온으로 유지 시 등온 응고된다. D.S.Duvall은 느린 가열시 매우 빠른 속도로 가열 시 보다 낮은 온도에서 dissolution이 완료되고 응고가 발생할 것으로 예상하였다. (중략)