• The Transactions of the Korean Institute of Electrical Engineers
• /
• v.43 no.6
• /
• pp.951-957
• /
• 1994

We present a new model for the series resistance of inverted-staggered amorphous silicon (a-Si) thin film transistors (TFT's) by employing the current spreading under the source and the drain contacts as well as the space charge limited current model. The calculated results based on our model have been in good agreements with the measured data over a wide range of applied voltage, gate-to-source and gate-to-drain overlap length, channel length, and operating temperature. Our model shows that the contribution of the series resistances to the current-voltage (I-V) characteristics of the a-Si TFT in the linear regime is more significant at low drain and high gate voltages, for short channel and small overlap length, and at low operating temperature, which have been verified successfully by the experimental measurements.

• Proceedings of the KIEE Conference
• /
• 2002.04a
• /
• pp.158-163
• /
• 2002

최근 전자통신기기의 급속화된 발전과 함께 전자부품에 대한 초소형화, 고성능화가 요구되고 있다. 특히 노트북 컴퓨터나, PDA, LCD 모니터와 같이 박막 액정 표시장치(Thin Film Transistor Liquid Crystal Display, TFT-LCD)가 대표적인 예라 볼 수 있다. 이러한 박막 액정 표시장치는 그 내부에 냉음극 형광램프(Cold Cathode Fluroscent Lamp)가 있어서 백라이트의 역할을 하는데 냉음극 형광램프의 특성상 초기 고압의 구동전압을 인가시킬 수 있는 인버터가 필수적이라 하겠다. 본 논문에서는 18인치(4_CCFL), 20인치(6_CCFL) TFT-LCD 모니터용, 멀티램프 구동 인버터를 설계 제작하여 90%에 가까운 효율을 얻었다. 코일손실 및 전자유도의 장애가 없고 불연성의 장점을 가지고, 소형화가 가능한 적층형 압전 변압기를 제작하고 이 제작된 적층형 압전 변압기의 전기적 특성분석을 통한 방전램프 구동용 인버터의 승압용 변압기로써 적용이 가능함을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.352.1-352.1
• /
• 2014

Indium Tin Oxide (ITO) films are the most extensively studied and commonly used as ones of TCO films. The ITO films having a high electric conductivity and high transparency are easily fabricated on glass substrate at a substrate temperature over $250^{\circ}C$. However, glass substrates are somewhat heavy and brittle, whereas plastic substrates are lightweight, unbreakable, and so on. For these reasons, it has been recently suggested to use plastic substrates for flexible display application instead of glass. Many reaearchers have tried to produce high quality thin films at rood temperatures by using several methods. Therefore, amorphous ITO films excluding thermal process exhibit a decrease in electrical conductivity and optical transparency with time and a very poor chemical stability. However the amorphous Indium Gallium Zinc Oxide (IGZO) offers several advantages. For typical instance, unlike either crystalline or amorphous ITO, same and higher than a-IGZO resistivity is found when no reactive oxygen is added to the sputter chamber, this greatly simplifies the deposition. We reported on the characteristics of a-IGZO thin films were fabricated by RF-magnetron sputtering method on the PEN substrate at room temperature using 3inch sputtering targets different rate of Zn. The homogeneous and stable targets were prepared by calcine and sintering process. Furthermore, two types of IGZO TFT design, a- IGZO source/drain material in TFT and the other a- ITO source/drain material, have been fabricated for comparison with each other. The experimental results reveal that the a- IGZO source/drain electrode in IGZO TFT is shown to be superior TFT performances, compared with a- ITO source/drain electrode in IGZO TFT.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.9 no.3
• /
• pp.576-581
• /
• 2005

In this paper. the a-Si:H TFT using ferroelectric of $SrTiO_3$ as a gate insulator is fabricated on glass. High k gate dielectric is required for on-current, threshold voltage and breakdown characteristics of TFT Dielectric characteristics of ferroelectric are superior to $SiO_2$ and $Si_3N_4$. Ferroelectric increases on-current and decreases threshold voltage of TFT and also ran improve breakdown characteristics.$SrTiO_4$ thin film is deposited by e-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C\~600^{\circ}C$. Dielectric constant of ferroelectric is about 60-100 and breakdown field is about IMV/cm. In this paper, the TFT using ferroelectric consisted of double layer gate insulator to minimize the leakage current. a-SiN:H, a-Si:H (n-type a-Si:H) are deposited onto $SrTiO_3$ film to make MFNS(Metal/ferroelectric/a-SiN:H/a-Si:H) by PECVD. In this paper, TFR using ferroelectric has channel length of$8~20{\mu}m$ and channel width of $80~200{\mu}m$. And it shows that drain current is $3.4{\mu}A$at 20 gate voltage, $I_{on}/I_{off}$ is a ratio of $10^5\~10^8,\;and\;V_{th}$ is$4\~5\;volts$, respectively. In the case of TFT without having ferroelectric, it indicates that the drain current is $1.5{\mu}A$ at 20gate voltage and $V_{th}$ is $5\~6$ volts. If properties of the ferroelectric thin film are improved, the performance of TFT using this ferroelectric thin film can be advanced.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.24 no.12A
• /
• pp.2002-2007
• /
• 1999

In this paper, the n-channel poly-Si thin-film transistors (poly-Si TFT's) formed by solid phase crystallization (SPC) on glass were investigated by measuring the electrical properties of poly-Si films, such as I-V characteristics, mobility, leakage current, threshold voltage, and subthreshold slope. It is done to decide to be applied on TFT-LCD with large-size and high density. In n-channel poly-Si TFT with 2, 10, 25$\mu\textrm{m}$ of channel length, the field effect mobilities are 111, 126 and 125 $\textrm{cm}^2$/V-s and leakage currents are 0.6, 0.1, and 0.02 pA/$\mu\textrm{m}$, respectively. Low threshold voltage and subthreshold slope, and good ON-OFF ratio are shown, as well. Thus, the poly-Si TFT’s used by SPC are expected to be applied on TFT-LCD with large-size and high density, which can integrate display panel and peripheral circuit on a large glass substrate.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.119-122
• /
• 2008

In this paper, we describe the current status and issues of the oxide thin-film transistors (OTFTs), which attract much attention as an emerging new backplane technology replacing conventional silicon-based TFTs technologies. First, the unique benefits of OTFTs will be presented as a backplane for large-sized AMOLED including note-book PC, second TV and HD-TV. And then, the state-of-the-art transistor performance and uniformity characteristics of OTFTs will be highlighted. The obtained a-IGZO TFTs exhibited the field-effect mobility of $18\;cm^2/Vs$, threshold voltage of 1.8 V, on/off ratio of $10^9$, and subthreshold gate swing of 0.28 V/decade. In addition, the world largest-sized 12.1-inch WXGA active-matrix organic light emitting diode (AMOLED) display is demonstrated using indium-gallium-zinc oxide (IGZO) TFTs.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.707-710
• /
• 2006

Zinc oxide (ZnO) is typically highly doped n-type semiconductor. To be used for thin-film transistor (TFT) devices, carrier concentration must be controlled precisely. We studied characteristics of ZnO grown by MOCVD at temperatures between $200^{\circ}C$ and $400^{\circ}C$. We found that hydrogen incorporated during growth plays important role in determining carrier density.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.345-345
• /
• 2010

1T-DRAM cell with solid phase (SPC) crystallized poly-Si thin film transistor was fabricated and electrical characteristics were evaluated. The fabricated device showed kink effect by negative back bias. Kink current is due to the floating body effect and it can be used to memory operation. Current difference between "1" state and "0" state was defined and the memory properties can be improved by using gate induced drain leakage (GIDL) current.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.15 no.2
• /
• pp.249-254
• /
• 2015

Solution-derived amorphous indium-gallium-zinc oxide (a-IGZO) thin-film-transistor (TFTs) were developed using a microwave irradiation treatment at low process temperature below $300^{\circ}C$. Compared to conventional furnace-annealing, the a-IGZO TFTs annealed by microwave irradiation exhibited better electrical characteristics in terms of field effect mobility, SS, and on/off current ratio, although the annealing temperature of microwave irradiation is much lower than that of furnace annealing. The microwave irradiated TFTs showed a smaller $V_{th}$ shift under the positive gate bias stress (PGBS) and negative gate bias stress (NGBS) tests owing to a lower ratio of oxygen vacancies, surface absorbed oxygen molecules, and reduced interface trapping in a-IGZO. Therefore, microwave irradiation is very promising to low-temperature process.

• Proceedings of the KIEE Conference
• /
• 1993.07b
• /
• pp.1292-1294
• /
• 1993

This paper proposes a new structure of polycrystalline silicon(poly-Si) thin film transistor(TFT) having a thick gate-oxide below the gate edge. The new structure is fabricated by the gate re-oxidation in wet ambient. It is shown that the thick gate-oxide below the gate edge is effective in reducing the leakage current and the gate-drain overlap capacitance. We have simulated this device by using the SSUPREM4 process simulator and the SPISCES-2B device simulator. As a simulation result it is found that the new structure provides a low tentage current less than 0.2 pA and achieves a on/off ratio as high as $5{\times}10^7$.