• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.4 s.334
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• pp.45-52
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• 2005

This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias.

• Proceedings of the Korea Information Processing Society Conference
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• 2003.05b
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• pp.835-838
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• 2003

인구증가와 발전으로 도시 집중화 현상에 따라 수도의 수요증가가 가속화되는 상태이다. 특히 물 부국현상 및 수질악화로 인한 수원확보도 어려워지고 있는 실정이다. 누수로 인한 막대한 손실을 줄이고자 컴퓨터와 인터넷을 이용하여 누수가 발생할 경우, 누수 여부를 판단하고 중앙모니터링 센터에서 관리할 수 있는 시스템이 필요하다. 따라서 누수를 탐지할 수 있는 구체적인 알고리즘이 필요하고, 전체 감지 시스템을 어떻게 구성할 것인지에 대한 설계가 필요하다. 이것을 가능하게 하는 핵심요인 중에 하나는 TDR 기술을 사용한 누수감지 시스템이다. 본 논문에서는 TDR기술을 이용하여 누수 감지시스템을 제안하고 유효성을 입증하기 위해 파이로트 시스템을 구축하여 시뮬레이션 하였다.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.730-735
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• 2009

The purpose of this study is to consider improvement performance to prevent condensation and draw the optimum insulation design method for building using simulation tool. In this study, the three corners, weak part in condensation, were conducted by three-dimensional steady state simulation. From the results, it is required to strengthen insulation design, and it is founded that existing insulation system typically applied to most Korean apartment buildings has serious insulation defect that insulation is disconnected by structural components at the joints of wall-slab and wall-wall in envelope. So, it is considerate to need a concrete technology improvement.

• KIEAE Journal
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• v.15 no.6
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• pp.81-86
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• 2015

Purpose: Condensation in the apartment housing is one of the most significant defects and complaints for condensation are rapidly increasing according to the growing interest in residential environment. Korea government established a regulation for reducing condensation in the apartment housing and TDR is adapted as a standard. However prevention of condensation depend on improving the performance of building envelop has limitation because of the increase of the cost. Centralized Hybrid ventilation system is suggested to prevent condensation. Method: Field measurement was conducted to verify the ventilation rate of the ventilation system. Based on the measurement, air network and CFD simulation was conducted to analyze ventilation rate for each room. Surface temperature was calculated by regulated TDR according to the regions and surfaces. The performance of condensation prevention was evaluated by the ventilation rate and surface temperature. Result: In the results, it was found that condensation was prevented in more than 90% of households by the centralized hybrid ventilation system which provided 0.19 ~ 0.81ACH for each room.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.41 no.6
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• pp.620-627
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• 2016

This paper proposes an advanced detection technique for cable fault by eliminating the sign of reference signal in STDR(sequence time-domain reflectometry) and SSTDR(spread-spectrum time-domain reflectometry). The proposed fault-detection technique can eliminate the reference signal more effectively than the conventional one since the sign detector can approximately recover the distorted reference signal by cable and connector, and consequently, can detect the reflected signal by fault more effectively than the conventional one. Especially, it is shown that the error rate of proposed technique can be significantly lower than the conventional one in the case of far fault simulation.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.25-32
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• 1997

대용량, 고속 정보처리가 요구되는 System의 모듈은 Data 처리의 고속성 및 회로의 고집적이 가능한 MCM의 형태로 구현되어 ATM, GPS 및 PCS 등의 분야에 광범위하게 응 용되고 있다. 위와 같은 High Speed 응용분야에서의 System 성능은 Interconnect Line의 전달지연, 임피던스 부정합에 의한 신호 반사 손실. 신호선 간의 Crosstalk, Ground Bounce 등의 현상에 대한 최적화 여부에 결정적인 영향을 받는다. 그러나 Interconnect의 특성상 정 형이 존재하지 않으므로 추상적인 Library를 구축하는 형식으로 접근할 수밖에 없으며 이를 위하여 여러기본 구조를 정의한후 각 Dimension을 변수로 두고 해석 결과를 합성하여 Database화하는 접근방식이다. 본 논문에서는 MCM-D 공정을 이용하여 Interconnect Line 특성을 분석하고 Database화 하기 위한 Test Pattern을 구현하고 Time Domain reflectometry(TDR)을 이용하여 그특성들을 측정 분석하였다. Test pattern 제작은 MCM-D 공정으로 최소선폭 27$\mu$m, Via Hole 75$\mu$m으로 형성하였고 2 Layer Signal과 GND로 총 3Layer를 구현하였다. 특성분석을 위해 TDR장비와 모데링 및 Simulation S/W인 IPA 510 을 사용하였다. 이를 통해 MCM-D를 이용한 공정에서 Interconcet Line의 고주파 특성을 측정하고 정량화하여 LIbrary를 제작할수 있었다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.6
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• pp.404-412
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• 2010

The purpose of this study is to accomplished an in-site evaluation method for existing building insulation status using Infra-red camera and to consider improvement performance to prevent condensation and draw the optimum insulation design method for building using simulation tool. The research contents of this study are to evaluate validity and suitability of building insulation defect survey using Infra-red camera for apartment housing with temperature and heat flow pattern analyze method. Based on this research, the three corners, weak part in condensation, were selected in apartment building and conducted simulation by three-dimensional steady state. From the results, it is required to strengthen insulation design, and it is founded that existing insulation system typically applied to most Korean apartment housings have serious insulation defect that insulation is disconnected by structural components at the joints of wall-slab and wall-wall in envelope. Thus, it is considerate to need a concrete technology improvement.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.871-874
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• 1998

A new transmission line parameter extraction method of iC interconnects on silicon substrate is presented. To extract the acurate parameters, the silicon substrate effects were taken into account. Since the electromagnetic fields under the silicon substrate are propagated with slow wave mode, effective dielectric constant and different ground plane with the multi-layer dielectric structures were employed for inductance and capacitance matrix determination. Then accurate signal transients simulation were performed with HSPICE by using the parameters. It was shown that the simulation resutls has an excellent agreement with TDR/TDT measurements.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.415-419
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• 2021

We developed a highly accurate, yet inexpensive, refractive index (RI)-based soil moisture sensor. To detect the RI, a light guide was set with a light-emitting diode and photodiode. When the air fills the space between the soil particles, most of the incident light is reflected at the interface between the waveguide and the air because of the large RI difference. As the moisture of the soil increases, the macroscopic soil RI increases. This allows incident light to pass through the interface. The intensity of the light reaching the photodiode was simulated according to the change in the soil RI. Using the simulation results, we designed and manufactured a curved glass waveguide. We evaluated the performance of the RI-based soil sensor by comparing it with a commercially available, high-cost and high-performance time-domain reflectometer (TDR). Our sensor was 96% accurate, surpassing the costly TDR sensor.