• 한국표면공학회지
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• 제28권4호
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• pp.219-224
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• 1995

The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.

• 한국재료학회지
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• 제15권7호
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• pp.458-464
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 한국재료학회지
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• 제15권1호
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• pp.42-46
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 한국표면공학회지
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• 제29권5호
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• 한국표면공학회지
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• 제26권6호
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.127-128
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• 2005

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate (BA), acrylic acid (AA) and vinyl acetate (VAc) by solution polymerization, triethyl amine (TEA) and trimethylolpropane triacrylate (TMPTA). The PSAs were evaluated by peel strength with varying contents of TMPTA and UV dose, and also glass transition temperature($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased peel strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• 접착 및 계면
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• 제3권1호
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• pp.13-19
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• 2002

We have studied on the surface and adhesion properties for acrylic terpolymers, having both hydrophobic and hydrophilic side chains, synthesized via solution polymerization. In order to develop a waterborne material. we tried to synthesize these terpolymers via emulsion polymerization. The polymeric emulsion synthesized was mainly composed of methyl methacrylate (MMA), methoxy-polyethyleneglycol methacrylate (MPEGMA) having hydrophilic side chains and methoxypolypropyleneglycol methacrylate (MPEGMA) having hydrophobic side chains. The viscosities of this series increased with an increase in the content of the co-monomer such as MPEGMA and (MPEGMA). This behavior resulted in the increase in the diameter and heterogeneity of the emulsion particle via AFM observation. Furthermore. the tensile adhesion strength and 90-degree peel strength of the adhesive of these polymeric emulsions were measured. In the case of polymeric emulsion composed of the same content of both hydrophilic and hydrophobic component, the adhesion property showed the highest value. However, since the adhesion properties as a practical applicable adhesive were poor, some improvements were required. When the composition above was modified with butyl acrylate (BA), the improvement effect on adhesion strength was accepted. In particular, 90-degree peel strength increased up to a maximum of 400% of the original value.

• 접착 및 계면
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• 제11권4호
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• pp.155-161
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• 2010

점착부여수지의 종류와 함량을 달리하여 에틸렌비닐아세테이트 공중합체(Ethylene Vinyl Acetate Copolymer, EVA)를 베이스 폴리머로 하는 핫멜트 접착제를 제조하고, 그것들의 유변학적 거동과 폴리우레탄 기재에 대한 T-peel 접착력을 평가하였다. C5 지방족 석유수지, C9 방향족 석유수지, 수소가 첨가된 디사이클로펜타디엔 석유수지 그리고, 디사이클로펜타디엔/아크릴 모노머 공중합 석유수지가 각각 핫멜트 접착제의 점착부여수지로 사용되었다. 점착부여수지의 산소 함량을 분석하여 점착부여수지의 극성도를 측정하였는데, 디사이클로펜타디엔/아크릴 모노머 공중합 석유수지가 다른 점착부여수지보다 산소 함량이 높은 것을 확인하였다. 디사이클로펜타디엔/아크릴 모노머 공중합 석유수지만이 EVA와 완전한 혼화성을 보였고, 핫멜트 접착제는 모든 조성에서 균일상을 나타내었다. 핫멜트 접착제와 폴리우레탄 기재와의 T-peel 접착력은 핫멜트 접착제 자체의 저장탄성계수(G')보다는 핫멜트 접착제에 첨가된 점착부여수지의 극성도에 의해서 좌우됨이 확인되었다.

• Bulletin of the Korean Chemical Society
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• 제28권2호
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

• 대한금속재료학회지
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• 제47권10호
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• pp.675-680
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• 2009

Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.