• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.443-444
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• 2006

The influence of the heat sources on LED junction temperature are Engine room air, Back plate, Electric power device, and so on. LED lamp cooling system is considered to be an important subject fur high light efficiency. Because LED Chip will be problem When LED junction temperature be over $135^{\circ}C$, In this Study, The Looped Heat Pipe System is considered to prevent LED Chip fall. The LHPS is consist of evaporator part, condenser part, heat pipe part. The working fluid of LHPS is HCFC-123. In this study, to prevent LED Chipfall, we study thermal characteristics for Looped Heat Pipe System with LED lamp.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• 한국통신학회논문지
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• 제34권7A호
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• pp.568-573
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• 2009

본 논문에서 0.13um CMOS 공정으로 설계된 배터리 기반 휴대용 통신 시스템 구동용의 온칩 시동회로를 갖는 스텝다운 CMOS DC-DC 변환기를 제안하였다. 1MHz의 스위칭 주파수를 기반으로 설계된 벅 변환기에는 온칩 시동회로와 커패시터 멀티플라이어 기법을 이용한 보상회로를 포함시켰다. 칩 측정 결과 2.5V ${\sim}$3.3V의 입력 전압을 1.2V로 강압시키는데 최대 87.2%의 효율을 갖는다. 최대 부하 전류, 출력 전류 리플 및 전압 리플은 각각 500mA, 25mA, 24mV 이다.

• ETRI Journal
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• 제31권2호
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• pp.111-120
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• 2009

Network-on-chip (NoC) architecture provides a highper-formance communication infrastructure for system-on-chip designs. Circuit-switched networks guarantee transmission latency and throughput; hence, they are suitable for NoC architecture with real-time traffic. In this paper, we propose an efficient integrated scheme which automatically maps application tasks onto NoC tiles, establishes communication circuits, and allocates a proper bandwidth for each circuit. Simulation results show that the average waiting times of packets in a switch in $6{\times}6$6, $8{\times}8$, and $10{\times}10$ mesh NoC networks are 0.59, 0.62, and 0.61, respectively. The latency of circuits is significantly decreased. Furthermore, the buffer of a switch in NoC only needs to accommodate the data of one time slot. The cost of the switch in the circuit-switched network can be reduced using our scheme. Our design provides an effective solution for a critical step in NoC design.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.55-60
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• 2001

RF MEMS is an exciting emerging technology that has great potential to develop TOC (Transceiver-on-Chip). Applications of the RF MEMS to wireless communications systems are presented. The ability of the RF MEMS technology to enhance the performance and to reduce the size of passive components, in particular, switches, inductors, and tunable capacitors, is addressed. A number of potential wireless system opportunities for the TOC are awaiting the maturation of the RF MEMS technology.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.484-487
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• 1997

The dicing is a process of gaining chip from a wafer. It is done by some mechanism to lengthwise and crosswise. Here, it is focused on measuring a depth of the wafer hefore a process of the dicing. First of all, it checks a precise outer position for the wafer on table to gain the chip. Second, the xafer should he lined after Imowing how much depth, it is in out of the outer position of the wafer. Here suggests that there are a composition of mechanical system, how to measure a depth out of scriber axis, a result from testing.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.349-352
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• 2001

As microprocessor and SOC (System On a Chip) performance moves into the GHz speed, the high-speed asynchronous design is becoming challenge due to the disadvantageous power and speed aspects in synchronous designs. The next generation on-chip systems will consist of multiple independently synchronous modules and asynchronous modules for higher performance, so the interface module for data transfer between multiple clocked IPs is designed with Xilinx FPGA and simulated with RISC microprocessor.

• Journal of information and communication convergence engineering
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• 제8권5호
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• pp.534-538
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• 2010

Efficient control of a marine engine requires an engine control unit (ECU) system that handles fast and precise signal processes for in-coming and out-going signals from fast running engines. In order to handle these roles, the sequential control has been adapted in the ECU system in small and medium size ship engines, which has caused high production cost and complexity of the system. Hence, this paper is focused on developing an distributed ECU system for high speed and high precision control of a marine engine by efficiently combining a CPLD chip and a microprocessor. By sharing load at the MCU with the designed CPLD chip, we could achieve in driving a marine engine with high speed and precise control so that the ECU board has been simplified and its production cost has been reduced.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2003년도 학술대회논문집
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• pp.243-249
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• 2003

With distribution industrial control system, the use of tow cost to achieve a highly reliable and safe system in real time distributed embedded application is proposed. This developed intelligent node is based on two microcontrollers, one for the execution of the application code, also as master controller for ensuring the real time control & the logic operation with PLD and other for communication task and the easy control execution, i.e., I/O digital input, digital output and interrupting. This paper also presents where the case NCS(Networked control system) with LonTalk protocol is applied for the filtration process control system of a small water treatment plant.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.404-409
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• 2004

We fabricated photo-sensor for fluorescence detection in LOC. LOC is high throughput screening system. Our LOC screens biochemical reaction of protein using the immunoassay, and converts biochemical reaction into electrical signal using LIF(Laser Induced Fluorescence) detection method. Protein is labeled with rhodamine intercalating dye and finger PIN photodiode is used as photo-sensor We measured fluorescence emission of rhodamine dye and analyzed tendency of fluorescence detection, according to photo-sensor size, light intensity, and rhodamine concentration. Detection current was almost linearly proportional to two parameters, intensity and concentration, and was inversely proportional to photo-sensor size. Integrated LOC consists of optical-filter deposited photo-sensor and PDMS microchannel detected 50 (pg/${mu}ell$) rhodamine. For integrated LOC including light source, we used green LED as the light source and measured emitted fluorescence.