• ETRI Journal
• /
• v.34 no.1
• /
• pp.44-54
• /
• 2012

Because of the intrinsic lack of internal-system observability and controllability in highly integrated multicore processors, very restricted access is allowed for the debugging of erroneous chip behavior. Therefore, the building of an efficient debug function is an important consideration in the design of multicore processors. In this paper, we propose a flexible on-chip debug architecture that embeds a special logic supporting the debug functionality in the multicore processor. It is designed to support run-stop-type debug functions that can halt and control the execution of the multicore processor at breakpoint events and inspect the possible causes of any errors. The debug architecture consists of the following three functional components: the core debug support block, the multicore debug support block, and the debug interface and control block. By embedding this debug infrastructure, the embedded processor cores within the multicore processor can be debugged simultaneously as well as independently. The debug control is performed by employing a JTAG-based scanning operation. We apply this on-chip debug architecture to build a debugger for a prototype multicore processor and demonstrate the validity and scalability of our approach.

• ETRI Journal
• /
• v.40 no.6
• /
• pp.759-773
• /
• 2018

Uncore components such as on-chip memory systems and on-chip interconnects consume a large amount of energy in emerging embedded applications. Few studies have focused on next-generation analytical models for future chip-multiprocessors (CMPs) that simultaneously consider the impacts of the power consumption of core and uncore components. In this paper, we propose a convex-optimization approach to design heterogeneous uncore architectures for embedded CMPs. Our convex approach optimizes the number and placement of memory banks with different technologies on the memory layer. In parallel with hybrid memory architecting, optimizing the number and placement of through silicon vias as a viable solution in building three-dimensional (3D) CMPs is another important target of the proposed approach. Experimental results show that the proposed method outperforms 3D CMP designs with hybrid and traditional memory architectures in terms of both energy delay products (EDPs) and performance parameters. The proposed method improves the EDPs by an average of about 43% compared with SRAM design. In addition, it improves the throughput by about 7% compared with dynamic RAM (DRAM) design.

• The KIPS Transactions:PartA
• /
• v.13A no.7 s.104
• /
• pp.589-598
• /
• 2006

In this paper, we describe the development and optimization of an embedded Biuetooth solution on an SoC platform for real-time audio streaming over a Bluetooth wireless link. The solution includes embedded Bluetooth protocol stack and profile simplemented on a virtual operating system for portability, and other optimization techniques to fully exploit the benefits of multimedia-oriented SoC. The optimization techniques implemented in this paper are memory access minimization by using on-chip scratch pad memory, codec library optimization with DSP and parallel memory access instruction set, and dynamic audio quality adjustment regarding current wireless link status. Experimental results show that the optimized solution presented in this paper can support high-qualify audio streaming without the support of external memory.

• ETRI Journal
• /
• v.31 no.6
• /
• pp.732-740
• /
• 2009

This paper describes the implementation of a digital audio effect system-on-a-chip (SoC), which integrates an embedded digital signal processor (DSP) core, audio codec intellectual property, a number of peripheral blocks, and various audio effect algorithms. The audio effect SoC is developed using a software and hardware co-design method. In the design of the SoC, the embedded DSP and some dedicated hardware blocks are developed as a hardware design, while the audio effect algorithms are realized using a software centric method. Most of the audio effect algorithms are implemented using a C code with primitive functions that run on the embedded DSP, while the equalization effect, which requires a large amount of computation, is implemented using a dedicated hardware block with high flexibility. For the optimized implementation of audio effects, we exploit the primitive functions of the embedded DSP compiler, which is a very efficient way to reduce the code size and computation. The audio effect SoC was fabricated using a 0.18 ${\mu}m$ CMOS process and evaluated successfully on a real-time test board.

• Journal of Sensor Science and Technology
• /
• v.15 no.2
• /
• pp.112-119
• /
• 2006

Resolution of an image sensor is very significant parameter to improve. It is hard to improve the resolution of the CMOS vision chip for edge detection based on a biological retina using a resistive network because the vision chip contains additional circuits such as a resistive network and some processing circuits comparing with general image sensors such as CMOS image sensor (CIS). In this paper, we proved the problem of low resolution by separating photo-sensing and signal processing circuits. This type of vision chips occurs a problem of low operation speed because the signal processing circuits should be commonly used in a row of the photo-sensors. The low speed problem of operation was proved by using a reset decoder. A vision chip for edge detection with $128{\times}128$ pixel array has been designed and fabricated by using $0.35{\mu}m$ 2-poly 4-metal CMOS technology. The fabricated chip was integrated with optical lens as a camera system and investigated with real image. By using this chip, we could achieved sufficient edge images for real application.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.4
• /
• pp.68-75
• /
• 2005

This paper presents a new method for the optimization of feed rate in sculptured surface machining. A NC verification model based on Z-map was utilized to obtain chip load according to feed per tooth. This optimization method can regenerate a new NC program with respect to the commanded cutting conditions and the NC program that was generated from CAM system. The regenerated NC program has not only the same data of the ex-NC program but also the updated feed rate in every block. The new NC data can reduce the cutting time and produce precision products with almost even chip load to the feed per tooth. This method can also reduce tool chipping and make constant tool wear.

• Speech Sciences
• /
• v.14 no.4
• /
• pp.157-167
• /
• 2007

In this paper, we implemented a single-chip speech recognizer using the TMS320C2000 DSPs. For this implementation, we had developed very small-sized speaker-dependent recognition engine based on dynamic time warping, which is especially suited for embedded systems where the system resources are severely limited. We carried out some optimizations including speed optimization by programming time-critical functions in assembly language, and code size optimization and effective memory allocation. For the TMS320F2801 DSP which has 12Kbyte SRAM and 32Kbyte flash ROM, the recognizer developed can recognize 10 commands. For the TMS320F2808 DSP which has 36Kbyte SRAM and 128Kbyte flash ROM, it has additional capability of outputting the speech sound corresponding to the recognition result. The speech sounds for response, which are captured when the user trains commands, are encoded using ADPCM and saved on flash ROM. The single-chip recognizer needs few parts except for a DSP itself and an OP amp for amplifying microphone output and anti-aliasing. Therefore, this recognizer may play a similar role to dedicated speech recognition chips.

• Proceedings of the KIEE Conference
• /
• 2003.11b
• /
• pp.271-274
• /
• 2003

This paper presents a Built-in Current Sensor that detect defects in CMOS integrated circuits using the current testing technique. This scheme employs a cross-coupled connected PMOS transistors, it is used as a current comparator. Our proposed scheme is a negligible impart on the performance of the circuit undo. test (CUT). In addition, in the normal mode of the CUT not dissipation extra power, high speed detection time and applicable deep submicron process. The validity and effectiveness are verified through the HSPICE simulation on circuits with defects. The entire area of the test chip is $116{\times}65{\mu}m^2$. The BICS occupies only $41{\times}17{\mu}m^2$ of area in the test chip. The area overhead of a BICS versus the entire chip is about 9.2%. The chip was fabricated with Hynix $0.35{\mu}m$ 2-poly 4-metal N-well CMOS technology.

• Nuclear Engineering and Technology
• /
• v.53 no.10
• /
• pp.3327-3334
• /
• 2021

Present electric grids are advanced to integrate smart grids, distributed resources, high-speed sensing and control, and other advanced metering technologies. Cybersecurity is one of the challenges of the smart grid and nuclear plant digital system. It affects the advanced metering infrastructure (AMI), for grid data communication and controls the information in real-time. The research article is emphasized solving the nuclear and smart grid hardware security issues with the integration of field programmable gate array (FPGA), and implementing the latest Time Authenticated Cryptographic Identity Transmission (TACIT) cryptographic algorithm in the chip. The cryptographic-based encryption and decryption approach can be used for a smart grid distribution system embedding with FPGA hardware. The chip design is carried in Xilinx ISE 14.7 and synthesized on Virtex-5 FPGA hardware. The state of the art of work is that the algorithm is implemented on FPGA hardware that provides the scalable design with different key sizes, and its integration enhances the grid hardware security and switching. It has been reported by similar state-of-the-art approaches, that the algorithm was limited in software, not implemented in a hardware chip. The main finding of the research work is that the design predicts the utilization of hardware parameters such as slices, LUTs, flip-flops, memory, input/output blocks, and timing information for Virtex-5 FPGA synthesis before the chip fabrication. The information is extracted for 8-bit to 128-bit key and grid data with initial parameters. TACIT security chip supports 400 MHz frequency for 128-bit key. The research work is an effort to provide the solution for the industries working towards embedded hardware security for the smart grid, power plants, and nuclear applications.

• Journal of Welding and Joining
• /
• v.30 no.6
• /
• pp.113-119
• /
• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.