• Title/Summary/Keyword: System semiconductor

Search Result 2,545, Processing Time 0.028 seconds

Design of Non-flammable Mixed Refrigerant Joule-Thomson Refrigerator for Semiconductor Etching Process (반도체 식각공정을 위한 비가연성 혼합냉매 줄톰슨 냉동기 설계)

  • Lee, Cheonkyu;Kim, Jin Man;Lee, Jung-Gil
    • Journal of the Semiconductor & Display Technology
    • /
    • v.21 no.2
    • /
    • pp.144-149
    • /
    • 2022
  • A cryogenic Mixed Refrigerant Joule-Thomson refrigeration cycle was designed to be applied to the semiconductor etching process with non-flammable constituents. 3-stage cascade refrigerator, single mixed refrigerant Joule-Thomson refrigerator, and 2-stage cascade type mixed refrigerant Joule-Thomson refrigerator are analyzed to figure out the coefficient of performance. Non-flammable mixture of argon(Ar), tetrafluoromethane(R14), trifluoromethane (R23) and octafluoropropane(R218) were utilized to analyze the refrigeration cycle efficiency. The designed refrigeration cycle was adapted to cool down the coolant of HFE7200(Ethoxy-nonafluorobutane, C4F9OC2H5) with certain constraints. Maximum coefficient of performance of the refrigeration system is obtained as 0.289 for the cooling temperature lower than -100℃. The detailed result of the coefficient of performance according to the mixture composition is discussed in this study.

Development of Monitoring System Using Residual Gas Analyzer (RGA) and Artificial Intelligence Modeling (잔류가스 분석기(RGA)와 인공지능 모델링을 이용한 모니터링 시스템 개발)

  • Ji Soo Lee;Song Hun Kim;Gyeong Su Kim;Hyo Jong Song;Sang-Hoon Park;Deuk-Hoon Goh;Bong-Jae Lee
    • Journal of the Semiconductor & Display Technology
    • /
    • v.23 no.2
    • /
    • pp.129-134
    • /
    • 2024
  • This study aims to talk about the necessity of solving the PFC gas emission problem raised by the recent development of the semiconductor industry and the remote plasma source method monitoring system used in the semiconductor industry. The 'monitoring system' means that the researchers applied machine learning to the existing monitoring technology and modeled it. In the process of this study, Residual Gas Analyzer monitoring technology and linear regression model were used. Through this model, the researchers identified emissions of at least 12700mg CO2 to 75800mg CO2 with values ranging from ion current 0.6A to 1.7A, and expect that the 'monitoring system' will contribute to the effective calculation of greenhouse gas emissions in the semiconductor industry in the future.

  • PDF

Thin-film passivation of the polymer EL device using parylene and its application to the passive matrix PELD system

  • Lee, Cheon-An;Jin, Sung-Hun;Jung, Keum-Dong;Lee, Jong-Duk;Park, Byung-Gook
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2004.08a
    • /
    • pp.669-672
    • /
    • 2004
  • The thin-film passivation technology using the poly-para-xylylene (parylene) was applied to polymer electroluminescent devices. The fabricated device shows a good luminescent characteristic of maximum 11640 cd/$m^2$. The measured lifetime was reached up to 28 hours, which means the effectiveness of the passivation. Applying the parylene thin-film passivation technique, 10${\times}$10 passive matrix display system was implemented and obtained some still images.

  • PDF

An Adaptive Dispatching Architecture for Constructing a Factory Operating System of Semiconductor Fabrication : Focused on Machines with Setup Times (반도체 Fab의 생산운영시스템 구축을 위한 상황적응형 디스패칭 방법론 : 공정전환시간이 있는 장비를 중심으로)

  • Jeong, Keun-Chae
    • IE interfaces
    • /
    • v.22 no.1
    • /
    • pp.73-84
    • /
    • 2009
  • In this paper, we propose a dispatching algorithm for constructing a Factory Operating System (FOS) which can operate semiconductor fabrication factories more efficiently and effectively. We first define ten dispatching criteria and propose two methods to apply the defined dispatching criteria sequentially and simultaneously (i.e. fixed dispatching architecture). However the fixed type methods cannot apply the criteria adaptively by considering changes in the semiconductor fabrication factories. To overcome this type of weakness, an adaptive dispatching architecture is proposed for applying the dispatching criteria dynamically based on the factory status. The status can be determined by combining evaluation results from the following three status criteria; target movement, workload balance, and utilization rate. Results from the shop floor in past few periods showed that the proposed methodology gives a good performance with respect to the productivity, workload balance, and machine utilization. We can expect that the proposed adaptive dispatching architecture will be used as a useful tool for operating semiconductor fabrication factories more efficiently and effectively.

Structural Analysis of a PCB Substrate System for Semiconductor (반도체용 PCB 기판시스템의 구조해석)

  • Rim, Kyung-Hwa;Yang, Xun;Yoon, Jong-Kuk;Kim, Young-Kyun;Iyu, Sun-Joong
    • Journal of the Semiconductor & Display Technology
    • /
    • v.10 no.4
    • /
    • pp.113-118
    • /
    • 2011
  • According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

Study on Design of high Efficient Cooling System for Low Temperature Furnace in Semiconductor Processing (반도체 공정용 저온 열처리로의 고효율 냉각시스템 설계에 관한 연구)

  • Jeoung, Du-Won;Suh, Ma-Son;Kim, Kwang-Sun
    • Journal of the Semiconductor & Display Technology
    • /
    • v.9 no.4
    • /
    • pp.71-76
    • /
    • 2010
  • According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).

Memristive Devices Based on RGO Nano-sheet Nanocomposites with an Embedded GQD Layer (저결함 그래핀 양자점 구조를 갖는 RGO 나노 복합체 기반의 저항성 메모리 특성)

  • Kim, Yongwoo;Hwang, Sung Won
    • Journal of the Semiconductor & Display Technology
    • /
    • v.20 no.1
    • /
    • pp.54-58
    • /
    • 2021
  • The RGO with controllable oxygen functional groups is a novel material as the active layer of resistive switching memory through a reduction process. We designed a nanoscale conductive channel induced by local oxygen ion diffusion in an Au / RGO+GQD / Al resistive switching memory structure. A strong electric field was locally generated around the Al metal channel generated in BIL, and the local formation of a direct conductive low-dimensional channel in the complex RGO graphene quantum dot region was confirmed. The resistive memory design of the complex RGO graphene quantum dot structure can be applied as an effective structure for charge transport, and it has been shown that the resistive switching mechanism based on the movement of oxygen and metal ions is a fundamental alternative to understanding and application of next-generation intelligent semiconductor systems.

Physical effect of annealing conditions on soluble organic semiconductor for organic thin film transistors

  • Kim, Dong-Woo;Kim, Doo-Hyun;Kim, Keon-Soo;Kim, Hyung-Jin;Lee, Dong-Hyuck;Hong, Mun-Pyo
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2008.10a
    • /
    • pp.268-269
    • /
    • 2008
  • We have examined the effect of physical drying and annealing conditions for the soluble derivatives of polythiophene as p-type channel materials of organic thin film transistors (OTFTs) in our special designed drying system; performances of the jetting-processed OTFTs can be improved more than 10 times just by optimizing the physical conditions of drying and annealing.

  • PDF

Design and Implementation of Multi-monitoring System for Motor Pump (모터 펌프를 위한 멀티-모니터링 시스템 설계 및 구현)

  • Kim, Tae Hyun;Yang, Oh
    • Journal of the Semiconductor & Display Technology
    • /
    • v.18 no.4
    • /
    • pp.81-86
    • /
    • 2019
  • According to the needs of many users, motor pumps have been steadily developed and widely used in many industries where fluids are used. Motor pumps are used in a variety of environments, degrading quality and performance. It is becoming important to monitor the condition of motor pumps in order to maintain system performance and increase efficiency. This paper presents the method for effectively monitoring the condition of motor pumps. The designed MMI controller receives the collected data through data logging and output and controls the motor pump with touch screen. Implementing a Wi-Fi monitoring system and SCADA monitoring system based on Ethernet and RS485, user can monitor even if the user is far from the MMI controller without time and space limitation. In addition, by implementing a voice output system, the user can immediately recognize the situation through the sound. Therefore, through the proposed method, multi-monitoring system solves the cause of breakdowns and degradation of motor-pump and gives the possibility of commercialization by providing the convenience of maintenance to users.

Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry

  • Kim, Koung-Suk;Kang, Ki-Soo;Jung, Seung-Tack
    • Journal of Mechanical Science and Technology
    • /
    • v.19 no.3
    • /
    • pp.820-825
    • /
    • 2005
  • This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.