• 한국지능정보시스템학회:학술대회논문집
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• 한국지능정보시스템학회 2001년도 The Pacific Aisan Confrence On Intelligent Systems 2001
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

• 한국경영과학회:학술대회논문집
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• 한국경영과학회 2001년도 추계학술대회 논문집
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• pp.11-14
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• 2001

A systematic construction and re-use of technology related to the product development and production has been the most important for the semiconductor industry dependent on process and equipment. Therefore, numerous outputs in the form of paper has been produced in the process of information management ranging from the creation to recycling and disposal of technologies. In this research, the technology and documents necessary for the business management in the field of semiconductor manufacturing were classified in an effort to solve problems while the modeling of document management architecture at the enterprise level was performed by properly setting up the security system to prevent the unauthorized disclosure of the product development technology to the third parties. Especially, the product and process specification are designed in such a way as to ensure a real-time response in interface with the production system in order to shorten the development lead-time and improve the productivity. This paper is to discuss the modeling approach, the strategy to construct the system and its results.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 전력전자학술대회 논문집
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• pp.589-592
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• 2002

The CCM (Continuous Conduction Mode) boost topology is generally used in the PFC (Power Factor Correction) regulator of household air-conditioning systems. There are three kinds of power devices-bridge rectifier diodes, FRDs (Fast Recovery Diodes), and IGBTs (or MOSFETs) - used In a boost PFC regulator. Selecting the appropriate device is very cumbersome work, specially, in the case of FRDs and IGBTs, because there are several considerations as described below: 1) High frequency leakage current regulation (conducted and radiated EMI regulation) 2) Power losses and thermal design 3) Device cost. It should be noted that there are trade-offs between the power loss characteristic of 2) and the other characteristics of 1) and 3). This paper presents a detailed evaluation by using several types of power devices, which can be unintentionally used, to show that optimal selection can be achieved. Based on the given thermal resistances, thermal analysis and design procedures are also described from a practical viewpoint.

• 반도체디스플레이기술학회지
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• 제5권4호
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• pp.35-40
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• 2006

This paper shows that the effect of exposing on the top area and a solution which using a water circulation system. Semiconductor substrate stage is made from Aluminum and is repeated the sequence of exposing (150), turning OFF shutter, taking 30 sec. interval at the top area of stage. So the temperature of substrate temperature rises continuously. On this, we made a waterway at the inner part of the substrate stage and operated a water circulation system. We measured the temperature of a substrate stage surface with a thermocouple attached to the substrate stage. To analyze the top area's temperature, we used Analysis Program ANSYS for analysis and 3D CAD program Solid-Works for modeling.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.89-94
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• 2011

In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.68-72
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• 2020

A new method for array testing of TFT-CD panel with the integrated gate driver circuits is presented. As larger size/high resolution TFT-LCD with the peripheral driver circuits has emerged, one of the important problems for manufacturing is array testing on the panel. This paper describes the technology of detecting defective arrays and optimizing the array testing process. For the effective characterization of pixel array, the pixel storage capability is simulated and measured with voltage imaging system. This technology permits full functional testing during the manufacturing process, enabling fabrication of large TFT-LCD panels with the integrated driver circuits.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.43-48
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• 2020

The demand for stable plasma has been on the rise because of the increased delivery power amount in the chamber for improving productivity, and fast and accurate plasma impedance matching become a crucial performance measure for radio frequency (RF) power system in semiconductor manufacturing equipment. In this paper, the overall impedance matching was understood, and voltage and current values were extracted with voltage - current (VI) probe to measure plasma impedance in real-time. Actual matching data were analyzed to derive calibration coefficient for V and I measurements to understand the characteristics of VI probe, and we demonstrated the tendency of RF impedance matching according to changes in load impedance. This preliminary empirical research can contribute to fast RF matching as well as advanced equipment control for the next level of detailed investigation on embedded system based-RF matching controller.

• 산업경영시스템학회지
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• 제37권4호
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• pp.126-133
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• 2014

This paper addresses order-lot pegging issues in the supply chain of a semiconductor business. In such a semiconductor business (memory or system LSI) order-lot pegging issues are critical to achieving the goal of ATP (Available to Promise) and on-time production and delivery. However existing pegging system and researches do not consider capacity limit on bottleneck steps. This paper presents an order-lot pegging algorithm for assigning a lot to an order considering quality constraints of each lot and capacity of bottleneck steps along the entire FAB. As a result, a quick and accurate response can be provided to customer order enquiries and pegged lot lists for each promised orders can be shown transparently and short or late orders can be detected before fixing the order.

• 한국안전학회지
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• 제24권4호
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• pp.11-16
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• 2009

This research investigates contact angle of Linear Guide Way through a experimental result and theoretical analysis. Since last ten years, most of researchers who concerned with the precision machinery and semiconductor device production etc. so the researches about Linear Guide Way have been unnoticed. The precision machinery and semiconductor device production system has the principle which transfers the mechanical moving to accuracy position control. The Linear Guide Way system has the principle which transfers mechanical moving to accuracy position control is very important to improve performance of the precision machinery and semiconductor device production system. So, In this research, in order to improvement for producing Linear Guide Way, bearing loading analysis and contact angle change through Linear Guide Way theoretical analysis and bearing modeling. Through this study, we may expect that there will be more improvement for producing Linear Guide Way.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1678-1679
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• 2007

This paper is the electric power system remote control of semiconductor plasma manufacturing equipment using PLC(power line communication). PLC is useful for economical data link but various problems and limitations are caused in using power lines for communications channel Develop of Semiconductor plasma manufactur ing equipment and remote automation technologies of tool develops day after day and standards. Also, Remote electric power control and device module control by GUIRCS(Graphic User Interface Remote Control System) of tool are monitoring in real time.