• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.127.4-127
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• 2001

Inspection and shape measurement of three-dimensional objects are widely needed in industries for quality monitoring and control. A number of visual or optical technologies have been successfully applied to measure three dimensional surfaces. Especially, the shape measurement using an interferometric principle becomes a successful methodology. However, those conventional interferometric methods to measure surface profile have an inherent shortcoming, namely 2∏ ambiguity problem. The problem inevitably happens when the object to be measured has discontinuous shape due to the repetition of interferometric signal with phase period of 2∏. Therefore, in this paper, we choose as a shape measuring method, ...

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.887-890
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• 1999

The etch characteristics of E-ICP and ICP are compared for the improvement of SiO$_2$ etch Process. Etch rate and etch pattern profile are measured by $\alpha$ -step surface profiler and SEM, respectively. The E-ICP provides improved characteristics on etch rate and surface profile in comparison to ICP process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.1
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• pp.47-52
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• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.869-870
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• 2011

• Journal of the Korean Society for Precision Engineering
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• v.33 no.2
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• pp.95-100
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• 2016

Various processes have been developed to improve the performance of the lubrication oil pump in a recent automobile industry. In particular, trochoidal profile has been widely used for the lubrication oil pump because it is easy to flow control and a lot of oil feed rate is obtained. Accuracy of the trochoidal profile as a core component of the lubricating oil pump affects the driving performance. So, it is necessary to develop efficient processing of the trochoidal profile. In this study, a machining process for the trochoidal profile is developed by turn-mill. Cutting force, surface roughness and tool wear were evaluated in accordance with machining conditions.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.5
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• pp.362-367
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• 2005

Ultrasonic backward radiation profile is frequency-dependent when the incident region has deptional gradient of acoustical properties or multi-layers. Until now, we have measured the profiles of principal frequencies of an used transducers so that it was not easy to characterize the frequency dependence of the SAW(surface acoustic wave) from the backward radiation profile. We tried to measure the spectral backward radiation profiles using DFP(digital filer package) in a Lecroy DSO(digital storage oscilloscope). The measured spectral profiles showed that the steel specimen of #1200 surface treatment have 2% SAW velocity dispersion of the loaded case and the severly rusty steel specimen have the very big changes in the shape and pattern of the spectral profile. It is concluded that the spectral backward radiation profiles could be very effective tool to evaluate the frequency dependence of surface area.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

• Journal of the korean Society of Automotive Engineers
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• v.2 no.1
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• pp.21-31
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• 1980

Two phase boundary layer equations of laminar filmwise condensation are solved by an approximate integral method under the following condition; saturated vapour flows vertically downward over a cooled surface of uniform temperature, the condensate film is so thin that the inertia and convection terms are neglected. The following conclusions are drawn under the above assumptions. 1. free convection In case of the linear temperature profile in a liquid film, numerical results for the average coefficients of heat transfer may be expressed as N $u_{m}$=4/3,(G $r_{l}$ /4.H)$^{1}$4/ and in case of the quadratic profile, numerical results may be expressed as N $u_{m}$=2/1.682,(G $r_{l}$ /H)$^{1}$4/. 2. Forced convection When the temperature profile is assumed to be linear in a liquid film, numerical results fir the average heat transfer coefficients may be expressed as N $u_{m}$=(A, R $e_{l}$ /H)$^{1}$2/. This expression is compared with the experimental results hitherto reported; For theoretical Nusselt number (N $u_{m}$)$_{th}$<2*10$^{4}$, the experimental Nusselt number (N $u_{m}$)$_{exp}$ is on the average larger than theoretical Nusselt number (N $u_{m}$)$_{th}$ by 30%. For (N $u_{m}$)$_{th}$>2*10$^{4}$, experimental Nusselt number (N $u_{m}$)$_{exp}$ is about 1.6 times as large as theoretical Nusselt number (N $u_{m}$)$_{th}$. These large deviation may be caused by the presence of turbulence in the liquid film. In case of the quadratic temperature profile in a liquid film, numerical results for the average coefficients of heat transfer may be expressed as N $u_{m}$'=(2,A,Re/H)$^{1}$2/. This formular shows that theoretical Nusselt number (N $u_{m}$)$_{th}$ is larger than experimental Nusselt number (N $u_{m}$)$_{exp}$ by 60%. It is speculated that when the temperature difference between cooled surface and saturated vapour is small, temperature profile in a liquid film is quadratic.quadratic.. quadratic.quadratic..atic..

• Design & Manufacturing
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• v.17 no.4
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• pp.63-71
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• 2023

In order to increase the extrusion production speed of aluminum, extrusion die cooling technology using liquid nitrogen has recently attracted a lot of attention. Increasing the extrusion speed increases the temperature of the bearing area of extrusion dies and the extrusion profile, which may cause defects on the surface of extruded profile. Extrusion die cooling technology is to directly inject liquid nitrogen through a cooling channel formed between the die and the backer inside the die-set. The liquid nitrogen removes heat from the die-set, and gaseous nitrogen at the exit of the channel, covers the extrusion profile of an inert atmosphere reducing the oxidation and the profile temperature. The aim of this study is to evaluate the cooling capacity by applying die cooling to extrusion of Al-Mn-based aluminum alloy flat tubes, and to investigate the effects of die cooling on the change in extrusion characteristics of flat tubes. Cooling capacity was confirmed by observing the temperature change of the extrusion profile depending on whether or not die cooling is applied. To observe changes in material characteristics due to die cooling, surface observation is conducted and microstructure and precipitate analysis are performed by FE-SEM on the surface and longitudinal cross section of the extruded flat tubes.

• Korean Journal of Materials Research
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• v.33 no.2
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• pp.54-62
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• 2023

The most comprehensive and particularly reliable method for non-destructively measuring the residual stress of the surface layer of metals is the sin²ψ method. When X-rays were used the relationship of ε_φψ-sin²ψ measured on the surface layer of the processing metal did not show linearity when the sin²ψ method was used. In this case, since the effective penetration depth changes according to the changing direction of the incident X-ray, σ_φ becomes a sin²ψ function. Since σ_φ cannot be used as a constant, the relationship in ε_φψ-sin²ψ cannot be linear. Therefore, in this paper, the orthogonal function method according to Warren's diffraction theory and the basic profile of normal distribution were synthesized, and the X-ray diffraction profile was calculated and reviewed when there was a linear strain (stress) gradient on the surface. When there is a strain gradient, the X-ray diffraction profile becomes asymmetric, and as a result, the peak position, the position of half-maximum, and the centroid position show different values. The difference between the peak position and the centroid position appeared more clearly as the strain (stress) gradient became larger, and the basic profile width was smaller. The weighted average strain enables stress analysis when there is a strain (stress) gradient, based on the strain value corresponding to the centroid position of the diffracted X-rays. At the 1/5 I_max max height of X-ray diffraction, the position where the diffracted X-ray is divided into two by drawing a straight line parallel to the background, corresponds approximately to the centroid position.