• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1816-1821
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• 2003

The sapphire wafer for blue light emitting device was manufactured by the implementation of the chemical and mechanical polishing process. The surface polishing of crystalline sapphire wafer was characterized by zeta potential measurement. The reduction process with the alkali slurry provides the surface chemical reaction with sapphire atoms. The poly-urethane pad also provides the frictional force to take out the chemically-reacted surface layers. The surface roughness was measured by the atomic force microscope and the crystalline quality was characterized by the double crystal X -ray diffraction analysis.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.282-285
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• 2009

Selective laser sintering (SLS) is a fast growing process of rapid production fur metallic based parts. To restore damaged mold surface using SLS, single layer experiments of $20{\mu}m$ Fe-Cr powder was performed under various heat input. Process window of $20{\mu}m$ Fe-Cr powder provided feasible process parameters for the smooth regular surface. To estimate coherence between melted powder and basematal, tendency of hardness distribution has been observed. Hardness of melted zone and remelted zone was diversified from 5GPa to 6.5GPa. It is over 2 times compared of hardness of basemetal. Average surface roughness of each direction on surface of melted powder was measured. Experimental results show that the mold restoring process using SLS can be successfully applied in the mold repair industry.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.2257-2259
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• 2000

This paper reports on the design, fabrication and driving experiment of micro mirror array(MMA) for lithography process to apply to biochip fabrication Photolithography technology is applied to activate specific area on the surface of modified glass surface, DNA monomers are bound on the activated area of the glass surface. After repeat of DNA monomer synthesizing process, DNA single strand probes could be solid-synthesized on the glass substrate. Without using photomask, photolithography process is tried using micro mirror array(MMA). Photomask or mask alignment is not required in maskless photolithography process using micro mirror array.

• 한국기계가공학회지
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• 제21권2호
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• pp.23-30
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• 2022

After drilling, reaming is required to process a workpiece for obtaining an excellent surface quality. In general, a cermet is defined as a "composite of a ceramic hard phase and metal-bonded phase." Cermets have excellent abrasion resistance, thermal resistance, and performance in finishing operations that require surface roughness and processing precision. However, although cermets have significant advantages, research on them is insufficient. In this study, workpiece SM45C was machined using drills and cermet reamers. The cermet reamer was processed for drag finishing for 0, 4, and 6 min. The experimental results showed the effects of drag finishing on surface roughness and dimensional accuracy.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.215-216
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• 2011

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.281-284
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• 2009

Flexible forming process for sheet metal using reconfigurable die is introduced based on numerical simulation. Numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. Elastic cushion which has high resilience behavior from excessive deformation are inserted between forming punches and blank material for smoothing the forming surface which has discrete due to characteristics of the flexile die. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation. Formability in view of surface defect such as onset of dimple is compared with regard to various punch sizes. Consequently, it is confirmed that the flexible forming process for sheet material has appropriate capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming process.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.532-537
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• 2007

Nano imprint lithography(NIL) is a cost-efficient, high-throughput processing technique to transfer nano-scale patterns onto thin polymer films. Polymers used as the resist include UV cured resins as well as thermoplastics such as polymethyl-methacrylate(PMMA). In this study, an analytic investigation was performed for the NIL process of transferring nano scale patterns onto polymeric films. Process optimization calls for a thorough understanding of resist flow during the process. We carried out 2D and 3D numerical analyses of resist flow during NIL process. The simulation incorporated continuum-hypothesis and the effects of surface tension were taken into account. For a more effective prediction of free surface, fixed grid scheme with the volume of fluid (VOF) method were used. The simulation results were verified with experimental results qualitatively. And the parametric study was performed for various process conditions.

• 한국기계가공학회지
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• 제11권1호
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.836-840
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• 2006

Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.

• 한국정밀공학회지
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• 제10권2호
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• pp.66-75
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• 1993

This paper proposes a monitoring method for nondestructive and in-process measurement of the case depth in LASER surface heat treatment process. The method is essentially an eddy-current method, and measures sensing coil's electrical impedance which varies with the changes of the material microstructure due to hardening. To investigate te validity of the proposed method a series of experiments were performed for various hardning depths. The results show that the relationship between the eddy- current sensor output and the changes in case depth is almost linear. This indicates that the eddy-current measuring method can be used as one of the possible monitoring method for mesauring the hardened depth in LASER heat treatment processes.