• Title/Summary/Keyword: Surface mounted device

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Ultra Precision Machining of Injection Mold Core for Asymmetric Aspheric Lens using 6:4 Brass (비대칭비구면 렌즈 사출 코어용 6:4 황동 초정밀 형상 가공)

  • Lee, Dong-Kil;Gu, Hal-Bon;Kim, Jeong-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.427-427
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    • 2007
  • The global applications of aspherics surfaces will expand rapidly on the electronics, optical components, communications, aerospace, defense, and medical optics devices etc. Especially, Asymmetric aspheric prism lens is one of the important parts in HMD(Head Mounted Display) because it affects dominantly on the optical performance of HMD. The mold core is the most important device to produce the plastic lenses by injection molding method. In this study, the mold cores for asymmetric aspheric prism lens were processed using fly-cutting method which is kind of the ultra precision processing and form accuracy and surface roughness of the cores were measured.

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Super Thin 0.25 mm Thickness White LED Lamp with PCB Type Lead Frame (0.25 mm 초박형 두께를 가지는 회로기판형 리드프레임 백색 LED 램프)

  • Yu, Soon-Jae;Kim, Do-Hyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.1
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    • pp.34-37
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    • 2010
  • 0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1\;^{\circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.

Development of a Submicron Order Straightness Measuring Device (서브미크론 진직도 측정장치 개발)

  • 박천홍;정재훈;김수태;이후상
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.5
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    • pp.124-130
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    • 2000
  • For measuring out the submicron order straightness, a precision measuring device is developed in this paper. The device is constructed with a hydrostatic feed table and a capacitive type sensor which is mounted to the feed table. Straightness is acquired as substracting the motion error of feed table from the measured profile with probe. Motion error of feed table is simultaneously compensated upto 0.120${\mu}{\textrm}{m}$ of linear motion error and 0.20arcsec of angular motion error using the active controlled capillary. Reversal method and strai호t-edge is used fur estimating the measuring accuracy and from the experimental result, it is verified that the device has the measuring accuracy 0.030m. Also, through the practical application on the measurement of ground surface, it is confirmed that the device is very effective to measure the submicron order straightness.

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A study on the inspection algorithm of FIC device in chip mounter (칩 마운터에의 FIC 부품 인식에 관한 연구)

  • Lyou, Kyoung;Moon, Yun-Shik;Kim, Kyoung-Min;Park, Gwi-Tae
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.3
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    • pp.384-391
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    • 1998
  • When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

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Development of Optical Leveling System using Quarter Photodetector (4분할 위치검출소자를 활용한 광학식 레벨링 개발)

  • Kim, Byoung-Chang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.6
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    • pp.111-116
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    • 2018
  • Recently, shape manufacturing method has been changed to a 3D printer. Since lamination type manufacturing method is the basis for forming a three-dimensional shape by repeated lamination, the horizontal accuracy of the lamination layer is very important. In the current paper, we have proposed a new leveling system to be installed in a large 3D printer. The light source was reflected from the water surface contained in the measuring device, and the inclination of the measuring device was measured from the light that entered into four regions of a quarter photodetector. The electrical signals generated differently according to the position of the beam spot incident on the quarter photodetector was acquired and compensated to be horizontal by using a motor mounted at the corner. Compared to a digital leveler, the newly developed leveling system gave errors of only 2 to 3%. This new device can be applied to various fields including the 3D printer in future.

Effects on PCB Transmission Characteristics by SMD Pad Alignment (SMD의 패드 정렬이 PCB 전송 특성에 미치는 영향)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.874-877
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    • 2018
  • Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.

The Mobile Robot Localizaion Using a Single Sonalr and Cylindrical Beacon (초음파 센서와 실린더형 등대를 이용한 이동 로봇의 위치 추정)

  • 범희락;조형석
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1993.10a
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    • pp.570-574
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    • 1993
  • This paper proposes a new method of estimating the position and heading angle of a mobile robot moving on a flat surface. The proposed localization method utilizes two passive beacons and a single rotating ultrasonic sensor. The passive beacons consist of two cylinders with different diameters and reflect the ultrasonic pulses coming from the sonar sensor mounted on the mobile robot. The geometric parameter set of beacon is acquired from the sonar scan data obtained at a single mobile robot location using a new data processing algorithm. Form this parameter set, the position and heading angle of the mobile robot is determined directly. The performance and validity of the proposed method are evaluated using two beacons and a single sonar sensor attached at the pan-tilt device mounted on a mobile robot, named LCAR, in our laboratory.

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A study on the real time inspection algorithm of FIC device in chip mounter (칩 마운터에의 FIC 부품 인식을 위한 실시간 처리 알고리듬에 관한 연구)

  • Ryu, Gyung;Kim, Young-Gi;Moon, Yoon-Sik;Park, Gui-Tae;Kim, Gyung-Min
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.48-51
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    • 1997
  • This paper presents the algorithm of FIC inspection in chip mounter. When device is mounted on the PCB, it is impossible to get zero defects since there are many problems which can not be predicted. Of these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). In this paper, we proposed a new algorithm based on the Radon transform which uses a projection to inspect the FIC(Flat Integrated Circuit) device and compared this method with other algorithms. We measured the position error and applied this algorithm to our image processing board which is characterized by line scan camera. We compared speed and accuracy in our board.

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Prediction of Wave Energy Absorption Efficiency and Wave Loads of a Three-Dimensional Bottom-Mounted OWC Wave Power Device (착저식 OWC 파력발전장치의 파에너지 흡수효율 및 파랑하중 계산)

  • Hong, Do-Chun;Hong, Key-Yong
    • Journal of the Korean Society for Marine Environment & Energy
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    • v.13 no.1
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    • pp.47-52
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    • 2010
  • The wave energy absorption efficiency and the first-order and the time-mean second-order wave loads of a three-dimensional bottom-mounted oscillating water column (OWC) chamber structure are studied. The potential problem is solved by making use of a hybrid Green integral equation associated with the finite-waterdepth free-surface Green function outside a twin chamber and the Rankine Green function inside taking account of the fluctuating air pressure inside the chamber. Numerical results of the primary wave energy converting efficiency and the oscillating and steady wave loads of a three-dimensional bottom-mounted OWC pilot plant have been presented.

Common Mode Filter Embedded in Flexible Printed Circuit Board for Multi-Function Cable (다기능 케이블을 위한 연성 회로 기판에 내장된 공통 모드 필터)

  • Byun, Jin-Do;Jung, Sang-Woon;Lee, Keun-Hyung;Lee, Hai-Young
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.3
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    • pp.343-351
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    • 2008
  • In this paper, a spiral shaped common mode filter(CMF) embedded in a flexible printed circuit board(FPCB) is proposed for a multi-function cable. The CMF embedded in a FPC cable presents a new concept as a multi-function cable by the common mode rejection characteristics without a surface mounted device(SMD) CMF. The embedded CMF has a wideband common mode rejection bandwidth and an enhanced differential mode characteristics compared to conventional CMFs that use a magnetic material such as a ferrite of high loss. The proposed CMF of 3 turn inductors has a common mode rejection bandwidth from 0.4 GHz to 3.12 GHz and has 1.95 dB at 3 GHz, 6.97 dB at 8 GHz improvements of a differential mode insertion loss compared to the commercial LTCC(Low Temperature Co-fire Ceramics) CMFs.