• Korean Journal of Materials Research
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• v.17 no.8
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• pp.437-441
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• 2007

Preparation and morphology control of $TiO_2$ nano powders for gas sensor applications are investigated. $TiO_2$ nanopowders with rutile and anatase structures were prepared by controlling the pH value of a precursor solution without any heat treatment. The mean particle size of $TiO_2$ powders were below 10nm. The prepared $TiO_2$ nano powders were hydrothermal treated by NaOH solution. The sample was washed in HCl solution. As a result and $TiO_2$ nanotubes were formed. The lengths of $TiO_2$ nanotube were $1{\mu}m$ and the diameters were 10nm. Crystal structure and microstructure of $TiO_2$ nanotube were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscope (TEM). As-prepared $TiO_2$ nanotube powders have several advantages of nano particle size and high surface area and could be a prominent candidate for nano-sensors. The sensitivity of $TiO_2$ nanotube sensor was measured for toluene and NO in this study.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.96-104
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• 1997

The present study was aimed to correlate the microstructure and the hardness as well as the wear resistance of the metal-ceramic particulated composite layer on the pure Al plate. The composite layers were constructed by the addition of TiC particles on the surface of Al-Cu alloyed layers by PTA overlaying process. Initially, the Al-Cu alloyed layers were achieved by the deposition of Al-(25 ~ 48%) Cu alloys on the pure Al plate by TIG process. It was revealed that TiC particles were uniformly dispersed without any reaction with matrix in the composite layer. The volume fraction of TiC particles (TiC V F) increased from 12% to 55% with increasing the number of pass of composite layer. Hardnesses of (Al-48%Cu + TiC (3&4layers)) composite layer were Hv450 and Hv560, respectively, due to the increase of TiC V/F. Hardnesses of (Al-Cu + TiC) composite layers decreased gradually with insreasing temperature from 100$^{\circ}$C to 400$^{\circ}$C, and hardnesses at 400$^{\circ}$C were then reached to 1/5 - 1/10 of room temperature hardness depending on the construction of composite layers. The Specific wear of (Al + Tic) layer and Al-48%Cu alloyed layer decreased to 1/10 of the of pure Al, while the specific wear of (Al-48%Cu + TiC (4 layers)) composite layer exhibited 1/15 of that of steel such as SS400 and STS304.

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.11a
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• pp.19-19
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• 2002

Perovskite-type titanate dielectrics have attracted much attention in memory devices such as DRAMs or FeRAMs due to their high dielectric constants. However, low volatility of the Ba, Sr, Pb or Zr precursors with only thd ligands has limitations in obtaining high quality thin films by liquid source metal organic chemical vapor deposition (LS-MOCVD) processes. To improve the volatility of these precursors, many attempts have been made such as adding polyether ligands to satisfy the coordinative saturation. We report the synthesis of new precursors Ba(thd)₂(tmeea) and Sr(thd)₂(tmeea), where tmeea = tris[2-(2-methoxyethoxy)ethyl]amino, and LS-MOCVD of barium strontium titanate (BSTO) thin films using these precursors. Due to increased basicity of amines compared with ethers, it is expected that the nitrogen-donor ligand will make a strong bond to a metal than an analogous oxygen-donor ligand, consequently improving the volatility and thermal behavior of these precursors. Thin films of BSTO were grown on Pt(111)/SiO₂/Si(100) substrates by LS-MOCVD using a cocktail source consisting of the conventional Ti precursor Ti(thd)₂(O/sup i/Pr), and these new Ba and Sr precursors. As-grown films were characterized by XPS, SEM, XRD, XRF, and C-V and I-V measurements. BSTO films grown at 420℃ were stoichiometric barium strontium titanate with very smooth surface morphology and their dielectric constants were found to be as targe as 450. Dependence of the composition, microstructure and the electrical properties of the BSTO films on the growth temperature, annealing temperature, working pressure, and the composition of the cocktail source will be discussed.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.73-80
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• 2007

For the sub-65 nm CMOS process, it is necessary to develop a new silicide material and an accompanying process that allows the silicide to maintain a low sheet resistance and to have an enhanced thermal stability, thus providing for a wider process window. In this study, we have evaluated the property and unit process compatibility of newly proposed composite silicides. We fabricated composite silicide layers on single crystal silicon from $10nm-Ni_{1-x}Co_x/single-crystalline-Si(100),\;10nm-Ni_{1-x}Co_x/poly-crystalline-\;Si(100)$ wafers (x=0.2, 0.5, and 0.8) with the purpose of mimicking the silicides on source and drain actives and gates. Both the film structures were prepared by thermal evaporation and silicidized by rapid thermal annealing (RTA) from $700^{\circ}C\;to\;1100^{\circ}C$ for 40 seconds. The sheet resistance, cross-sectional microstructure, surface composition, were investigated using a four-point probe, a field emission scanning probe microscope, a field ion beam, an X-ray diffractometer, and an Auger electron depth profi1ing spectroscopy, respectively. Finally, our newly proposed composite silicides had a stable resistance up to $1100^{\circ}C$ and maintained it below $20{\Omega}/Sg$., while the conventional NiSi was limited to $700^{\circ}C$. All our results imply that the composite silicide made from NiCo alloy films may be a possible candidate for 65 nm-CMOS devices.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.151-155
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• 2009

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.18-23
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• 2013

In this study, the effects of cryogenic treatment cycles on the residual stress and mechanical properties of 7075 aluminum alloy (Al7075) samples, in the form of a tube-shaped product with a diameter of 500 nm, were investigated. Samples were first subjected to solution treatment at $470^{\circ}C$, followed by cryogenic treatment and aging treatment. The residual stress and mechanical properties of the samples were systematically characterized. Residual stress was measured with a cutting method using strain gauges attached on the surface of the samples; in addition, tensile strength and Vickers hardness tests were performed. The detailed microstructure of the samples was investigated by transmission electron microscopy. Results showed that samples with 85 % relief in residual stress and 8% increase in tensile strength were achieved after undergoing three cycles of cryogenic treatments; this is in contrast to the samples processed by conventional solution treatment and natural aging (T4). The major reasons for the smaller residual stress and relatively high tensile strength for the samples fabricated by cryogenic treatment are the formation of very small-sized precipitates and the relaxation of residual stress during the low temperature process in uphill quenching. In addition, samples subjected to three cycles of cryogenic treatment demonstrated much lower residual stress than, and similar tensile strength compared to, those samples subjected to one cycle of cryogenic treatment or artificial aging treatment.

• Journal of the Korean Magnetics Society
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• v.19 no.4
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• pp.138-141
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• 2009

We studied the effects of Saccharin on the properties of electroplated Ni-Fe Permalloy thin films. When 0 to 1 ${\mu}mol/L$ of Saccharin was added to the plating electrolyte, the grain sizes of the deposits are found to decrease, which reduces the surface roughness and the coercivity and increases the permeability and magnetoimpedance. The reduction in the grain sizes is strongly correlated with increases in the incremental permeability and the magnetoimpedance. We demonstrated that Saccharine is a useful additive for the electrodeposition of soft Permalloy thin films and that the softness can be adjusted by varying the concentration of Saccharin.

• Journal of Welding and Joining
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• v.27 no.4
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.

• Journal of Welding and Joining
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• v.32 no.2
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• pp.48-53
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• 2014

This study was carried out to investigate the effect of postweld heat treatment(PWHT, 930, 1080, $1230^{\circ}C$) on the microstructure, phase formation, pitting corrosion and mechanical properties such as hardness, tensile strength and impact values of super duplex stainless steel(UNS S32750) multipass welds. Based on the microstructural examination and X-ray diffraction analysis, it was found that the ${\sigma}$ phase was formed in the welds heat treated at $930^{\circ}C$ in which the ferrite content greatly decreased into 5~10% in the welds. The secondary austenite was formed in the reheated zone of welds and redissolved into ferrite with increasing heat treatment temperatures. The tensile strength and impact values of welds heat treated at $930^{\circ}C$ were the lowest and revealed the brittle fracture surface. The weight loss by pitting corrosion increased with test temperatures. It was confirmed that pitting corrosion occurred mainly in secondary austenite of reheated zones. The postweld heat treatment temperature is recommended to be in the range of $1050{\sim}1150^{\circ}C$.

• Food Science of Animal Resources
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• v.34 no.3
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• pp.307-315
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• 2014

pH adjustment would be of advantage in improving the water holding capacity of muscle proteins. The objective of this study was to evaluate the addition of fish sarcoplasmic protein (SP) solution, which was adjusted to pH 3.0 or 12.0, neutralized to pH 7.0, and lyophilized to obtain the acid- and alkaline-treated SP samples, on the functional properties of the chicken myofibrillar protein induced by microbial transglutaminase (MTG). The solubility of alkaline-treated SP was higher than that of the acid counterpart; however, those values of the two pH-treated samples were lower than that of normal SP (p<0.05). All SP solutions were mixed with myofibrillar proteins (MP) extracted from chicken breast, and incubated with MTG. The shear stresses of MP with acid- and alkaline-treated SP were higher than that of normal SP. The thermal stability of MP mixture reduced upon adding SP, regardless of the pH treatment. The breaking force of MP gels with acid-treated SP increased more than those of alkaline-treated SP, while normal SP showed the highest value. The MP gel lightness increased, but cooking loss reduced, with the addition of SP. Smooth microstructure of the gel surface was observed. These results indicated that adjusting the pH of SP improved the water holding capacity of chicken myofibrillar proteins induced by MTG.