• Journal of Cancer Prevention
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• v.23 no.4
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• pp.153-161
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• 2018

Imbalance of protein homeostasis (proteostasis) is known to cause cellular malfunction, cell death, and diseases. Elaborate regulation of protein synthesis and degradation is one of the important processes in maintaining normal cellular functions. Protein degradation pathways in eukaryotes are largely divided into proteasome-mediated degradation and lysosome-mediated degradation. Proteasome is a multisubunit complex that selectively degrades 80% to 90% of cellular proteins. Proteasome-mediated degradation can be divided into 26S proteasome (20S proteasome + 19S regulatory particle) and free 20S proteasome degradation. In 1980, it was discovered that during ubiquitination process, wherein ubiquitin binds to a substrate protein in an ATP-dependent manner, ubiquitin acts as a degrading signal to degrade the substrate protein via proteasome. Conversely, 20S proteasome degrades the substrate protein without using ATP or ubiquitin because it recognizes the oxidized and structurally modified hydrophobic patch of the substrate protein. To date, most studies have focused on protein degradation via 26S proteasome. This review describes the 26S/20S proteasomal pathway of protein degradation and discusses the potential of proteasome as therapeutic targets for cancer treatment as well as against diseases caused by abnormalities in the proteolytic system.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1393-1398
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• 2009

We once have announced that we developed a horizontal large-area alignment system with an alignment accuracy of < ${\pm}3{\mu}m$ and an alignment time of < 30 seconds, a core process module for RGB direct pattering by using a fine metal mask, which can process a Gen 4 ($730{\times}920mm^2$) substrate for high resolution OLED products. In this article, we presents a brand-new vertical alignment system for a even larger substrate of Gen 5 and beyond which can provide a better alignment accuracy and a higher throughput. The newly developed system exhibits an alignment accuracy of < ${\pm}2{\mu}m$ and an alignment time of < 20 seconds which, we believe, can open a new era for manufacturing large-size OLED monitors and TVs.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.87-90
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• 2007

VIATRON TECHNOLOGIES has developed an $\underline{A}$tmospheric $\underline{M}$etal $\underline{D}$oping (AMD) system which uniformly dopes metal species onto a substrate. The AMD system injects metal-organic vapor over substrate using an injection head with a scan motion. One of important application of this system is a metalinduced crystallization of amorphous Si for manufacturing AMOLED poly-Si panels. The AMD system with a use of Ni vapor source produces doping of trace amount of Ni onto amorphous Si, enabling uniform MIC crystallization. Also, the operation without vacuum condition offers advantages such as easy maintenance, low cost production, and large glass processes.

• Molecules and Cells
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• v.40 no.7
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• pp.441-449
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• 2017

Proteolysis in eukaryotic cells is mainly mediated by the ubiquitin (Ub)-proteasome system (UPS) and the autophagy-lysosome system (hereafter autophagy). The UPS is a selective proteolytic system in which substrates are recognized and tagged with ubiquitin for processive degradation by the proteasome. Autophagy is a bulk degradative system that uses lysosomal hydrolases to degrade proteins as well as various other cellular constituents. Since the inception of their discoveries, the UPS and autophagy were thought to be independent of each other in components, action mechanisms, and substrate selectivity. Recent studies suggest that cells operate a single proteolytic network comprising of the UPS and autophagy that share notable similarity in many aspects and functionally cooperate with each other to maintain proteostasis. In this review, we discuss the mechanisms underlying the crosstalk and interplay between the UPS and autophagy, with an emphasis on substrate selectivity and compensatory regulation under cellular stresses.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.93-93
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• 2016

Large scale integrated circuits (LSIs) has been improved by the shrinkage of the circuit dimensions. The smaller chip sizes and increase in circuit density require the miniaturization of the line-width and space between metal interconnections. Therefore, an extreme precise control of the critical dimension and pattern profile is necessary to fabricate next generation nano-electronics devices. The pattern profile control of plasma etching with an accuracy of sub-nanometer must be achieved. To realize the etching process which achieves the problem, understanding of the etching mechanism and precise control of the process based on the real-time monitoring of internal plasma parameters such as etching species density, surface temperature of substrate, etc. are very important. For instance, it is known that the etched profiles of organic low dielectric (low-k) films are sensitive to the substrate temperature and density ratio of H and N atoms in the H2/N2 plasma [1]. In this study, we introduced a feedback control of actual substrate temperature and radical density ratio monitored in real time. And then the dependence of etch rates and profiles of organic films have been evaluated based on the substrate temperatures. In this study, organic low-k films were etched by a dual frequency capacitively coupled plasma employing the mixture of H2/N2 gases. A 100-MHz power was supplied to an upper electrode for plasma generation. The Si substrate was electrostatically chucked to a lower electrode biased by supplying a 2-MHz power. To investigate the effects of H and N radical on the etching profile of organic low-k films, absolute H and N atom densities were measured by vacuum ultraviolet absorption spectroscopy [2]. Moreover, using the optical fiber-type low-coherence interferometer [3], substrate temperature has been measured in real time during etching process. From the measurement results, the temperature raised rapidly just after plasma ignition and was gradually saturated. The temporal change of substrate temperature is a crucial issue to control of surface reactions of reactive species. Therefore, by the intervals of on-off of the plasma discharge, the substrate temperature was maintained within ${\pm}1.5^{\circ}C$ from the set value. As a result, the temperatures were kept within $3^{\circ}C$ during the etching process. Then, we etched organic films with line-and-space pattern using this system. The cross-sections of the organic films etched for 50 s with the substrate temperatures at $20^{\circ}C$ and $100^{\circ}C$ were observed by SEM. From the results, they were different in the sidewall profile. It suggests that the reactions on the sidewalls changed according to the substrate temperature. The precise substrate temperature control method with real-time temperature monitoring and intermittent plasma generation was suggested to contribute on realization of fine pattern etching.

• Journal of the Korea Society of Computer and Information
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• v.12 no.6
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• pp.213-218
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• 2007

We propose a compact internal quard-band antenna with sufficient impedance bandwidths and gains for the GSM(Global Systems for Mobile), GPS(Global Positing System). DCS(Digital Codeless System), PCS (Personal Communication System) operation. The proposed antenna on a substrate. which is small enough to be installed in practical mobile phones, has heights of only 6mm from the substrate. In addition, the proposed antenna decreases the construction complex on the substrate. The GSM ($880MHz{\sim}960MHz$) GPS(1575MHz) DCS($1710MHz{\sim}1880MHz$). PCS($1750MHz{\sim}1870MHz$) bands. Details of the design and analysis of the proposed antenna are described and the experimental results of the constructed prototype are presented.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.2
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• pp.41-48
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• 2014

Direct writing(DW) is a method of patterning materials to a substrate directly, without a mask. It can use a variety of materials and be applied to various fields. Among DW systems, the flow-based type, using a syringe pump and nozzle, is simpler than other types. Furthermore, the range of materials is exceptionally wide. In additive processes, a three dimensional structure is made of stacking layer. Each layer is made of several lines. In this regard, good surface roughness of fabricated layers is essential to three dimensional fabrication. The surface roughness of any fabricated layer tends to change with the dispensing pattern. When multiple layers fabricated by a nozzle dispensing system are stacked, control of the nozzle position from the substrate is important in order to avoid interference between the nozzle and the fabricated layer. In this study, a fluid direct writing system for three dimensional structure fabrication was developed. Experimentsto control the position of the nozzle from substrate were conducted in order to examine the characteristics of the material used in this system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2371-2380
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• 2000

In this paper, we developed the proximity exposure system with the vertical structure of glass and mask stage to minimize the mask's warp caused by the pull of gravity. This system, which canirradiate the ultra violet through 1440 H 850 $\textrm{mm}^2$ and 1330X 1015 $\textrm{mm}^2$ exposure area, has the followingcharacteristics. The glass stage can be inclined by 80 degrees at vertical structure to load substrate withsafety on it. When the glass stage is the vertical state, the gap control, alignment control and exposureof ultra violet are executed. So, it enhances the pattern uniformity by minimizing the mask's warp. Theglass stage can also control the gap between the mask and the substrate by the coarse and fine motioncontrol. The mask stage can adjust the posture of photomask to the position of substrate by imageprecessing method. The galss stage for the gap control and the mask stage for the alignment aredesigned independently for each function.

• Journal of Korean Society on Water Environment
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• v.28 no.5
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• pp.717-722
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• 2012

Fluoride can be easily found in semiconductor and display industry. However, there is a lack of research for its effects on the related wastewater treatment. The objective of this study is to evaluate the microbial inhibitory effect by fluoride injection. The research entailed the assessment of removal efficiency of $TCOD_{Cr}$ according to the fluoride concentration and also the Specific Oxygen Uptake Rate (SOUR) was measured. The laboratory scale reactor was prepared and operated with the fluoride concentrations of 0, 10, 50, 100, and 200 mg/L based on concentrations frequently occurring in the wastewater. The results from this study showed that, as the fluoride concentration increase, the Specific Substrate Utilization Rate (SSUR) tend to decrease as expected. Also, the increase in fluoride concentrations resulted in the decrease in SOUR. It is determined that fluoride injection affects the microbial activity. Especially, The addition of above 200 mg/L fluoride into reactor caused rapidly decreased SSUR and SOUR due to the inhibitory effects of fluoride.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1589-1592
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• 1994

We developed the ion plating system, consisted of the Facing Target Magnetron Sputtering System and the r.f, electrode of the coil type, which was available to control the reactive and the adhesion between thin film and substrate, and studied about the discharge characteristics and the optimum condition in order to form the high quality thin film. The characteristics of discharge and plasma was measured as Double Probe and Electrostatic Retarding Grid Analyzer. The incident ion energy on the substrate was increased as the increasing r.f power, bias voltage. By the r.f electrode, the ionization rate of the sputtered particles was about 75%, and the mean incident ion energy depend on the value which was difference between the plasma potential and biased substrate potential.