• Title/Summary/Keyword: Substrate Stiffness

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Microfluidic chip for characterization of mechanical property of cell by using impedance measurement (임피던스 측정을 이용한 세포의 변형성 분석용 미소유체 칩)

  • Kim, Dong-Il;Choi, Eun-Pyo;Chio, Sung-Sik;Park, Jung-Yul;Lee, Sang-Ho;Yun, Kwang-Seok
    • Journal of Sensor Science and Technology
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    • v.18 no.1
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    • pp.42-47
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    • 2009
  • In this paper we propose a microfluidic chip that measures the mechanical stiffness of cell membrane using impedance measurement. The microfluidic chip is composed of PDMS channel and a glass substrate with electrode. The proposed device uses patch-clamp technique to capture and deform a target cell and measures impedance of deformed cells. We demonstrated that the impedance increased after the membrane stretched and blocked the channel.

Evaluation of Elastic Properties for Nanoscale Coating Layers Using Ultrasonic Atomic Force Microscopy (초음파원자현미경을 이용한 나노스케일 박막 코팅층에 대한 탄성특성 평가)

  • Kwak, Dong Ryul;Cho, Seung Bum;Park, Ik Keun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.5
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    • pp.475-480
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    • 2015
  • Ultrasonic atomic force microscopy (Ultrasonic-AFM) has been used to investigate the elastic property of the ultra-thin coating layer in a thin-film system. The modified Hertzian theory was applied to predict the contact resonance frequency through accurate theoretical analysis of the dynamic characteristics of the cantilever. We coat 200 nm thick Aluminum and Titanium thin films on the substrate using the DC Magnetron sputtering method. The amplitude and phase of the contact resonance frequency of a vibrating cantilever varies in response to the local stiffness constant. Ultrasonic-AFM images were obtained using the variations in the elastic property of the materials. The morphology of the surface was clearly observed in the Ultrasonic-AFM images, but was barely visible in the topography. This research demonstrates that Ultrasonic-AFM is a promising technique for visualizing the distribution of local stiffness in the nano-scale thin coatings.

Application of ultra-high performance fiber reinforced concrete for retrofitting the damaged exterior reinforced concrete beam-column joints

  • Al-Osta, Mohammed A.;Khan, Muhammad I.;Bahraq, Ashraf A.;Xu, Shi-Yu
    • Earthquakes and Structures
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    • v.19 no.5
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    • pp.361-377
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    • 2020
  • In the present research work, the effectiveness and the efficiency of a retrofitting approach using a layer of ultra-high performance fiber reinforced concrete (UHPFRC) jacket for damaged substandard exterior beam-column joints (BCJs) is experimentally investigated. The main objective of this study is to rehabilitate the already damaged BCJs to meet the serviceability requirements without compromising safety. According to the proposed strengthening technique, a chipped surface, lightly brushed with a dry condition was selected for making a successful bond between normal concrete substrate surface (NCSS) and UHPFRC. Then a fresh UHPFRC jacket with a thickness of 30 mm was cast around the damaged specimens. The entire test matrix was comprised of three 1/3 scale damaged exterior BCJs with a different column axial load (CAL). These specimens were repaired with UHPFRC and retested under monotonic loading. Based on the experimental results, repaired specimens showed an excellent performance in terms of their load-displacement response, maximum strength, displacement ductility, initial stiffness, secant stiffness and energy dissipation capacity when compared with the corresponding values registered when these specimens were tested in their virgin state. This rehabilitative intervention not only restored the strength, stiffness, ductility and energy dissipation capacity of severely damaged specimens but also improved their performance.

The Influence of Hydrogen Intercalation on the Nanomechanical Properties of Epitaxial Graphene on SiC Substrates

  • Kwon, Sangku;Ko, Jae-Hyeon;Yang, G.E.;Kim, Won-Dong;Kim, Yong-Hyun;Park, Jeong Young
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.129.1-129.1
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    • 2013
  • Atomically-thin graphene is the ideal model system for studying nanoscale friction due to its intrinsic two-dimensional anisotropy. Here, we report the reduced nanoscale friction of epitaxial graphene on SiC, investigated with conductive-probe atomic force microscopy/friction force microscopy in ultra-high vacuum. The measured friction on a buffer layer was found to be 1/8 of that on a monolayer of epitaxial graphene. Conductive probe atomic force microscopy revealed a lower conductance on the buffer layer, compared to monolayer graphene. We associate this difference in friction with the difference in total lateral stiffness. Because bending stiffness is associated with flexural phonons in two-dimensional systems, nanoscale frictional energy should primarily dissipate through damping with the softest phonons. We investigated the influence of hydrogen intercalation on the nanoscale friction. We found that the friction decreased significantly after hydrogen intercalation, which is related to loose contact between the graphene and the substrate that results in a lower bending stiffness.

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Axisymmetric bending of a circular plate with stiff edge on a soft FGM layer

  • Volkov, Sergey S.;Litvinenko, Alexander N.;Aizikovich, Sergey M.;Wang, Yun-Che;Vasiliev, Andrey S.
    • Structural Engineering and Mechanics
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    • v.59 no.2
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    • pp.227-241
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    • 2016
  • A circular plate with constant thickness, finite radius and stiff edge lying on an elastic halfspace is considered. The half-space consists of a soft functionally graded (FGM) layer with arbitrary varying elastic properties and a homogeneous elastic substrate. The plate bends under the action of arbitrary axisymmetric distributed load and response from the elastic half-space. A semi-analytical solution for the problem effective in whole range of geometric (relative layer thickness) and mechanical (elastic properties of coating and substrate, stiffness of the plate) properties is constructed using the bilateral asymptotic method (Aizikovich et al. 2009). Approximated analytical expressions for the contact stresses and deflections of the plate are provided. Numerical results showing the qualitative dependence of the solution from the initial parameters of the problem are obtained with high precision.

Stress Analysis Using Finite Element Modeling of a Novel RF Microelectromechanical System Shunt Switch Designed on Quartz Substrate for Low-voltage Applications

  • Singh, Tejinder;Khaira, Navjot K.;Sengar, Jitendra S.
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.5
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    • pp.225-230
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    • 2013
  • This paper presents a novel shunt radio frequency microelectromechanical system switch on a quartz substrate with stiff ribs around the membrane. The buckling effects in the switch membrane and stiction problem are the primary concerns with RF MEMS switches. These effects can be reduced by the proposed design approach due to the stiffness of the ribs around the membrane. A lower mass of the beam and a reduction in the squeeze film damping is achieved due to the slots and holes in the membrane, which further aid in attaining high switching speeds. The proposed switch is optimized to operate in the k-band, which results in a high isolation of -40 dB and low insertion loss of -0.047 dB at 21 GHz, with a low actuation voltage of only 14.6 V needed for the operation the switch. The membrane does not bend with this membrane design approach. Finite element modeling is used to analyze the stress and pull-in voltage.

Behavior of Bacteria on the Porous Substrates: Diffusion Effect (다공성 매질 표면에서 박테리아의 거동: 확산의 영향)

  • Cho, Myoung-Ock;Cho, Ji-Yong;Park, Eun-Jung;Lee, Dong-Hee;Lee, Jeong-Hoon;Kim, Jung-Kyung
    • Journal of the Korean Society of Visualization
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    • v.6 no.2
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    • pp.45-50
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    • 2008
  • It has been found that the colony size of bacteria grown on an agar plate decreases with increasing agar gel concentration. Evidenc from recent studies suggests that the bacterial colony dynamics is closely related with the mechanical properties of the substrate. We investigate whether bacterial growth on the agar substrate is controlled mostly by the nutrients' diffusion which is hindered more in porous medium than in solution. The number of bacterial cells in single colonies is found to be inversely correlated with agar concentration. High-resolution live cell imaging at the single bacterium level confirms that the bacterial growth rate is reduced with increasing agar concentration. There is a strong correlation between the slowed diffusion and the reduced number of cells in a high concentration of agar medium.

Winkler spring behavior in FE analyses of dowel action in statically loaded RC cracks

  • Figueira, Diogo;Sousa, Carlos;Neves, Afonso Serra
    • Computers and Concrete
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    • v.21 no.5
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    • pp.593-605
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    • 2018
  • A nonlinear finite element modeling approach is developed to assess the behavior of a dowel bar embedded on a single concrete block substrate, subjected to monotonic loading. In this approach, a discrete representation of the steel reinforcing bar is considered, using beam finite elements with nonlinear material behavior. The bar is connected to the concrete embedment through nonlinear Winkler spring elements. This modeling approach can only be used if a new constitutive model is developed for the spring elements, to simulate the deformability and strength of the concrete substrate. To define this constitutive model, an extensive literature review was conducted, as well as 3 experimental tests, in order to select the experimental data which can be used in the calibration of the model. Based on this data, an empirical model was established to predict the global dowel response, for a wide range of bar diameters and concrete strengths. This empirical model provided the information needed for calibration of the nonlinear Winkler spring model, valid for dowel displacements up to 4 mm. This new constitutive model is composed by 5 stages, in order to reproduce the concrete substrate response.

Vibration Analysis of the Large Substrate Handling Robot (8.5G 솔라셀 평판 핸들링 로봇의 진동 제어)

  • Park, Dong Il;Park, Cheolhoon;Park, Chanhun;Kim, Doohyung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.6
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    • pp.498-503
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    • 2016
  • Many types of robot systems are used in the mass production line of thin film solar cells and flat panel displays. There are some issues such as the deflection and the vibration of the end-effector because robots handle large and heavy substrates at high speed. Heavy payload and high speed cause much vibration because the end-effector (fork) is made of carbon fiber reinforced polymer because of its light weightiness and sufficient stiffness. This study performs a dynamic simulation of an 8.5G solar cell substrate handling robot, including rigid and flexible bodies and a vibration controller. The fifth polynomial trajectory and the zero vibration derivative input shaping algorithm are applied. The vibration reduction is also proved in the experiments.

Fracture toughness of amorphus SiC thin films using nanoindentation and simulation

  • Mamun, M.A.;Elmustafa, A.A.
    • Advances in materials Research
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    • v.9 no.1
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    • pp.49-62
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    • 2020
  • Fracture toughness of SiC on Si thin films of thicknesses of 150, 750, and 1500 nm were measured using Agilent XP nanoindenter equipped with a Dynamic Control Module (DCM) in Load Control (LC) and Continuous Stiffness Method (CSM) protocols. The fracture toughness of the Si substrate is also measured. Nanovision images implied that indentations into the films and well deep into the Si caused cracks to initiate at the Si substrate and propagate upward to the films. The composite fracture toughness of the SiC/Si was measured and the fracture toughness of the SiC films was determined based on models that estimate film properties from substrate properties. The composite hardness and modulus of the SiC films were measured as well. For the DCM, the hardness decreases from an average of 35 GPa to an average of 13 GPa as the film thick increases from 150 nm to 1500 nm. The hardness and moduli of the films depict the hardness and modulus of Si at deep indents of 12 and 200 GPa respectively, which correlate well with literature hardness and modulus values of Si. The fracture toughness values of the films were reported as 3.2 MPa√m.