• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.11
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• pp.762-769
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• 2017

The extensional stiffness in quasi-isotropic laminates is uniform in the radial direction, but the bending stiffness varies radially due to the stacking sequence. This paper addresses the directional dependency of the bending stiffness and its radial variation in three types of quasi-isotropic laminate reflectors consisting of unidirectional fiber composite materials (UDM) and randomly distributed composite materials (short fiber, RDM). The extensional stiffness and bending stiffness in optical reflectors using RDM are uniform, while the bending stiffness in those using UDM varies radially from 11% to 26%. Also, the stiffness sensitivity, such as the bend-twist or bend-torsion effect, due to the differences in the stiffness value in the composite, is large. These factors are problematic in the optical field requiring precision surfaces. Utilizing RDM might be one way to eliminate the presence of bending stiffness in composite mirror substrates.

• Journal of Sensor Science and Technology
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• v.32 no.6
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• pp.386-390
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• 2023

Stiffness-engineered stretchable substrate technology has been widely used to produce stretchable displays, transistors, and integrated circuits because it is compatible with various flexible electronics technologies. However, the stiffness-engineering technology has never been applied to transistor-based stretchable strain sensors. In this study, we developed thin-film transistor-based strain sensors on stiffness-engineered stretchable substrates. We designed and fabricated strain-sensitive stretchable resistors capable of inducing changes in drain currents of transistors when subjected to stretching forces. The resistors and source electrodes of the transistors were connected in series to integrate the developed stretchable resistors with thin-film transistors on stretchable substrates by printing the resistors after fabricating transistors. The thin-film transistor-based stretchable strain sensors demonstrate feasibility as strain sensors operating under strains of 0%-5%. This strain range can be extended with further investigations. The proposed stiffness-engineering approach will expand the potential for the advancement and manufacturing of innovative stretchable strain sensors.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• The Journal of Korea Robotics Society
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• v.11 no.3
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• pp.133-139
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• 2016

Increasing interest of human health, building bio-database (Bio DB) has been become a hot issue in life science. Consequently, Single Cell Analysis (SCA) which can explain biodiversity of lives has been a significant factor for building Bio DB. In numerous studies from these analyses, they have been showed that mechanical properties of cells can serve explanation of biological heterogeneity and criterion of disease states. Therefore, measuring mechanical properties of cells have great potential to be used in bio-medical applications. However, traditionally, many researchers have undergone difficult and time consuming work because handling small sized cells usually requires high-skilled technique. Thus, this paper shows robotized stiffness measurement technique using fixed ended beam sensor, precision motorized stage and substrate which have wall structure.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.2
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• pp.115-119
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• 2016

Winding is one of the major processes in roll-to-roll systems. Taper tension profile in a winding determines the distribution of stress in the radial direction, i.e., the radial stress in the wound rolls. Maximum radial stress is major cause of material defect, and this study has been actively proceeded. Traditional models of radial stress model were focused on flexible and light substrate. In this study, we developed an advanced radial stress model including effects of both these parameters(weight and stiffness) on the radial stress. The accuracy of the developed model was verified through FEM(Finite Element Method) analysis. FEM result of maximum radial stress value corresponds to 99 % in comparison to result with the model. From this study, the material defects does not occur when the steel winding. And steel industry can be applied to improve the winding process.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.111-118
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• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.39-46
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• 2019

A stiffness-gradient soft PDMS/hard PDMS/FPCB stretchable package of the island-bridge structure was processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate, and its effective elastic modulus and stretchable deformation characteristics were analyzed. With the elastic moduli of the soft PDMS, hard PDMS, and FPCB to be 0.28 MPa, 1.74 MPa, and 1.85 GPa, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was analyzed as 0.58 MPa. When the soft PDMS of the soft PDMS/hard PDMS/FPCB package was stretched to a tensile strain of 0.3, the strains occurring at hard PDMS and FPCB were found to be 0.1 and 0.003, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.55-62
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• 2019

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/FPCB structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate. The elastic characteristics of the stretchable packages were estimated and their long-term reliabilities on stretching cycles and bending cycles were characterized. With 0.28 MPa, 1.74 MPa, and 1.85 GPa as the elastic moduli of the soft PDMS, hard PDMS, and FPCB, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was estimated as 0.6 MPa. The resistance of the stretchable packages varied for 2.8~4.3% with stretching cycles ranging at 0~0.3 strain up to 15,000 cycles and for 0.9~1.5% with 15,000 bending cycles at a bending radius of 25 mm.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.9
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• pp.104-109
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• 2021

Tactile sensors and integrated circuits that detect external stimuli have been developed for use in various industries. Most tactile sensors have been developed using the MEMS(micro electro-mechanical systems) process in which metal electrodes and strain sensors are applied to a silicon substrate. However, tactile sensors made of highly brittle silicon lack flexibility and are prone to damage by external forces. Flexible tactile sensors based on polydimethylsiloxane and using a multi-walled carbon nano-tube mixture as a pressure-sensitive material are currently being developed as an alternative to overcome these limitations. In this study, a manufacturing process of pressure-sensitive materials with low initial electrical resistance is developed and applied to the fabrication of flexible tactile sensors. In addition, flexible tactile sensors are developed with pressure-sensitive materials dispensed on a substrate with flexible mechanical properties. Finally, a study is conducted on the change in electrical resistance of pressure-sensitive materials according to the modulus of elasticity of the substrate.