• Laser Solutions
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• v.8 no.1
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• pp.39-44
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• 2005

We report experimental results on the periodic patterning using a Ti:sapphire femtosecond laser (800nm, 100fs, 1kHz). Periodic structures with reproducible basic patterns are produced both on the surface and inside transparent materials. Period patterning for the application to display panel is widely investigated. Also, the submicron dot and line patterns are fabricated inside fused silica glass, which is important for the formation of diffraction grating in integrated optical circuit. finally, we demonstrate the utility of the femtosecond laser application to optical memory by fabricating the three-dimensional dot patterns.

• Journal of information and communication convergence engineering
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• v.13 no.1
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• pp.56-61
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• 2015

The demand for high-aspect-ratio structures has been increasing in the field of semiconductors and other applications. Here, we present the commercially available negative-tone SU-8 as a potential resist that can be used for direct patterning of high-aspect-ratio structures at the submicron scale and the nanoscale. Such resist patterns can be used as polymeric molds to create high-aspect-ratio metallic submicron and nanoscale structures by using electroplating. Compared with poly (methyl methacrylate) (PMMA), we found that the negative tone resist required an exposure dose that was less than that of PMMA of equal thickness by a factor of 100-150. Patterning of up to 4:1 aspect ratio SU-8 structures with a minimum feature size of 500 nm was demonstrated. In addition, nanoimprint lithography was studied to further extend the aspect ratio to realize a minimum feature size of less than 10 nm with an extremely high aspect ratio in the negative resist.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.6
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• pp.36-40
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• 2009

Development of maskless lithography techniques can provide a potential solution for the photomask cost issue. Furthermore, it could open a market for small scale manufacturing applications. Since femtosecond lasers have been found suitable for processing of a wide range of materials with sub-micrometer resolution, it is attractive to use this technique for maskless lithography. As a femtosecond laser has recently been developed, both of high power and high photon density are easily obtained. The high photon density results in photopolymerization of photoresist whose absorption spectrum is shorter than that of the femtosecond laser. The maskless lithography using the two-photon absorption (TPA) makes micro structures. In this paper, we present a femtosecond laser direct write lithography for submicron PR patterning, which show great potential for future application.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.10
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• pp.101-107
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• 1994

The PMMA/Ge/AZ trilayer resist decreased proximity effect of backscattering electrons and corrected pattern distoration in order to from deep submicron patterns. In the experiment, the prosiemity effect is decreased by 11% and 30% for the case of 0.9$\mu$m and 1.7$\mu$m AZ, respectively, in trilayer resist compared to monolyer resist. also, the EID of 240$\AA$ Ge film is smaller than that of 500$\AA$ film by 365. 0.1$\mu$m line/space was formed in the 2000$\AA$ PMMA layer with the condition of dose 330${\mu}C/cm^{2}$ and of 150sec of develop time in MIBK : IPA (1:3) developer.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.3
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• pp.87-92
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• 1997

Inductively coupled Cl$_{2}$ plasma has been studied to etch Pt thin films, which hardly form volatile compound with any reactive gas at normal process temperature. Low etch rate and residue problems are frequently observed. For higher etch rate, high density plasma and higher process temperature is adopted observed. For higher etch rate, high density plasma and higher process temperature is adopted and thus SiO$_{2}$ is used as for patterning mask instead of photoresist. The effect of O$_{2}$ or Ar addition to Cl$_{2}$ was investigated, and the chamber pressure, gas flow rate, surce RF power and bias RF power are also varied to check their effects on etch rate and selectivity. The major etching mechanism is the physical sputtering, but the ion assisted chemical raction is also found to be a big factor. The proposs can be optimized to obtain the etch rate of Pt up to 200nm/min and selectivity to SiO$_{2}$ at 2.0 or more. Patterning of submicron Pt lines are successfully demonstrated.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.151-157
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• 1993

Abstract We have fabricated Y-Ba-Cu-O superconducting thin films by in-situ on-axis rf magnetron sputtering method using $Y_1$B$a_2$C${u_4}\;{_2O_x}$ nonstoichiometric target. Reactive ion etching (RIE) method was used in patterning the films. We have investigated the properties of patterned films, and compared the properties of the films before and after patterning. As the line width of the pattern decreases from 5${\mu}$m to 2${\mu}$m, a slight but not significant degradation in superconducting properties of the patterned films is observed. The bridge patterns are found to have clean edges and good electrical properties enough to be applied in device applications. From the result of this research, the possibility of submicron patterning by RlE is confirmed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.196-198
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• 2003

Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

• Journal of the Optical Society of Korea
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• v.14 no.4
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• pp.305-309
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• 2010

Photopolymer films containing fluorescent anthracene polymer, polymethyleneanthracene (PMAn), were prepared with different concentrations of PMAn for holographic recording useful for security documents. The fluorescent photopolymer film showed enhanced fluorescent intensity due to the micro-separation which arose from grating formation and diffusion during photopolymerization. Experimental values of diffraction efficiency were well matched to the simulated values for photopolymers having different PMAn concentrations. Holography patterning was carried out using the fluorescent photopolymer under a photo-mask. A grating was confirmed using microscope techniques in the recorded area under the pattern. Importantly the recorded area showed enhanced fluorescence compared to the unrecorded part, allowing fluorescence patterns at micro scale along with the submicron grating pattern. The fluorescence pattern recorded on the photopolymer film provides additional readability of holographic reading and thus is useful for secure recording and reading of information.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.59-66
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• 1996

Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.

• Transactions of Materials Processing
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• v.14 no.5 s.77
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• pp.473-476
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• 2005

The demand of on-chip total analyzing system with MEMS (micro electro mechanical system) bio/chemical sensor is rapidly increasing. In on-chip total analyzing system, to detect the bio/chemical products with submicron feature size, a filtration system with nano-filter is required. One of the conventional methods to fabricate nano-filter is to use direct patterning or RIE (reactive ion etching). However, those procedures are very costly and are not suitable fur mass production. In this study, we suggested new fabrication method for a nano-filter based on replication process, which is simple and low cost process. After the Si master was fabricated by laser interference lithography and reactive ion etching process, the polymeric mold was replicated by UV-imprint process. Metallic nano-filter was fabricated after removing the polymeric part of metal deposited polymeric mold. Finally, our fabrication method was applied to metallic nano-filter with $1{\mu}m$ pitch size and $0.4{\mu}m$ hole size for bacteria sensor application.