• 제목/요약/키워드: Submicron patterning

검색결과 15건 처리시간 0.024초

펨토초 레이저를 이용한 미세 패터닝 기술 (Periodic patterning using a femtosecond laser)

  • 손익부;이만섭;우정식;이상만;정정용
    • 한국레이저가공학회지
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    • 제8권1호
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    • pp.39-44
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    • 2005
  • We report experimental results on the periodic patterning using a Ti:sapphire femtosecond laser (800nm, 100fs, 1kHz). Periodic structures with reproducible basic patterns are produced both on the surface and inside transparent materials. Period patterning for the application to display panel is widely investigated. Also, the submicron dot and line patterns are fabricated inside fused silica glass, which is important for the formation of diffraction grating in integrated optical circuit. finally, we demonstrate the utility of the femtosecond laser application to optical memory by fabricating the three-dimensional dot patterns.

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High-Aspect-Ratio Nanoscale Patterning in a Negative Tone Photoresist

  • Ryoo, Kwangki;Lee, Jeong Bong
    • Journal of information and communication convergence engineering
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    • 제13권1호
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    • pp.56-61
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    • 2015
  • The demand for high-aspect-ratio structures has been increasing in the field of semiconductors and other applications. Here, we present the commercially available negative-tone SU-8 as a potential resist that can be used for direct patterning of high-aspect-ratio structures at the submicron scale and the nanoscale. Such resist patterns can be used as polymeric molds to create high-aspect-ratio metallic submicron and nanoscale structures by using electroplating. Compared with poly (methyl methacrylate) (PMMA), we found that the negative tone resist required an exposure dose that was less than that of PMMA of equal thickness by a factor of 100-150. Patterning of up to 4:1 aspect ratio SU-8 structures with a minimum feature size of 500 nm was demonstrated. In addition, nanoimprint lithography was studied to further extend the aspect ratio to realize a minimum feature size of less than 10 nm with an extremely high aspect ratio in the negative resist.

펨토초 레이저를 이용한 미세 PR 패터닝 (Femtosecond Laser Lithography for Maskless PR Patterning)

  • 손익부;고명전;김영섭;노영철
    • 한국정밀공학회지
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    • 제26권6호
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    • pp.36-40
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    • 2009
  • Development of maskless lithography techniques can provide a potential solution for the photomask cost issue. Furthermore, it could open a market for small scale manufacturing applications. Since femtosecond lasers have been found suitable for processing of a wide range of materials with sub-micrometer resolution, it is attractive to use this technique for maskless lithography. As a femtosecond laser has recently been developed, both of high power and high photon density are easily obtained. The high photon density results in photopolymerization of photoresist whose absorption spectrum is shorter than that of the femtosecond laser. The maskless lithography using the two-photon absorption (TPA) makes micro structures. In this paper, we present a femtosecond laser direct write lithography for submicron PR patterning, which show great potential for future application.

삼층감광막구조를 이용한 미세패턴의 전자빔 묘화 (Submicron Patterning in Electron Beam Lithography using Trilayer Resist)

  • 배용철;서태원;전국진
    • 전자공학회논문지A
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    • 제31A권10호
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    • pp.101-107
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    • 1994
  • The PMMA/Ge/AZ trilayer resist decreased proximity effect of backscattering electrons and corrected pattern distoration in order to from deep submicron patterns. In the experiment, the prosiemity effect is decreased by 11% and 30% for the case of 0.9$\mu$m and 1.7$\mu$m AZ, respectively, in trilayer resist compared to monolyer resist. also, the EID of 240$\AA$ Ge film is smaller than that of 500$\AA$ film by 365. 0.1$\mu$m line/space was formed in the 2000$\AA$ PMMA layer with the condition of dose 330${\mu}C/cm^{2}$ and of 150sec of develop time in MIBK : IPA (1:3) developer.

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고밀도 플라즈마에서 규소산화막을 마스크로 이용한 백금박막의 페터닝 (Patterning of Pt thin films using SiO$_2$mask in a high density plasma)

  • 이희섭;이종근;박세근;정양희
    • 전자공학회논문지D
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    • 제34D권3호
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    • pp.87-92
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    • 1997
  • Inductively coupled Cl$_{2}$ plasma has been studied to etch Pt thin films, which hardly form volatile compound with any reactive gas at normal process temperature. Low etch rate and residue problems are frequently observed. For higher etch rate, high density plasma and higher process temperature is adopted observed. For higher etch rate, high density plasma and higher process temperature is adopted and thus SiO$_{2}$ is used as for patterning mask instead of photoresist. The effect of O$_{2}$ or Ar addition to Cl$_{2}$ was investigated, and the chamber pressure, gas flow rate, surce RF power and bias RF power are also varied to check their effects on etch rate and selectivity. The major etching mechanism is the physical sputtering, but the ion assisted chemical raction is also found to be a big factor. The proposs can be optimized to obtain the etch rate of Pt up to 200nm/min and selectivity to SiO$_{2}$ at 2.0 or more. Patterning of submicron Pt lines are successfully demonstrated.

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활성이온식각법에 의한 Y-Ba-Cu-O고온초전도 박막의 미세선 제작 (Patterning of Y-Ba-Cu-O thin films by rdactive ion etching(RIE))

  • 박종혁;한택상;김영환;최상삼
    • 한국재료학회지
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    • 제3권2호
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    • pp.151-157
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    • 1993
  • In situ on-axis rf magnetron sputtering 방법으로 $Y_1$B$a_2$C${u_4}\;{_2O_x}$의 비화학 양론적인 타게트를 사용하여 $T_c$, $_{zero}$/-88.2K, ${\Delta}{T_c}$, <1.5K의 고온초전도 박막을 제조하고, 활성이온식각법으로 이 박막을 patterning하여 그 특성을 조사하였다. 제조된 패턴은 깨끗한 경계면을 가지고 있음이 관찰되었으며, 패턴 폭이 5${\mu}$m에서 2${\mu}$m로 좁아짐에 따라 임계온도와 임계전류밀도의 특성저하가 나타났으나, 그 저하폭이 크지 않아 소자로서 응용하기에 충분한 특성을 가지고 있음을 확인하였다. 한편 RIE방법에 의하여 미크론 이하의 선폭 제조가능성을 확인하였다.

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나노 임프린팅 리소그래피 장비의 기술개발 동향 (State of the art and technological trend for the nano-imprinting lithography equipment)

  • 이재종;최기봉;정광조
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.196-198
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    • 2003
  • Classical lithography in semiconductor employs stepper technologies. Limits of this technology are clearly seen at structures below 100nm. Nano-imprinting lithography is a new method for generating patterns in submicron range at reasonable cost. In order to manufacture nano-imprinting lithography(NIL) equipment, several NIL manufacturers have been developing key technologies for realization of nano-imprinting process, recently. In this paper, we've been describe state-of-the-art and technology trends for nano-imprinting lithography equipments.

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Preparation and Holographic Recording of Fluorescent Photopolymer Films Containing Anthracene Polymer for Security

  • Park, Tea-Hoon;Kim, Yoon-Jung;Kim, Jeong-Hun;Kim, Eun-Kyoung
    • Journal of the Optical Society of Korea
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    • 제14권4호
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    • pp.305-309
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    • 2010
  • Photopolymer films containing fluorescent anthracene polymer, polymethyleneanthracene (PMAn), were prepared with different concentrations of PMAn for holographic recording useful for security documents. The fluorescent photopolymer film showed enhanced fluorescent intensity due to the micro-separation which arose from grating formation and diffusion during photopolymerization. Experimental values of diffraction efficiency were well matched to the simulated values for photopolymers having different PMAn concentrations. Holography patterning was carried out using the fluorescent photopolymer under a photo-mask. A grating was confirmed using microscope techniques in the recorded area under the pattern. Importantly the recorded area showed enhanced fluorescence compared to the unrecorded part, allowing fluorescence patterns at micro scale along with the submicron grating pattern. The fluorescence pattern recorded on the photopolymer film provides additional readability of holographic reading and thus is useful for secure recording and reading of information.

감광성 polyimide LB막의 pattern형성에 관한 연구 (A study on patterning of photosensitive polyimide LB film)

  • 김현종;채규호;김태성
    • E2M - 전기 전자와 첨단 소재
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    • 제9권1호
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    • pp.59-66
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    • 1996
  • Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.

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UV 임프린팅 공정을 이용한 금속막 필터제작 (Fabrication of Metallic Nano-Filter Using UV-Imprinting Process)

  • 노철용;이남석;임지석;김석민;강신일
    • 소성∙가공
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    • 제14권5호
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    • pp.473-476
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    • 2005
  • The demand of on-chip total analyzing system with MEMS (micro electro mechanical system) bio/chemical sensor is rapidly increasing. In on-chip total analyzing system, to detect the bio/chemical products with submicron feature size, a filtration system with nano-filter is required. One of the conventional methods to fabricate nano-filter is to use direct patterning or RIE (reactive ion etching). However, those procedures are very costly and are not suitable fur mass production. In this study, we suggested new fabrication method for a nano-filter based on replication process, which is simple and low cost process. After the Si master was fabricated by laser interference lithography and reactive ion etching process, the polymeric mold was replicated by UV-imprint process. Metallic nano-filter was fabricated after removing the polymeric part of metal deposited polymeric mold. Finally, our fabrication method was applied to metallic nano-filter with $1{\mu}m$ pitch size and $0.4{\mu}m$ hole size for bacteria sensor application.