Residual Stress Behavior of High Temperature Polyimide Thin Films depending on the Structural Isomers of Diamine (Diamine의 구조적 이성질체에 따른 내열성 폴리이미드 박막의 잔류응력거동)
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- Journal of the Microelectronics and Packaging Society
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- v.6 no.2
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- pp.23-30
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- 1999