• 한국초전도ㆍ저온공학회논문지
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• 제9권1호
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• pp.57-60
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• 2007

Superconducting electric power devices need to stack HTS wires to increase the current carrying capacity. Uniform multi-stacked wires(UMS) which were made of the same HTS wires have been used. This paper shows the magnetization loss of hybrid multi-stacked(HMS) wire made of BSCCO wires and YBCO wires. Five HMS wires, YB(YBCO-BSCCO), YYBB. YBYB, YBBY and BYYB, were made and tested. Magnetization losses of each UMS wire were compared with corresponding HMS wire. Test results show that magnetization losses per unit length of HMS wire are between the corresponding UMS BSCCO wire and HMS YBCO wire below critical magnetic field. Above the critical magnetic field, magnetization losses of HMS wires are larger than that of corresponding both VMS wires.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 추계학술대회
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• pp.376-379
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• 2006

In this paper, stack voltage monitoring module is developed which monitor cell voltage of the fuel cell stack and transfer it to the main controller for monitoring fault and stopping drive when the trouble is happened in the fuel cell stack. Especially, the circuit, for monitoring each cell voltage of several hundreds cells in stack, is designed and analyzed. The connector is also developed for making wire harness simple and low cost because wire harness is complicated when the cells are connect each monitoring circuit.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.845-846
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• 2006

Reduce AC loss is very important in superconductor power machine. And HTS power application are needed an increment of current capacity. in this paper estimate AC loss effect and increase of current according tocomposition stack with 1G wire and 2G wire by measurement. A Method of composition stack are YBCO-BSCCO, YBCO-BSCCO-BSCCO-YBCO and BSCCO-YBCO-YBCO-BSCCO. also, test result compared analytic equation by Norries

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 심포지엄 논문집 정보 및 제어부문
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• pp.258-260
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• 2007

Nowadays the automotive circuit design becomes more complicated a practical modern car circuit usually contains thousands of wires. So the error connection between connector and pins becomes more difficult to be located. This paper proposes a general way to locate all error wires in an automotive circuit design. Firstly, we give an exact definition of error wire to guide our job. This definition also composes the core part of our algorithm. Then we limit the area of the error wires by several steps. During these steps, we apply breadth-first search method to step over all wires under consideration of reducing time cost. In addition, we apply bidirectional stack technique to organize the data structure for algorithm optimization. This algorithm can get a result with all error wires and doubtful wires in a very efficient way. The analysis of this algorithm shows that the complexity is linear. We also discuss some possible improvement of this algorithm.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• 한국해양환경ㆍ에너지학회지
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• 제13권3호
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• pp.216-222
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• 2010

연안잠식방지를 위해 둑이나 방파제 등의 고형의 구조물을 사용하는 것은 건설과 유지를 위해 많은 비용을 필요로 한다. 그럼에도 불구하고 파랑에너지가 효과적으로 감쇄되지 않을 경우 이들 고형 시설의 효과는 기대에 미치지 못할 수 있다. 효과적인 파랑에너지 감쇄를 통한 연안잠식 방지를 위해 경제적이고 환경친화적인 유연한 방파제를 도입하였다. 이 방파제는 폐타이어묶음과 그물망으로 이루어지는데, 폐타이어묶음은 그물망의 위치를 유지하는 역할을 하고 파랑에너지의 감쇄는 그물망을 통하여 발생한다. 현장실험을 위하여 2009년 6월 10일부터 타이완의 타이난 지역에 있는 슈앙천 해안에 상기 시설을 길이 50 m 높이 2 m로 설치하여 운용하였다. 2009년 6월 19~22일의 태풍 린파와 8월 6~10일의 태풍 모라콧의 영향 아래에서 상기 설비의 효능을 조사하였다. 설비 주위로 0.5~0.8 m의 침적이 발생하여 연안잠식 방지에 상기 설비의 효과가 긍정적인 것으로 나타났다.

• 제어로봇시스템학회논문지
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• 제15권8호
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• pp.798-803
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• 2009

This paper proposes a grating scanner which is driven by a stack-type piezoelectric element. The mechanism of the grating scanner is based on flexure hinges. Using some constraints, the compliant mechanism is designed and then verified by Finite Element Analysis. The designed compliant mechanism is manufactured by wire electro-discharge machining, and then integrated with a stack-type piezoelectric element for actuation and a capacitance displacement sensor for measuring ultra-precision displacement. Experiments demonstrates the characteristics and the performances of the grating scanner using the terms of working range, resonance frequency, bandwidth and resolution. The grating scanner is applicable to a Moire interferometry for measuring 3-dimensional microscopic surface.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• 한국초전도ㆍ저온공학회논문지
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• 제21권4호
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• pp.24-28
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• 2019

Despite the second generation HTS tapes (2G HTS tape) have limits in critical current value, scientific and electric devices require more current density day after day. These requirements are realized by using different superconducting wires that consist of 2G HTS tapes designed in various combinations. Authors of this paper have developed the numerical model for estimation of total critical current in the superconducting wire and critical current in each 2G HTS tape placed in this superconducting wire. The current drop in six 2G HTS tapes having different constructions was analyzed. The result of this research is the decrease of critical current up to 25 % for the stack of tapes and up to 5 % for the parallel tapes in the same plane. In addition, what was also made is the estimation of the current distribution by length for six 25 m 2G HTS tapes in different constructions and determination of current deviation by length of the wire.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.881-886
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• 2009

This paper presents a manipulation system consisting of a coarse/fine XY positioning system and an out-of-plane manipulator. The object of the system is to conduct tine positioning and manipulation of micro parts. The fine stage and the out-of-plane manipulator have compliant mechanisms with flexure hinges, which are driven by stack-type piezoelectric elements. In the fine stage, the compliant mechanism plays the roles of motion guide and displacement amplification. The out-of-plane manipulator contains three piezo-driven compliant mechanisms for large working range and fine resolution. For large displacement, the compliant mechanism is implemented by a two-step displacement amplification mechanism. The compliant mechanisms are manufactured by wire electro-discharge machining for flexure hinges. Experiments demonstrate that the developed system is applicable to a fine positioning and fine manipulation of micro parts.