Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)
- Volume 6 Issue 1 Serial No. 18
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- Pages.17-22
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- 2007
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- 1738-2270(pISSN)
The Low Height Looping Technology for Multi-chip Package in Wire Bonder
와이어 본더에서의 초저 루프 기술
- Kwak, Byung-Kil (Precision Instruments R&D Center, Sam sung Techwin Co., LTD) ;
- Park, Young-Min (Precision Instruments R&D Center, Sam sung Techwin Co., LTD) ;
- Kook, Sung-June (Semiconductor System Division, Sam sung Techwin Co., LTD)
- Published : 2007.03.31
Abstract
Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below