• 전기화학회지
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• 제10권4호
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• pp.279-282
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• 2007

개질기에서 생산된 수소를 연료전지용 연료로 사용할 때에는 개질수소가 포함하고 있는 일산화탄소가 막-전극접합체의 촉매를 피독시켜서 연료전지 성능이 크게 감소된다. 본 논문에서는 개질수소에 포함된 일산화탄소가 스퍼터링 공정으로 제조된 박막층에 의하여 개선된 막-전극접합체의 성능에 어떠한 영향을 미치는지 연구하였다. 실험결과 Pt와 Ru박막은 MEA의 단위전지 성능을 개선하였으며, 금속박막은 막-전극접합체의 일산화탄소에 대한 내구성을 증가시켰다. 산화전극으로의 공기주입 운전기법은 막-전극접합체의 일산화탄소에 대한 내구성을 증가시켰다. 게다가 Pt, Ru그리고 PtRu박막은 공기주입 운전에 영향을 주는 것으로 확인되었다.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.51-61
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• 1999

R.f. magnetron sputtering법에 의해 $SrBi_2Ta_2O_9$ 박막을 $Pt/SiO_2$/Si p-tyPp (100) 기판 위에 제조하였다. 제조된 박막을 $800^{\circ}C$에서 열처리한 후 증착 조건에 따라 미세구조와 전기적 특성을 측정하였다. $800^{\circ}C$에서 열처리된 박막은 (006), (111), (200) 및 이차상인 BiPt 피크가 XRD 분석 결과 나타났으며, 가스 압력의 감소와 기판 온도의 증가에 따라 결정입자는 성장하였다. 50mtorr, $100^{\circ}C$에서 증착 후 $800^{\circ}C$에서 열처리한 박막의 두께는 200nm이었다. 이 박막의 잔류분극과 항전계 값은 각각 20.07 $\mu$C/$\textrm {cm}^2$, 79kV/cm이었다.

• 한국정보통신학회논문지
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• 제11권1호
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• pp.89-94
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• 2007

다양한 기판 온도와 산화 가스 압력 하에서 i-beam 스퍼터링 법으로 BiSrCaCuO 박막을 제작하였다. 기판온도 $T_{sub}$와 산화 가스 압력 $pO_3$를 변화시키며 제작된 Bi2212 및 Bi2223 박막의 생성상도를 작성하였다. Bi2212 조성으로 스퍼터링 하였으나 Bi2212 상 뿐 아니라 Bi2201 상과 Bi2223 상이 모두 생성되었고, Bi2212나 Bi2223 단상은 매우 좁은 온도 영역에서만 형성되었다. 생성 엔탈피의 변화 ${\Delta}{\bar}HO_2$와 생성 엔트로피의 변화 ${\Delta}{\bar}SO_2$에 대한 열역학적인 계산을 통해 Bi2212 단상이 형성된 경우 각각 -260 kJ/mol 및 $-225J/mol{\cdot}K$의 값을 얻었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.288-289
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• 2011

Indium Tin Oxide (ITO) is a typical highly Transparent Conductive Oxide (TCO) currently used as a transparent electrode material. Most widely used deposition method is the sputtering process for ITO film deposition because it has a high deposition rate, allows accurate control of the film thickness and easy deposition process and high electrical/optical properties. However, to apply high quality ITO thin film in a flexible microelectronic device using a plastic substrate, conventional DC magnetron sputtering (DMS) processed ITO thin film is not suitable because it needs a high temperature thermal annealing process to obtain high optical transmittance and low resistivity, while the generally plastic substrates has low glass transition temperatures. In the room temperature sputtering process, the electrical property degradation of ITO thin film is caused by negative oxygen ions effect. This high energy negative oxygen ions(about over 100eV) can be critical physical bombardment damages against the formation of the ITO thin film, and this damage does not recover in the room temperature process that does not offer thermal annealing. Hence new ITO deposition process that can provide the high electrical/optical properties of the ITO film at room temperature is needed. To solve these limitations we develop the Magnetic Field Shielded Sputtering (MFSS) system. The MFSS is based on DMS and it has the plasma limiter, which compose the permanent magnet array (Fig.1). During the ITO thin film deposition in the MFSS process, the electrons in the plasma are trapped by the magnetic field at the plasma limiters. The plasma limiter, which has a negative potential in the MFSS process, prevents to the damage by negative oxygen ions bombardment, and increases the heat(-) up effect by the Ar ions in the bulk plasma. Fig. 2. shows the electrical properties of the MFSS ITO thin film and DMS ITO thin film at room temperature. With the increase of the sputtering pressure, the resistivity of DMS ITO increases. On the other hand, the resistivity of the MFSS ITO slightly increases and becomes lower than that of the DMS ITO at all sputtering pressures. The lowest resistivity of the DMS ITO is $1.0{\times}10-3{\Omega}{\cdot}cm$ and that of the MFSS ITO is $4.5{\times}10-4{\Omega}{\cdot}cm$. This resistivity difference is caused by the carrier mobility. The carrier mobility of the MFSS ITO is 40 $cm^2/V{\cdot}s$, which is significantly higher than that of the DMS ITO (10 $cm^2/V{\cdot}s$). The low resistivity and high carrier mobility of the MFSS ITO are due to the magnetic field shielded effect. In addition, although not shown in this paper, the roughness of the MFSS ITO thin film is lower than that of the DMS ITO thin film, and TEM, XRD and XPS analysis of the MFSS ITO show the nano-crystalline structure. As a result, the MFSS process can effectively prevent to the high energy negative oxygen ions bombardment and supply activation energies by accelerating Ar ions in the plasma; therefore, high quality ITO can be deposited at room temperature.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.160-160
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• 2015

InGaZnO (IGZO) thin-film transistors (TFTs) are very promising due to their potential use in high performance display backplane [1]. However, the stability of IGZO TFTs under the various stresses has been issued for the practical IGZO applications [2]. Up to now, many researchers have studied to understand the sub-gap density of states (DOS) as the root cause of instability [3]. Nomura et al. reported that these deep defects are located in the surface layer of the IGZO channel [4]. Also, Kim et al. reported that the interfacial traps can be affected by different RF-power during RF magnetron sputtering process [5]. It is well known that these trap states can influence on the performances and stabilities of IGZO TFTs. Nevertheless, it has not been reported how these defect states are created during conventional RF magnetron sputtering. In general, during conventional RF magnetron sputtering process, negative oxygen ions (NOI) can be generated by electron attachment in oxygen atom near target surface and accelerated up to few hundreds eV by self-bias of RF magnetron sputter; the high energy bombardment of NOIs generates bulk defects in oxide thin films [6-10] and can change the defect states of IGZO thin film. In this study, we have confirmed that the NOIs accelerated by the self-bias were one of the dominant causes of instability in IGZO TFTs when the channel layer was deposited by conventional RF magnetron sputtering system. Finally, we will introduce our novel technology named as Magnetic Field Shielded Sputtering (MFSS) process [9-10] to eliminate the NOI bombardment effects and present how much to be improved the instability of IGZO TFTs by this new deposition method.

• 한국재료학회지
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• 제26권4호
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• pp.207-211
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• 2016

Ti films were deposited on glass substrates under various preparation conditions in a chamber of two-facing-target type dc sputtering; after deposition, the electric resistivity values were measured using a conventional four-probe method. Crystallographic orientations and microstructures, including the texture and columnar structure, were also investigated for the Ti films. The morphological features, including the columnar structures and surface roughness, are well explained on the basis of Thornton's zone model. The electric resistivity and the thermal coefficient of the resistivity vary with the sputtering gas pressure. The minimum value of resistivity was around 0.4 Pa for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films; the apparent tendencies are almost the same for the two films, with a small difference in resistivity because of the different film thicknesses. The films deposited at high gas pressures show higher resistivities. The maximum of TCR is also around 0.4 Pa, which is the same as that obtained from the relationship between the resistivity and the gas pressure. The lattice spacing also decreases with increasing sputtering gas pressure for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films. Because they are strongly related to the sputtering gas pressures for Ti films that have a crystallographic anisotropy that is different from cubic symmetry, these changes are well explained on the basis of the film microstructures. It is shown that resistivity measurement can serve as a promising monitor for microstructures in sputtered Ti films.

• 한국전기전자재료학회논문지
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• 제22권7호
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• pp.595-601
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• 2009

For the silicon oxide $(SiO_x)$ films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration$(O_2/Ar+O_2)$ introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the $SiO_x$ films are as follows: $d_{TS}\;and\;d_{TT}$ are 90mm and 120mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3%. Under this optimum conditions, it was found that the $SiO_x$ film was grown with a very high deposition rate of $250{\AA}$/min by rf-power of $4.4W/cm^2$, which was significantly enhanced as compared with a deposition rate (${\sim}55{\AA})$/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.126.2-126.2
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• 2011

ZnS thin films were deposited with the radio frequency magnetron sputtering technique at various temperatures and sputtering powers. With the increase in the deposition temperature and the decrease in the radio frequency sputtering power, the crystallinity was increased and the surface roughness was decreased, which lead to the decrease in the electrical resistivity of the film. It is also clearly observed that, the intensity of the (111) XRD peak increases with increasing the substrate temperature. On the other hand, as seen in the FWHM decreased with increasing the substrate temperature. Since the FWHM of the (111) diffraction peak is inversely properties to the grain size of the film, then grain size of ZnS thin film increases with increasing the substrate temperature. The electrical resistivity and optical transmittance of the ZnS film as a function of the post-annealing temperature. It can be seen that with the annealing temperature set at $400^{\circ}C$, the resistivity decreases to a minimum value of $2.1{\times}10^{-3}\;{\Omega}cm$ and the transmittance increases to a maximum value of 80% of the ZnS film.

• 한국항행학회논문지
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• 제7권2호
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• pp.211-216
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• 2003

본 논문에서는 오래 전부터 NMOS의 게이트 전극으로 사용된 폴리실리콘을 대체할 수 있는 Ta-Ti 합금의 특성에 대해 연구하였다. 실리콘 기판 위에 열적으로 성장된 $SiO_2$ 위에 Ta과 Ti의 두 타깃을 사용하여 co-sputterring 방법으로 Ta-Ti 합금을 증착하였다. 각각의 타깃은 100W의 sputtering power로 증착하여 시편을 제작하였다. 또한 비교 분석을 위하여 Ta을 100W의 sputtering power로 증착한 시편도 제작하였다. 제작된 Ta-Ti 합금 게이트의 열적/화학적 안정성을 검토하기 위하여 $600^{\circ}C$에서 급속열처리를 수행한 결과 소자의 성능 저하는 나타나지 않았다. 또한 전기적 특성 분석 결과 Ta-Ti 합금은 NMOS에 적합한 일함수인 4.13eV를 산출해 낼 수 있었고, 면저항 역시 폴리실리콘에 비해 낮은 값을 얻을 수 있었다.

• 한국진공학회지
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• 제2권2호
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• pp.152-160
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• 1993

본 연구에서는 DC magnetron sputtering 장비를 이용하여, GdFe, Co, CoCr 박막을 제작함에 있어서 sputtering 조건에 관계되는 Ar 압력, 투입전력, 기판의 종류 등의 요소가 박막의 특성, 특히 보자력과 미세구조에 미치는 영향을 관찰하였다. GdFe의 경우 성막속도가 증가함에 따라 Gd의 atomic%가 줄어드는 것을 알 수 있었으며, Ar압력이 증가함에 따라 성막속도는 감소하였고, 투입전력이 증가함에 따라 성막속도는 거의 선형적으로 증가함을 알 수 있다. 또한 투입전력이 증가함에 따라 박막의 보자력도 증가함을 알 수 있었다. Co 박막에 대해서는 투입전력과 Ar 압력에 관한 성막속도와 미세구조에 관하여 관찰하였다. 이로써 투입전력이 증가하면 성막속도가 증가하며 결정립의 크기가 감소함을 알 수 있었고, Ar 압력이 증가하면 성막속도가 감소함을 알 수 있었다. CoCr의 박막에서는 substrate 종류에 따라 보자력 및 미세구조에 미치는 영향에 대해 연구를 행하였으며, substrate의 종류가 미세구조와 보자력에 상당한 영향을 준다는 것을 알 수 있었다.