• Journal of the Korean Ceramic Society
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• 제41권6호
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• pp.476-480
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• 2004

AZO (Al-doped ZnO) thin films were deposited on glass by pulsed magnetron sputtering method, and their structural, electrical and optical properties were investigated. XRD patterns showed that a highly c-axis preferred AZO film was grown in perpendicular to the substrate when pulse frequency of 30 ㎑ was applied to the target. Microstructure of thin films showed that the fibrous grain of tight dome shape was grown. The deposition rate decreased linearly with increase of pulse frequency, and the lowest resistivity was 8.67${\times}$10$\^$-4/ $\Omega$-cm for the film prepared at pulse frequency of 30 ㎑. The optical transmittance spectra of the films showed a very high transmittance of 85∼90%, within visible wavelength region and exhibited the absorption edge of about 350 nm. The characteristics of the low electrical resistivity and high optical transmittance of AXO films suggested a possibility for the application to transparent conducting oxides.

• Journal of the Korean Vacuum Society
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• 제10권2호
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• pp.189-193
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• 2001

We have characterized physical and electrical properties of W-TiN stacked gate electrode structure with TiN as a diffusion barrier of fluorine. As the $N_2/Ar$ gas ratio increased during sputter deposition, TiN thin films became N-rich, and the resistivity of the films increased. However, the resistivity of W-TiN stacked gate reduced as a result of the crystallization of tungsten with the increase of $N_2/Ar$ gas ratio. On the other hand, tungsten in W-TiN stacked gate structure have the (100)-oriented crystalline structure although TiN films were subjected to annealing at high temperature (600~$800^{\circ}C$). Leakage currents of W-TiN gate MOS capacitors were less than $10^{-7}\textrm{/Acm}^2$ and also were lowered by the order of 2 compared with those of pure W gate electrode.

• Korean Journal of Materials Research
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• 제22권9호
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• pp.459-464
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• 2012

We investigated cleaning effects using $NH_4OH$ solution on the surface of Cu film. A 20 nm Cu film was deposited on Ti / p-Si (100) by sputter deposition and was exposed to air for growth of the native Cu oxide. In order to remove the Cu native oxide, an $NH_4OH$ cleaning process with and without TS-40A pre-treatment was carried out. After the $NH_4OH$ cleaning without TS-40A pretreatment, the sheet resistance Rs of the Cu film and the surface morphology changed slightly(${\Delta}Rs:{\sim}10m{\Omega}/sq.$). On the other hand, after $NH_4OH$ cleaning with TS-40A pretreatment, the Rs of the Cu film changed abruptly (${\Delta}Rs:till{\sim}700m{\Omega}/sq.$); in addition, cracks showed on the surface of the Cu film. According to XPS results, Si ingredient was detected on the surface of all Cu films pretreated with TS-40A. This Si ingredient(a kind of silicate) may result from the TS-40A solution, because sodium metasilicate is included in TS-40A as an alkaline degreasing agent. Finally, we found that the $NH_4OH$ cleaning process without pretreatment using an alkaline cleanser containing a silicate ingredient is more useful at removing Cu oxides on Cu film. In addition, we found that in the $NH_4OH$ cleaning process, an alkaline cleanser like Metex TS-40A, containing sodium metasilicate, can cause cracks on the surface of Cu film.

• Proceedings of the Materials Research Society of Korea Conference
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.23.1-23.1
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• 2011

최근 화석연료를 대체하기 위한 지속가능한 신에너지에 대한 요구가 증대됨에 따라 태양광 발전에 대한 연구도 폭발적으로 늘어가고 있는 추세이다. 태양광이 화석연료 대체에너지로 실효성을 가지기 위해서는 태양광 발전 시스템의 발전효율을 높이고 생산 비용을 저감하는 문제가 선결되어야 한다. 기존 실리콘 태양전지 시스템 설비 비용의 60% 이상을 차지하는 모듈의 제조과정에서 소재 손실을 최소화함으로써 저가격화를 실현하고자 박막형 태양전기 기술이 태동되었다. 현재 박막 태양전지와 관련하여 활발한 기술 개발이 진행되고 있으며 상당한 시장 점유율을 보이고 있는 실정이다. 박막 태양전지 분야에서 CIGS와 같은 화합물 반도체 박막 태양전지 시장이 확대되고 있는 실정을 고려한다면 실리콘 박막 태양전지의 경우 고효율화 저가격화 달성은 더욱 절실한 문제이다. 실리콘 박막의 경우 독성이 없으며 고갈 우려가 없는 소재이면서 기존의 직접회로 산업의 인프라 구조를 활용할 수 있어 많은 기대와 관심을 끌고 있는 박막 태양전지 후보이다. 박막 태양전지 제조에 있어서 핵심기술은 도핑된 실리콘층과 광흡수를 위한 진성 실리콘층을 합성하는 공정 기술이다. 현재 박막 태양전지 산업에서 실리콘 박막 소재의 합성은 주로 PECVD법에 의해 이루어지고 있다. 그러나 스퍼터 공정을 이용한 실리콘 박막 합성 연구 또한 20년 이상의 오랜 기간 동안 연구되어 오고 있다. 스퍼터 공정을 이용한 실리콘 박막합성는 독성 가스를 사용하지 않으며, 디스플레이와 같은 기존의 소자 공정 기술을 채용할 수 있다는 장점을 가지고 있어 주목 받고 있다. 실제로 반응성 마그네트론 스퍼터링에 의해 제조된 실리콘 박막은 PECVD공정에 의한 실리콘 박막에 상응하는 우수한 광전자적 특성을 보인다. 스퍼터 공정에서는 박막 성장을 위한 수송 물질들이 열적 평형 상태에 근접한 라디칼들이라기 보다 대부분 고에너지 원자종과 이온들이 주류를 이루고 있어 합성된 실리콘 박막의 결함 제어가 어렵다는 문제가 있다. 박막 합성 기구의 규명을 통하여 이러한 문제를 해결하기 위한 시도들이 이루어 지고 있으며, 본 발표를 통하여 스퍼터 공정을 이용한 태양전지용 실리콘 박막 합성기술에 대한 현황을 소개하고자 한다.

• Journal of the Korean Ceramic Society
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• 제34권2호
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• pp.209-215
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• 1997

Aluminum nitride(AIN) thin films were deposited by reactive single ion beam sputtering using N2 or NH3 as reactive gas. The structural, compositional and optical properties of AIN thin films were characterized by XRD, GAXRD, TEM, SEM, XPS UV/VIS spectrophotometer, and FT-IR. All the deposited AIN thin films were amorphous by the analysis fo XRD and GAXRD. However, TEM analysis showed that AIN nano-crystallites were uniformly distributed in the films. The presence of Al-N bonds were also confirmed by FT-IR and XPS analyses. The optical bandgap of AIN films increased up to 6.2 eV and the transmittance was a-bout 100% in visible range with approaching the stoichimetric composition. Irrespective of using N2 or NH3 as reactive gas, the deposited AIN thin films had very smooth surface morphologies. Their refractive index ranged from 1.6 to 1.7.

• Journal of the Microelectronics and Packaging Society
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• 제12권3호
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• pp.207-212
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• 2005

Al, Ti, Ta, and Cr thin films were deposited on a polyimide substrate using DC magnetron sputter to study the adhesion characteristics of metal films on polyimide substrates, while RF bias of 0 - 400 W was applied to the substrate during DC sputtering. The adhesion strength was evaluated using a 90-degree peel test. The peel tests showed that the adhesion strength was enhanced by applying the RF bias to the substrate in all specimens. Scanning electron microscopy and Auger depth profile of the fractured surfaces indicate that the polyimide underwent cohesive failure during peeling and heavy deformation was also observed in the metal films peeled from the polyimide substrate when the RF bias applied during the deposition. Cross-sectional transmission electron microscopy revealed that the metal/polyimide interface was not clear and complicated. This complicated interface, likely formed due to the RF bias applied to the substrate, was attributed to the adhesion enhancement observed during the bias sputtering.

• Journal of the Korean Institute of Telematics and Electronics D
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• 제34D권2호
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• pp.27-37
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• 1997

Photoluminescent and cathodoluminescent charcteristics of inorganic luminescent materials were investigated ot develop possible phosphors for thin film electroluminescent (TFEL) device applications. Mg, Zn, and Photoluminescent and cathodoluminescent charcteristics of inorganic luminescent materials were investigated ot develop possible phosphors for thin film electroluminescent (TFEL) device applications. Mg, Zn, and $Si_3N_4$ powders were used to synthesize $(Mg_xZn_{1-x})SiN_2$ host materials. $Tb_4O_7$ and $Eu_2O_3$ powdrs were added as luminescent centers. Very sharp emission spectra of $Tb^{3+}$ ions were observed from $Mg._5Zn._5SiN_2:Tb$ sampels sintered at $1400^{\circ}C$ for an hour and the maximum intensity of emission spectra occured at wavelength of 550nm (green light). Synthetic conditions of $(Mg_xZn_{1-x})SiN_2:Eu$ phosphors were optimized for the hghest luminescence. The Eu concentrations were varied from 0.2% to 1.6%. Before firing, the powders were mixed using ballmills, methanol, acetone, or D.I. water. The Mg/Zn ratio also were varied from x=0.3 to x=0.7. The maximum PL intensity was obtained from a sample with 1.2% Eu concentration and the powder was mixed with methanol and dried before firing. The maximum intensity of the emission spectra occurred t the wavelength of 470nm(blue light). TFEL devices fabricated by using sputter deposition of $(Mg._3Zn._7)SiN_2:Eu$ phosphor layer showed yellowish white emission at the phosphor field of 2MV/cm.

• Progress in Superconductivity
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• 제5권2호
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• pp.105-108
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• 2004

We have studied effects of in-situ annealing on the fabrication of superconducting MgB$_2$ thin films prepared by rf magnetron co-sputtering. The Films were deposited on A1$_2$O$_3$ (1102) substrates at room temperature by using Mg and B targets. To trap remnant $O_2$ gas in the chamber, we used 20 mtorr Af sputter-gas balanced with 5 mol % of H$_2$ gas. To enhance adhesion to the substrate a thin layer of B was deposited prior to the codeposition of Mg and B. After completion of the film deposition, an additional Mg layer was deposited on top to compensate for Mg loss during the subsequent in-situ annealing. We have investigated the effects of two most important annealing parameters that are the Mg-to-B composition ratio and the annealing temperature. The range of the Mg-to-B composition ratio was from 0.42 to 0.85, and that of the annealing temperature was 500 $^{\circ}C$∼750 $^{\circ}C$. The Best result was obtained for the composition ratio of about 10% Mg excess from the stoichiometry and the annealing temperature of 700 $^{\circ}C$. Based on these results, we obtained films with T$_{c}$ : 36.5 K by further refining the fabrication process.s.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.352.1-352.1
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• 2014

Indium Tin Oxide (ITO) films are the most extensively studied and commonly used as ones of TCO films. The ITO films having a high electric conductivity and high transparency are easily fabricated on glass substrate at a substrate temperature over $250^{\circ}C$. However, glass substrates are somewhat heavy and brittle, whereas plastic substrates are lightweight, unbreakable, and so on. For these reasons, it has been recently suggested to use plastic substrates for flexible display application instead of glass. Many reaearchers have tried to produce high quality thin films at rood temperatures by using several methods. Therefore, amorphous ITO films excluding thermal process exhibit a decrease in electrical conductivity and optical transparency with time and a very poor chemical stability. However the amorphous Indium Gallium Zinc Oxide (IGZO) offers several advantages. For typical instance, unlike either crystalline or amorphous ITO, same and higher than a-IGZO resistivity is found when no reactive oxygen is added to the sputter chamber, this greatly simplifies the deposition. We reported on the characteristics of a-IGZO thin films were fabricated by RF-magnetron sputtering method on the PEN substrate at room temperature using 3inch sputtering targets different rate of Zn. The homogeneous and stable targets were prepared by calcine and sintering process. Furthermore, two types of IGZO TFT design, a- IGZO source/drain material in TFT and the other a- ITO source/drain material, have been fabricated for comparison with each other. The experimental results reveal that the a- IGZO source/drain electrode in IGZO TFT is shown to be superior TFT performances, compared with a- ITO source/drain electrode in IGZO TFT.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.188.1-188.1
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• 2014

Aluminum is widely used as a material for electrode on silicon based devices. Especially, aluminum films are used as backside and front-side electrodes in silicon quantum dot (QD) solar cells. In this point, the diffusion of aluminum is very important for the enhancement of power conversion efficiency by improvement of contact property. Aluminum was deposited on a Si (100) wafer and a Si QD layer by ion beam sputter system with a DC ion gun. The Si QD layer was fabricated by $1100^{\circ}C$ annealing of the $SiO_2/SiO_1$ multilayer film grown by ion beam sputtering deposition. Cs ion beam with a low energy and a grazing incidence angle was used in SIMS depth profiling analysis to obtain high depth resolution. Diffusion behavior of aluminum in the Al/Si and Al/Si QD interfaces was investigated by secondary ion mass spectrometry (SIMS) as a function of heat treatment temperature. It was found that aluminum is diffused into Si substrate at $450^{\circ}C$. In this presentation, the effect of heat treatment temperature and Si nitride diffusion barrier on the diffusion of Al will be discussed.