• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1705-1708
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• 2003

The purpose of this study is to investigate the manufacturing technique on the U type Draw-Bending of inner grooved tube. This bending process make the U shape tube by Hair Pin Bending machine. The U type tube requires the quality of product that satisfy sufficient conditions for a heat exchanger. The mandrel components act the important roles that prevent wrinkles and keep the shape of cross section of bended tube at bending process. We performed the FEM simulation using LS-DYNA software and the bending test of inner groove tube and then, compared bending simulation with bending test results about mandrel ball diameter, mandrel position and optimal clearance between mandrel and tube.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.224-225
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• 2000

Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.4
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• pp.64-69
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• 2018

This paper investigates the compressive deformation behavior of direct metal tooling (DMT), processing titanium alloy (Ti-6Al-4V) parts under high strain loading conditions. Split Hopkinson Pressure Bar (SHPB) experiments were performed to determine the flow stress and the coefficients of the Johnson-Cook model. This model is described as a function of strain, strain rate, and temperature. SHPB experiments were performed to characterize the deformation behavior of specimens made with 3D printers, using Ti-6Al-4V material under high temperature and dynamic loading.

• Journal of electromagnetic engineering and science
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• v.9 no.1
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• pp.32-37
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• 2009

Various Class-E CMOS power amplifiers for GSM applications are presented. A stage-convertible transformer for a dual mode power amplifier is proposed to increase efficiency in the low-output power region. An integrated passive device(IPD) process is used to reduce combiner losses. A split secondary 1:2 transformer with IPD process is designed to obtain efficient and symmetric power combining. A quasi-four-pair structure of CMOS PA is also proposed to overcome the complexities of power combining.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.05a
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• pp.289-294
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• 2001

This study reveals the thin sheet metal Process with multi-forming die that the name is progressive die, also high precision production part is made. They require analysis of many kinds of important factors, i.e. theory and practice of metal press working and its phenomena, die structure, machining condition for die making, die material, heat treatment of die components, know-how and so on. In this study, we designed and constructed a multi-forming progressive die as a bending working of multi-stage and peformed through the try out. Out of the characteristics of this paper that nothing might be ever seen before such as this type of research method on the all of processes of thin and high precision production part.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.33-35
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• 2016

This paper proposes a method utilizing image compression and transmission method for image segmentation in order to reduce the time required in the process of analyzing the image information that has in the image compression process. Many studies of existing with respect to the image segmentation are being studied as a way to split a lot of a particular part in the image. We divide full image into the N equal parts. And it is compressed using the field coding. This will reduce the time-consuming than using the conventional method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.93-94
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• 2005

Cu metallization using electrochemical plating(ECP) has played an important role in back end of line(BEOL) interconnect formation. In this work, we studied the optimized copper thickness using Bottom-up Gap-fill in Cu ECP, which is closely related with the pattern dependencies in Cu ECP and Cu dual damascene process at 0.13 ${\mu}m$ technology node. In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge, Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness.

• Transactions of Materials Processing
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• v.3 no.3
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• pp.291-301
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• 1994

In the simultaneous forward-backward extrusion the effects of some process variables including area reduction, stroke advance, materials(Al 2024 and commercial pure copper) on the extrusion load, plastic flow and height ratio of upper to lower extruded parts are experimentally investigated and analyzed. Grid-marking technique is employed to visualize the plastic flow. The influence of using split and original specimen on the extrusion load and height ratio is evaluated by experiments. Experimental results show that the plastic flow if oriented to the part of lower area reduction in the begining but it is usually variated during the overall process. The configurations of plastic deformation and plastic flow are dependent on the working materials and the lubricational conditions.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.8
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• pp.87-92
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• 2022

The Al3003 aluminum plate was cut by grinding, milling, sawing, and shearing, and the hard-anodizing surface of the material was investigated. Large burrs were formed during grinding and milling. The brittle anodized film split and migrated along the deformed aluminum surface. During shearing, the hard-anodized film on the blade entry surface cracks and slides along the deforming aluminum. The cutting heat increased the ductility of the aluminum and further promoted burr formation. The oil-based coolant suppressed burrs and prevented chips from sticking to the endmill. It is better to avoid the high cutting speed and slow material feed rate conditions, which increase the cutting temperature and burr in the band saw.

• Journal of Korea Multimedia Society
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• v.25 no.5
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• pp.670-675
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• 2022

This study proposes an improved binarization method to improve image recognition rate. The research goal is to minimize the information loss that occurs during the binarization process, and to transform the object of the original image that cannot be determined through the transformation process into an image that can be judged. The proposed method uses a stepwise segmentation method of an image and divides blocks using prime numbers. Also, within one block, a trapezoidal type of fuzzy is applied. The fuzzy trapezoid is binarized by dividing the brightness histogram area into three parts according to the degree of membership. As a result of the experiment, information loss was minimized in general images. In addition, it was found that the converted binarized image expressed the object better than the original image in the special image in which the brightness region was tilted to one side.