• Journal of Welding and Joining
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• 제27권1호
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• 한국품질경영학회:학술대회논문집
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• 한국품질경영학회 2004년도 품질경영모델을 통한 가치 창출
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• pp.298-301
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• 2004

European Union Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain mercury, cadmium, lead, hexavalent chromium, polybrominated biphenyls(PBB) or polybrominated diphenyl ethers(PBDE) (by Directive 2002/95/EC of The European Parliament and the Council of 27 january, 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment ). So, It is important to develop lead free solder and to assure the reliability of appliance. But lead free solder(i.e. Sn-3Ag-0.5Cu) have some problems such as lift off, whisker, migration and crack, etc. In this paper we discuss the reliability assurance method in lead free solder and appliance.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• 자원환경지질
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• 제39권1호
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• pp.9-25
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• 2006

백운 금-은광상은 트라이아스기 또는 쥐라기의 엽리상화강섬록암내에 발달된 단층대를 충진한 천열수성 석영맥광상이다. 이 광상의 광화작용은 단층-각력대에 수반되며 2시기로 구분된다. I시기는 다시 조기와 말기로 구분되며 주된 광화시기이다. II시기는 광화작용이 관찰되지 않는다. I시기 소기는 모암변질과 유비철석, 황철석, 자류철석, 섬아연석, 백철석, 황동석, 황석석 및 방연석이 관찰된다. I시기 말기는 금-은광물정출시기로 일렉트럼, 함은사면동석, 스테파나이트, 보울란제라이트, 농홍은석, 휘은석 , 시르메라이트, 자연은, Ag-Te -Sn-S계 광물, Ag-Cu-S계 광물, 황철석, 황동석 및 방연석이 관찰된다. 유체포유물 자료에 의하면, 광화 I시기의 균일화온도와 염농도는 각각 $171.6\~360.8^{\circ}C,\;0.5\~10.2\;wt.\%$로써 광화유체가 천수의 혼입에 의한 냉각과 희석이 있었음을 지시한다. 또한, 광화 I시기에 관찰되는 광물공생군으로부터 구한 생성온도(조기: $236\~>380^{\circ}C$, 말기: $<197\~272^{\circ}C$)와 황분압(조기: $>10^{-7.8}\;atm.,$ 말기: $10^{-14.2\~10^{-16}\;atm.$)이 광화작용이 진행됨에 따라 감소되어 진다. 황($2.4\~6.1\%_{\circ}$(조기=$3.4\~5.3\%_{\circ}$, 말기=$2.4\~6.1\%_{\circ}$)), 산소($4.5\~8.8\%_{\circ}$(석영: 조기=$6.3\~8.8\%_{\circ}$, 말기=$4.5\~5.6\%_{\circ}$)), 수소($-96\~-70\%_{\circ}$(석영: 조기=$-96\~-70\%_{\circ}$, 말기=$-78\~-74\%_{\circ}$, 방해석: 말기=$-87\~-76\%_{\circ}$)) 및 탄소($-6.8\~-4.6\%_{\circ}$(방해석: 말기)) 동위원소 값의 자료로 볼 때, 이 광상의 광화유체는 마그마 기원의 유체가 주종을 이룬 것으로 보이며 광화작용이 진행됨에 따라 기원이 다른 천수의 혼입이 작용한 것으로 해석할 수 있다.

• 한국생산제조학회지
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• 제23권3호
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 한국미생물·생명공학회지
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• 제20권2호
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• pp.150-155
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• 1992

토양 분리 균주로부터 얻은 배양액을 20-80 황산암모늄으로 분획한 후 세포의 cytosine deaminase의 성질을 검토하였다. 이 효소는 cytosine과 5-fluorocytosine(5-FC)에 기질 특이성을 가짐으로서 각각 uracil과 5-fluorouracil(5-FU)로 전환을 촉매하였다. 효소안정성에 대한 온도와 보존기간은 tris-HC1 완충용액에서 검토한 결과 최적온도는 $50^{\circ}C$ 부근이하에서 90 이상의 잔존활성을, 보존시간은 4일정도에서 80 이상의 잔존활성을 유지하였다. 최대 pH 8.0과 $37^{\circ}C$의 온도에서 나타났다. 활성에 적당한 pH는 8.0~8.5였고, 온도는 37~$45^{\circ}C$의 범위였다.

• 한국자동차공학회논문집
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• 제19권6호
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• pp.90-96
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• 2011

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

• 대한금속재료학회지
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• 제46권2호
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• 한국전기전자재료학회논문지
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• 제29권4호
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• pp.237-240
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• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.