• Title/Summary/Keyword: Slurry temperature

Search Result 391, Processing Time 0.024 seconds

Polishing Properties by Change of Slurry Temperature in Oxide CMP (산화막 CMP 공정에서 슬러리 온도 변화에 따른 연마 특성)

  • Ko, Pil-Ju;Park, Sung-Woo;Kim, Nam-Hoon;Seo, Yong-Jin;Lee, Woo-Sun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.18 no.3
    • /
    • pp.219-225
    • /
    • 2005
  • To investigate the effects of slurry temperature on the chemical mechanical polishing(CMP) performance of oxide film with silica and ceria slurries, we have studied slurry properties as a function of different slurry temperature. Also, the effects of each input parameter of slurry on the oxide CMP characteristics were investigated. The pH showed a slight tendency of decrease, the conductivity in slurries showed an increased tendency, the mean particle size in slurry decreased, and the zeta potential of slurry decreased with temperature. The removal rates significantly increased and maintained at the specific levels over 4$0^{\circ}C$. The better surface morphology of oxide films could be obtained at 40 $^{\circ}C$ of silica slurry and at 90 $^{\circ}C$ of ceria slurry. It is found that the CMP performance of oxide film could be significantly improved or controlled by change of slurry temperature.

Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis

  • Kim, Nam-Hoon;Seo, Yong-Jin;Ko, Pil-Ju;Lee, Woo-Sun
    • Transactions on Electrical and Electronic Materials
    • /
    • v.6 no.4
    • /
    • pp.164-168
    • /
    • 2005
  • Effects of high-temperature slurry were investigated on the chemical mechanical polishing (CMP) performance of tetra-ethyl ortho-silicate (TEOS) film with silica and ceria slurries by the surface analysis of X-ray photoelectron spectroscopy (XPS). The pH showed a slight tendency to decrease with increasing slurry temperature, which means that the hydroxyl $(OH^-)$ groups increased in slurry as the slurry temperature increased and then they diffused into the TEOS film. The surface of TEOS film became hydro-carbonated by the diffused hydroxyl groups. The hydro-carbonated surface of TEOS film could be removed more easily. Consequently, the removal rate of TEOS film improved dramatically with increasing slurry temperature.

Theoretical Analysis of Ignition of a Coal-Water Slurry Droplets with Interior Temperature Distribution (내부 온도분포를 고려한 Coal-Water Slurry의 점화현상에 관한 이론적 해석)

  • Choi, C.E.;Baek, S.W.;Kim, J.W.
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.17 no.7 s.94
    • /
    • pp.1823-1832
    • /
    • 1993
  • CWS(coal-water slurry) is used for application in power plants, boilers, industrial furnaces. A single coal-water slurry droplet ignition has been examined to reveal the basic nature of their evaporation, volatilization and heating processes. The interior droplet temperature distribution has been considered. The effect of coal thermal conductivity, droplet size, water fraction in the slurry, gas temperature and velocity and radiation on the ignition phenomena were also studied. Either increasing the velocity and gas temperature or decreasing the droplet size and water fraction in the slurry may reduce the time for evaporation and ignition delay time.

Effect of curing temperature on the properties of ground granulated blast furnace slag-cement bentonite slurry

  • Kim, Taeyeon;Lee, Bongjik;Hong, Seongwon
    • Geomechanics and Engineering
    • /
    • v.29 no.3
    • /
    • pp.237-247
    • /
    • 2022
  • To investigate the curing temperature effect on the engineering properties of ground granulated blast furnace slag-cement bentonite (GGBS-CB) slurry for cutoff walls, the laboratory experiments including the setting time, unconfined compressive strength, and permeability tests were carried out. The mixing procedure for GGBS-CB slurry was as follows: (1) montmorillonite-based bentonite slurry was first fabricated and hydrated for four hours, and (2) cement or GGBS with cement was added to the bentonite slurry. The dosage range of GGBS was from 0 to 90 % of cement by mass fraction. The GGBS-CB slurry specimens were cured and stored in environmental chamber at temperature of 14±1, 21±1, 28±1℃ and humidity of 95±2% until target days. The highest average temperature of three seasons in South Korea was selected and used for the tests. The experimental results indicated that in early age (less than 28 days) of curing the engineering properties of GGBS-CB slurry were primarily affected by the curing temperature, whereas the replacement ratio of GGBS became a main factor to determine the properties of the slurry as the curing time increased.

Study on Ammonia Emission Characteristic of Pig Slurry (양돈 슬러리의 암모니아 발생 특성에 관한 연구)

  • Lee S.H.;Yun N.K.;Lee K.W.;Lee I.B.;Kim T.I.;Chang J.T.
    • Journal of Animal Environmental Science
    • /
    • v.12 no.1
    • /
    • pp.7-12
    • /
    • 2006
  • Ammonia emission from swine production process originates from three major sources: manure storage facility, swine housing, and land application of manure. Most of the ammonia gas that are emitted from swine production operations is the by-product of aerobic or anaerobic decomposition of swine waste by microorganism. Knowing the ammonia emission rate is necessary to understand how management practices or alternative manure handling process could reduce impacts of this emission on the environment and neighbors. Ammonia gas emission from pig slurry is very difficult to predict because it is affected by many factors including wind speed of slurry surface, temperature or pH of the swine slurry, sort breed differences and classes, and diets. This study was carried out to effects of pH and temperature on ammonia gas emission from growing-finishing pig slurry. Treated far slurry in this study were pH and temperature. Results showed that pH of slurry variable changes 5, 6, 7, 8 upon an addition of NaOH and $HNO_3$, respectively. The temperature of the slurry which was contained in a water bath maintained at increasing levels ranging from 10 to $35^{\circ}C$. Ammonia emission rate of influenced pH and temperature such that the increase in pH or temperature resulted to an increase in ammonia emission. The ammonia gas was not detected at pH 5 and 6. Moreover, at a slurry of pH 8, the ammonia ranged from 28 to 60ppm and 8-29 ppm at slurry pH of 7 while temperature was 13 to $33^{\circ}C$. When slurry pH was>6, the ammonia emission was significantly increased according to rise in temperature in contrast to acid treatment of the pH. There was also a significantly increase in ammonia emission relative to slurry pH of 7 to 8. The above findings showed that to effectively reduce ammonia emission from slurry of growing-finishing pigs, the pH and temperature should be maintained a low levels.

  • PDF

Thermal properties of latent heat storage microcapsule-water slurry

  • Mun, Soo-Beom
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.39 no.8
    • /
    • pp.807-812
    • /
    • 2015
  • A microcapsule water slurry is a latent heat-storage material having a low melting point. In this study, the thermal properties of a microcapsule water slurry are measured. The physical properties of the test microcapsule water slurry, i.e., thermal conductivity, specific heat, latent heat, and density, are measured, and the results are discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). It is clarified that Eucken's equation can be applied to the estimation of the thermal conductivity of the microcapsule water slurry. Useful correlation equations of the thermal properties of the microcapsule water slurry are proposed in terms of the temperature and concentration ratio of the microcapsule water slurry constituents.

Characteristic of Oxide CMP with the Various Temperatures of Silica Slurry (실리카 슬러리의 온도 변화에 따른 산화막의 CMP 특성)

  • Ko, Pil-Ju;Park, Sung-Woo;Kim, Nam-Hoon;Seo, Yong-Jin;Chang, Eui-Goo;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2004.11a
    • /
    • pp.707-710
    • /
    • 2004
  • Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). In this paper, we have investigated slurry properties and CMP performance of silicon dioxide (oxide) as a function of different temperature of slurry. Thermal effects on the silica slurry properties such as pH, particle size, conductivity and zeta potential were studied. Moreover, the relationship between the removal rate (RR) with WIWNU and slurry properties caused by changes of temperature were investigated. Therefore, the understanding of these temperature effects provides a foundation to optimize an oxide CMP Process for ULSI multi-level interconnection technology.

  • PDF

Enhancement of Convective Heat Transfer by Using a Micro-Encapsulated Phase-Change-Material Slurry (피복된 미립 상변화물질 슬러리를 이용한 대류 열전달의 향상에 관한 연구)

  • Jung, Dong-Ju;Choi, Eun-Soo
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.24 no.9
    • /
    • pp.1277-1284
    • /
    • 2000
  • To enhance heat transfer characteristics of water, micro-encapsulated octadecane of about $10{\mu}m$ diameter was added to water. Viscosity of the slurry was measured by using a capillary tube viscometer. The measured viscosity decreased as the temperature of the slurry increased, and it increased as the fraction of the capsules in the slurry increased. Thermal characteristics of the octadecane were studied by using a differential scanning calorimeter. The melting temperature and the melting energy of the octadecane were found to be $28.6^{\circ}$ and 34.4kcal/kg, respectively. The convective heat transfer characteristics of the slurry were investigated in a flow loop with a constant heat flux test section. Friction factor of the slurry flow was found to be similar to the expected curve by Petukhov. The Nusselt number of the slurry flow was highest when the octadecane melted. Effective thermal capacity of the 14.2% slurry was found to have 1.67 times of the thermal capacity of water.

Effects of Temperature on Removal Rate in Cu CMP (Cu CMP에서 온도가 재료 제거율에 미치는 영향)

  • Park, In-Ho;Lee, Da-Sol;Jeong, Seon-ho;Jeong, Hae-do
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.17 no.6
    • /
    • pp.91-97
    • /
    • 2018
  • Chemical mechanical polishing(CMP) realizes a surface planarity through combined mechanical and chemical means. In CMP process, Preston equation is known as one of the most general approximation of the removal rate. Effects of pressure and relative speed on the mechanical property of Cu CMP has been investigated. On the other hand, The amount of abrasion also increased with changes in pressure and speed, resulting in a proportional increase of temperature during CMP. Especially this temperature is an important factor to change chemical reaction in a Cu CMP. However, when the slurry temperature became higher than $70^{\circ}C$, the removal rate went lower due to abrasives aggregation and scratching occurred on the Cu film. Therefore, it was found that the slurry temperature should not exceed $70^{\circ}C$ during Cu CMP. Finally, authors could increase the pressure, speed and slurry temperature up to a ceratin level to improve the removal rate without surface defects.

Microstructural Evolution during Isothermal Heating and Thixoformability of Mg-5%Al Alloy (Mg-5%Al합금의 등온가열에 따른 미세조직변화 및 반응고 성형성)

  • Kim, Jeong-Min;HwangBo, Hyun-Seok;Kim, Ki-Tae;Jung, Woon-Jae
    • Journal of Korea Foundry Society
    • /
    • v.21 no.4
    • /
    • pp.246-252
    • /
    • 2001
  • Variation in the microstructure of Mg-5%Al semi-solid slurry during isothermal heating was investigated in relation to initial microstructure, holding time, and holding temperature. Specimens with three different initial microstructures were isothermally heated. Dendritic structure in as-cast ingot was decomposed into solid globules in the semi-solid slurry during isothermal holding, while in the recrystallized specimens prepared by extrusion or rolling the size of solid particles was continuously increased during the heating. Effects of mold temperature and liquid fraction of slurry on the mold filling ability were also studied. Very thin section (0.4 mm) could be successfully filled up to 50 mm by 60% liquid slurry when the mold was heated to $600^{\circ}C$.

  • PDF