• 제목/요약/키워드: Slurry temperature

검색결과 391건 처리시간 0.02초

산화막 CMP 공정에서 슬러리 온도 변화에 따른 연마 특성 (Polishing Properties by Change of Slurry Temperature in Oxide CMP)

  • 고필주;박성우;김남훈;서용진;이우선
    • 한국전기전자재료학회논문지
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    • 제18권3호
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    • pp.219-225
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    • 2005
  • To investigate the effects of slurry temperature on the chemical mechanical polishing(CMP) performance of oxide film with silica and ceria slurries, we have studied slurry properties as a function of different slurry temperature. Also, the effects of each input parameter of slurry on the oxide CMP characteristics were investigated. The pH showed a slight tendency of decrease, the conductivity in slurries showed an increased tendency, the mean particle size in slurry decreased, and the zeta potential of slurry decreased with temperature. The removal rates significantly increased and maintained at the specific levels over 4$0^{\circ}C$. The better surface morphology of oxide films could be obtained at 40 $^{\circ}C$ of silica slurry and at 90 $^{\circ}C$ of ceria slurry. It is found that the CMP performance of oxide film could be significantly improved or controlled by change of slurry temperature.

Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis

  • Kim, Nam-Hoon;Seo, Yong-Jin;Ko, Pil-Ju;Lee, Woo-Sun
    • Transactions on Electrical and Electronic Materials
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    • 제6권4호
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    • pp.164-168
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    • 2005
  • Effects of high-temperature slurry were investigated on the chemical mechanical polishing (CMP) performance of tetra-ethyl ortho-silicate (TEOS) film with silica and ceria slurries by the surface analysis of X-ray photoelectron spectroscopy (XPS). The pH showed a slight tendency to decrease with increasing slurry temperature, which means that the hydroxyl $(OH^-)$ groups increased in slurry as the slurry temperature increased and then they diffused into the TEOS film. The surface of TEOS film became hydro-carbonated by the diffused hydroxyl groups. The hydro-carbonated surface of TEOS film could be removed more easily. Consequently, the removal rate of TEOS film improved dramatically with increasing slurry temperature.

내부 온도분포를 고려한 Coal-Water Slurry의 점화현상에 관한 이론적 해석 (Theoretical Analysis of Ignition of a Coal-Water Slurry Droplets with Interior Temperature Distribution)

  • 최창은;백승욱;김종욱
    • 대한기계학회논문집
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    • 제17권7호
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    • pp.1823-1832
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    • 1993
  • CWS(coal-water slurry) is used for application in power plants, boilers, industrial furnaces. A single coal-water slurry droplet ignition has been examined to reveal the basic nature of their evaporation, volatilization and heating processes. The interior droplet temperature distribution has been considered. The effect of coal thermal conductivity, droplet size, water fraction in the slurry, gas temperature and velocity and radiation on the ignition phenomena were also studied. Either increasing the velocity and gas temperature or decreasing the droplet size and water fraction in the slurry may reduce the time for evaporation and ignition delay time.

Effect of curing temperature on the properties of ground granulated blast furnace slag-cement bentonite slurry

  • Kim, Taeyeon;Lee, Bongjik;Hong, Seongwon
    • Geomechanics and Engineering
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    • 제29권3호
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    • pp.237-247
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    • 2022
  • To investigate the curing temperature effect on the engineering properties of ground granulated blast furnace slag-cement bentonite (GGBS-CB) slurry for cutoff walls, the laboratory experiments including the setting time, unconfined compressive strength, and permeability tests were carried out. The mixing procedure for GGBS-CB slurry was as follows: (1) montmorillonite-based bentonite slurry was first fabricated and hydrated for four hours, and (2) cement or GGBS with cement was added to the bentonite slurry. The dosage range of GGBS was from 0 to 90 % of cement by mass fraction. The GGBS-CB slurry specimens were cured and stored in environmental chamber at temperature of 14±1, 21±1, 28±1℃ and humidity of 95±2% until target days. The highest average temperature of three seasons in South Korea was selected and used for the tests. The experimental results indicated that in early age (less than 28 days) of curing the engineering properties of GGBS-CB slurry were primarily affected by the curing temperature, whereas the replacement ratio of GGBS became a main factor to determine the properties of the slurry as the curing time increased.

양돈 슬러리의 암모니아 발생 특성에 관한 연구 (Study on Ammonia Emission Characteristic of Pig Slurry)

  • 이성현;윤남규;김경원;이인복;김태일;장진택
    • 한국축산시설환경학회지
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    • 제12권1호
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    • pp.7-12
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    • 2006
  • 본 연구에서는 육성 비육돈 슬러리를 이용하여 슬러리의 환경조건에 따라 슬러리로 부터의 암모니아 발생 특성을 분석코자 하였다. 슬러리의 온도와 pH를 조절하여 슬러리로부터 발생하는 암모니아 농도를 측정 분석한 결과 슬러리의 온도가 높을수록 슬러리로 부터 발생하는 암모니아 농도는 급격히 증가하는 것으로 나타났고, 슬러리의 pH를 5, 6, 7, 8의 4수준으로 조절하여 각각의 온도에 따라 발생하는 암모니아 농도를 측정한 결과 pH 5, 6에서는 암모니아 가스가 검출되지 않았으나 pH 7, 8에서는 많은 양의 암모니아 가스가 검출되었고 양돈 슬러리의 pH가 높을수록 발생하는 암모니아 가스가 많이 발생하는 것으로 분석되었다. 본 연구결과 슬러리의 온도를 낮추어 주거나 슬러리의 pH를 낮춤으로써 슬러리로부터 발생하는 악취가스를 크게 줄일 수 있을 것으로 판단되었다.

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Thermal properties of latent heat storage microcapsule-water slurry

  • Mun, Soo-Beom
    • Journal of Advanced Marine Engineering and Technology
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    • 제39권8호
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    • pp.807-812
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    • 2015
  • A microcapsule water slurry is a latent heat-storage material having a low melting point. In this study, the thermal properties of a microcapsule water slurry are measured. The physical properties of the test microcapsule water slurry, i.e., thermal conductivity, specific heat, latent heat, and density, are measured, and the results are discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). It is clarified that Eucken's equation can be applied to the estimation of the thermal conductivity of the microcapsule water slurry. Useful correlation equations of the thermal properties of the microcapsule water slurry are proposed in terms of the temperature and concentration ratio of the microcapsule water slurry constituents.

실리카 슬러리의 온도 변화에 따른 산화막의 CMP 특성 (Characteristic of Oxide CMP with the Various Temperatures of Silica Slurry)

  • 고필주;박성우;김남훈;장의구;서용진;이우선
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.707-710
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    • 2004
  • Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). In this paper, we have investigated slurry properties and CMP performance of silicon dioxide (oxide) as a function of different temperature of slurry. Thermal effects on the silica slurry properties such as pH, particle size, conductivity and zeta potential were studied. Moreover, the relationship between the removal rate (RR) with WIWNU and slurry properties caused by changes of temperature were investigated. Therefore, the understanding of these temperature effects provides a foundation to optimize an oxide CMP Process for ULSI multi-level interconnection technology.

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피복된 미립 상변화물질 슬러리를 이용한 대류 열전달의 향상에 관한 연구 (Enhancement of Convective Heat Transfer by Using a Micro-Encapsulated Phase-Change-Material Slurry)

  • 정동주;최은수
    • 대한기계학회논문집B
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    • 제24권9호
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    • pp.1277-1284
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    • 2000
  • To enhance heat transfer characteristics of water, micro-encapsulated octadecane of about $10{\mu}m$ diameter was added to water. Viscosity of the slurry was measured by using a capillary tube viscometer. The measured viscosity decreased as the temperature of the slurry increased, and it increased as the fraction of the capsules in the slurry increased. Thermal characteristics of the octadecane were studied by using a differential scanning calorimeter. The melting temperature and the melting energy of the octadecane were found to be $28.6^{\circ}$ and 34.4kcal/kg, respectively. The convective heat transfer characteristics of the slurry were investigated in a flow loop with a constant heat flux test section. Friction factor of the slurry flow was found to be similar to the expected curve by Petukhov. The Nusselt number of the slurry flow was highest when the octadecane melted. Effective thermal capacity of the 14.2% slurry was found to have 1.67 times of the thermal capacity of water.

Cu CMP에서 온도가 재료 제거율에 미치는 영향 (Effects of Temperature on Removal Rate in Cu CMP)

  • 박인호;이다솔;정선호;정해도
    • 한국기계가공학회지
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    • 제17권6호
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    • pp.91-97
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    • 2018
  • Chemical mechanical polishing(CMP) realizes a surface planarity through combined mechanical and chemical means. In CMP process, Preston equation is known as one of the most general approximation of the removal rate. Effects of pressure and relative speed on the mechanical property of Cu CMP has been investigated. On the other hand, The amount of abrasion also increased with changes in pressure and speed, resulting in a proportional increase of temperature during CMP. Especially this temperature is an important factor to change chemical reaction in a Cu CMP. However, when the slurry temperature became higher than $70^{\circ}C$, the removal rate went lower due to abrasives aggregation and scratching occurred on the Cu film. Therefore, it was found that the slurry temperature should not exceed $70^{\circ}C$ during Cu CMP. Finally, authors could increase the pressure, speed and slurry temperature up to a ceratin level to improve the removal rate without surface defects.

Mg-5%Al합금의 등온가열에 따른 미세조직변화 및 반응고 성형성 (Microstructural Evolution during Isothermal Heating and Thixoformability of Mg-5%Al Alloy)

  • 김정민;황보현석;김기태;정운재
    • 한국주조공학회지
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    • 제21권4호
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    • pp.246-252
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    • 2001
  • Variation in the microstructure of Mg-5%Al semi-solid slurry during isothermal heating was investigated in relation to initial microstructure, holding time, and holding temperature. Specimens with three different initial microstructures were isothermally heated. Dendritic structure in as-cast ingot was decomposed into solid globules in the semi-solid slurry during isothermal holding, while in the recrystallized specimens prepared by extrusion or rolling the size of solid particles was continuously increased during the heating. Effects of mold temperature and liquid fraction of slurry on the mold filling ability were also studied. Very thin section (0.4 mm) could be successfully filled up to 50 mm by 60% liquid slurry when the mold was heated to $600^{\circ}C$.

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