• Journal of Animal Environmental Science
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• v.4 no.1
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• pp.63-71
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• 1998

The dramatic increase in both swine and cattle production in Korea has presented problems related to protection of water resources. Animal wastes are a potentially valuable source of plant nutrients. Modern liquid waste management plans for a livestock housing need to focus on the slurry aeration and composting control methods and cost effective equipments. Recent developments in the animal manure liquid composting make it possible to improve the manure more easier to handle, reduce the odorous, labors and bedding materials, kill the weed seeds etc. However, there are some disadvantages, the aerator consumes much electrical power and initial cost is high. To solve these problems, this study is intended to develop a key points such as slurry aeration and dilution, liquid waste composting equipments.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.150-153
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• 2007

Apply electromagnetic stirring system to making rheology slurry of Al7075. This experiment has important element which is the relation between solid fraction percent and melt temperature of Al7075. The rheology slurry of Al7075 eliminated liquid phase to include alloying element of copper and zinc by squeeze casting process. In result the most structure was composed entirely of globular primary $\alpha$. Used this material for this study. This study made a comparison of mechanical property according to heat treatment T6 at each melt temperature ($619^{\circ}C$ and $615^{\circ}C$). The microstructure and component are observed how heat treatment T6 weight with the mechanical property by SEM-EDS.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.720-727
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• 2004

In the process of ice-slurry making, the phenomenon of ice adhesion influences extremely to ice making system. In this study, the effect on the ice adhesion by thermal storage material with additives is investigated quantitatively. Various solutions of 300 g in a stainless vessel were frozen under stirring. Through the experiment the ice adhesion between cooling wall and ice-slurry was compared with each other by measuring the stirring power. From the experiment, the stirring power in EG, SCA solution was smaller than those in the solution containing functional materials, such as poly-vinyl-alcohol or kitchen detergent.

• Korean Journal of Organic Agriculture
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• v.10 no.2
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• pp.1-28
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• 2002

Regarding the dangers to soil, water and air, which come from current agricultural application measures for nitrogen, a sectoral approach for a non-polluting liquid manure utilization cannot be used any longer. Slurry was not any longer considered as a tiresome waste produced of animal husbandry, but as a valuable fertilizer. The goal of the largest possible utilization of slurry on the farm was and still is in the foreground, An Integrated system approach has to be found. leading to a drastic improvement of nutrient utilization and hence to a considerably reduced nutrient use. This can only be expected, if the organic manure can be applicated at times, when losses through leaching and volatilization can be minimized. The necessary investments for such concepts can clearly be reduced through cooperation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1296-1300
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• 2004

SnO$_2$ is one of the most suitable gas sensor materials. The microstructure and surface morphology of films must be controlled because the electrical and optical properties of SnO$_2$ films depend on these characteristics. The effects of chemical mechanical polishing(CMP) on the variation of morphology of SnO$_2$ films prepared by RF sputtering system were investigated. The commercially developed ceria-based oxide slurry, silica-based oxide slurry, and alumina-based tungsten slurry were used as CMP slurry. Non-uniformities of all slurries met stability standards of less than 5 %. Silica slurry had the highest removal rate among three different slurries, sufficient thin film topographies and suitable root mean square(RMS) values.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.125-128
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• 2004

Chemical Mechanical Polishing(CMP) in semiconductor production is characterized its output property by Removal Rate(RR) and Non-Uniformity(NU). Some Previous works shows that RR is determined by production of pressure and velocity and NC is also largely affected by velocity of flow-field during CMP. This study is about the direct measurement of velocity of slurry during CMP and reconstruction whole flow-field by Particle Image Velocimetry(PIV) Techniques. Typical PIV system is tuned adequately for inspecting CMP and Slurry Flow-field is measured by changing both Pad RPM and Carrier RPM. The results show that velocity is majorly determined not by Carrier RPM, but by Pad RPM.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.4
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• pp.618-623
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• 2004

This paper has dealt with the heat storage characteristics of gel type micro size latent heat storage material slurry. The heat release operation to the gel type micro size latent heat storage material slurry was carried out using hot air bubbles by direct contact heat exchange. This experiment was carried out using phase change material of n-paraffin so the heat release amount is higher than cold water system. The parameters of this experiment were concentration of latent heat phase change material, height of heat release bath and inlet velocity of hot air. The main results obtained are as follows : (1) The effect of concentration of latent heat phase change material dispersed with water is very affective to the direct contact heat exchange between hot air and gel type micro size latent heat storage material slurry. (2) It is clarified that the most effective concentration of latent heat phase change material dispersed with water exists around 20mass% at this type of direct heat exchange model experiment.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.7
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• pp.596-602
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• 2006

Ice adhesion and blockage problems have been issued in continuous ice slurry making process. So we composed continuous ice slurry making device using a commercial small plate heat exchanger (PHX), and investigated character of ice formation. An experiment of ice formation was peformed with an aqueous solution of ethylene glycol 7 mass%. In the experiment, the effect of the pressurization on ice slurry formation during the cooling process was investigated. The pressurization test for the aqueous solution was performed by setting valves at the PHX inlet and outlet. At the results, the time of continuous ice formation increased as the pressure of the plate heat exchanger increased for cooling temperature of $-5^{\circ}C$. Also continuous ice formation at the cooling temperature of $-7^{\circ}C$ showed a possibility. It was found that the pressurization may contribute to suppress the dissolution of supercooled aqueous solution in the PHX.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.163-166
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• 2006

The dishing and the erosion were evaluated on the tungsten CMP process with conventional and new developed slurry. The tungsten thin film was polished by orbital polishing equipment. Commercial pattern wafer was used for the evaluation. Both slurries were pre tested on the oxide region on the wafer surface and the removal rate was not different very much. At the pattern density examination, the erosion performance was increased at all processing condition due to the reduction of thickness loss in new slurry. However, the dishing thickness was not remarkably changed at high pattern density despite of the improvement at low pattern density. At the large pad area, the reduction of dishing thickness was clearly found at new tungsten slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.118-118
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• 2008

The oxide CMP has been applied to interlayer dielectric(ILD) and shallow trench isolation (STI) in chip fabrication. Recently the slurry used in oxide CMP being changed from silica slurry to ceria (cerium dioxide) slurry particularly in STI CMP, because the material selectivity of ceria slurry is better than material selectivity of silica slurry. Moreover, the ceria slurry has good a planarization efficiency, compared with silica slurry. However ceria abrasives make a material removal rate too high at the region of wafer center. Then we focuses on why profile of material removal rate is convex. The material removal rate sharply increased to 3216 $\AA$/min by $4^{th}$ run without conditioning. After $4^{th}$ run, material removal rate converged. Furthermore, profile became more convex during 12 run. And average material removal rate decreased when conditioning process is added to end of CMP process. This is due to polishing mechanism of ceria. Then the ceria abrasive remains at the pad, in particular remains more at wafer center contacted region of pad. The field emission scanning electron microscopy (FE-SEM) images showed that the pad sample in the wafer center region has a more ceria abrasive than in wafer outer region. The energy dispersive X-ray spectrometer (EDX) verified the result that ceria abrasive is deposited and more at the region of wafer center. Therefore, this result may be expected as ceria abrasives on pad surface causing the convex profile of material removal rate.