• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2001.07a
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• pp.287-292
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• 2001

• Proceedings of the SAREK Conference
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• 2004.06a
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• pp.222-222
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• 2004

• Corrosion Science and Technology
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• v.22 no.4
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• pp.252-256
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• 2023

The galvanostatic polarization technique was used to accelerate corrosion in high chromium cast iron (HCCI) immersed in a simulated slurry solution of 0.1 mol dm^-3 H₂SO₄, 0.05 mol dm^-3 HCl, and 10 wt% SiC. The HCCI contained 27 wt% of Cr and 2.8 wt% of C, and its microstructure mainly comprised austenitic and carbide phases. A two-electrode system using a dense carbon rod and the HCCI sample was employed for the galvanostatic polarization by applying an anodic current for 24 hours. The corrosion rate increased upon applying the anodic current, but the increase was not significant, particularly for current densities higher than 10 µA cm^-2. Following polarization, the corrosion morphology revealed that the anodic current accelerated surface corrosion in the HCCI; however while the depth of the corroded area increased, the increase was not substantial. The propagation behavior of the anodic current and its impact on corrosion were further discussed.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2004.05a
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• pp.201-204
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• 2004

• Proceedings of the Korean Society of Rheology Conference
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• 2001.09a
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• pp.160.4-160
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• 2001

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.111.2-111.2
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• 2010

삼상슬러리 기포탑 반응기의 설계 및 Scale-up을 위하여 기포탑의 직경변화에 따른 기체-슬러리 계면에서의 물질전달 현상의 Similarity를 검토하고, 기체-슬러리 계면에서의 물질전달 현상과 슬러리 기포탑 반응기의 운전변수 및 반응물들의 물성들과의 연관성을 고찰하기 위하여 삼상슬러리 기포탑의 물질전달계(System)에서 주요 파라메타를 도출하였으며, 이들 파라메터들을 이용하여 슬러리 기포탑반응기의 물질전달 Scaling을 검토하였다. 물질전달계의 주요제어인자로는 기체-액체 부피물질전달계수($k_La$), 슬러리상의 확산도($D_{SL}$), 기포탑의 직경(D), 기포탑 반응기에 유입되는 기체의 유입속도($U_G$), 기포탑 반응기 내부의 연속상인 슬러리상의 표면장력(${\sigma}_{SL}$), 슬러리상과 기체상간의 밀도차(${\rho}_{SL}-{\rho}_G$) 그리고 슬러리상의 점도(${\mu}_{SL}$)등 슬러리 상의 물성을 선정하였으며 중력가속도(g)를 선정하였다. 물질전달계의 Scling을 검토하기위하여 이를 재구성하였으며 기포탑 반응기의 구조와 직경이 변화함에 따라 이들 무차원군의 변화양상을 고찰하였다. 실험적으로 측정된 물질전달계수와 Scaling에 의해 예측된 물질전달계수를 비교 검토함으로써 본 연구의 Correlation의 적용범위를 제시하였다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.4
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• pp.549-559
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• 1999

An experimental study was peformed to measure the viscosity of microencapsulated PCM slurries as the functions of its concentration and temperature, and also influence to its fluid dynamics. For the viscosity measurement, a rotary type viscometer, which was equipped with temperature control system, was adopted. The slurry was mixed with water and Sodium Lauryl Sulphate as a surfactant by which its suspended particles were dispersed well without the segregation of particles during the experiment. The viscosity was increased as the concentration of MicroPCM particle added. The surfactant increased 5% of the viscosity over the working fluid without particles. Experiments were proceeded by changing parameters such as PCM particles'concentration as well as the temperature of working fluid. As a result, a model to the functions of temperature for the working fluid and its particle concentration is proposed. The proposed model, for which its standard deviation shows 0.8068, is agreed well with the reference's data. The pressure drop was measured by U-tube manometer, and then the friction factor was obtained. It was noted that the pressure drop was not influenced by the state of PCM phase, that is solid or liquid in its core materials at their same concentration. On the other hand, it was described that the pressure drop of the slurry was much increased over the working fluid without particles. A friction factor was placed on a straight line in all working fluids of the laminar flow regardless of existing particles as we expected.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.1
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• pp.12-16
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• 2005

Chemical mechanical polishing (CMP) process is one of the most useful methods for improving the surface roughness of films. The effects of CMP on the surface morphology of WO$_3$ films prepared by RF sputtering system were investigated in this paper. A removal rate of films increased, and the uniformity performance of surface decreased with the addition of an oxidizer to the tungsten slurry. Non-uniformity performance of surface was superior as its value was below 5 % when oxidizers of 5.0 vol% and 2.5 vol%, respectively, were added to the tungsten slurry. The optimized oxidizer concentration, reflected both the improved roughness values and hillock-free surface with the good uniformity performance, was 5.0 vol% as an atomic force microscopy(AFM) analysis of thin film topographies. Our CMP results will be a useful reference for advanced technology of thin films for gas sensor applications in the near future.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.254-258
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• 2005

Semisolid process is possible in any material system possessing a freezing range where the microstructure should consist of the nondendritic globular solid phase separated and enclosed by the liquid phase, referred to as semisolid slurry. There are two primary semisolid processing routes, thixocasting and rheocasting. Especially, rheocasting process has become a new focus in the field of semisolid process because of its many advantages such as no special billet required and possibility of in-house scrap recycling, compared with the thixocasting process. In-Ladle direct thermal control (DTC) rheocasting has been developed, based on the fact that there is slurry and mush transition in every molten metal and the transition, which normally occurs in the range of liquid traction of 0.1 to 0.6, could be controlled by controlling solid shape and relative solid-liquid interfacial energy. In this study, A356 Al alloy was investigated to verify In-Ladle DTC rheocasting for obtaining semisolid slurry. Modeling of heat transfer was carried out to investigate the effect of pouring temperature and ladle material, geometry and temperature and the simulation results were compared with the actual experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.563-564
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• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A diamond disk use during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In. this study, we characterized diamond disk with 9 kinds of sample.