• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.7
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• pp.341-349
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• 2017

Formation and transportation of $CO_2$-hydrate slurry was conducted by circulating saturated water with $CO_2$ through a double-tube type heat exchanger which was cooled down by brine. The inner diameter and circulation length of the heat exchanger were 1 inch and 20 m, respectively. Water in tank was supersaturated by injected $CO_2$ and the operation pressure was maintained at 3,000 to 4,000 kPa with fluid-temperature of less than $9^{\circ}C$. $CO_2$ hydrate mass fraction was calculated based on density of $CO_2$-hydrate slurry mixture. Results showed that the $CO_2$-hydrate slurry could be circulated without blockage for 1 hr. Circulation status of the $CO_2$-hydrate slurry was also visualized.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.101-108
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• 2022

Centrifugal pumps are typically used in many slurry industries to transport solid materials. Solid particles in the slurry frequently shock the walls inside the pump, significantly abrading the flow path. Wear damage causes replacement of the pump components, which wastes manpower and time. Therefore, previous studies have been conducted on factors to improve efficiency and life time. This study identifies trends in pumps supplying lime to desulfurized devices from thermal power plants. The shear stress transport(SST) model is used to determine the erosion trend of the centrifugal pump that transfers lime slurry. The purpose of this study is to identify efficiency and erosion trends by selecting three of the various impeller design elements. The three impeller blade design variables mentioned above represent the inlet draft angle and blade angle of leading edge(L.E) and trailing edge(T.E). The maximum value of the erosion density rate tends to be similar to the Input power.

• Journal of Powder Materials
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• v.15 no.4
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• pp.271-278
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• 2008

Sintering behavior of iron nanopowder agglomerate compact prepared by slurry compaction method was investigated. The Fe nanopowder agglomerates were prepared by hydrogen reduction of spray dried agglomerates of ball-milled $Fe_2O_3$ nanopowder at various reduction temperatures of $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$, respectively. It was found that the Fe nanopowder agglomerates produced at higher reduction temperature have a higher green density compact which consists of more densified nanopowder agglomerates with coarsed nanopowders. The sintering behavior of the Fe nanopowder agglomerates strongly depended on the powder packing density in the compact and microstructure of the agglomerated nanopowder. It was discussed in terms of two sintering factors affecting the entire densification process of the compact.

• Journal of the Korean Ceramic Society
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• v.34 no.4
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• pp.394-398
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• 1997

Mn-Zn ferrite powders were prepared by alcoholic dehydration, using coprecipitation method. Then the effects of organic dispersant and polymeric binder concentration on stability and casting of slurry were discussed. Citric acid, the organic dispersant and polyvinylacohol(PVA), the non-ionic binder, were selected as additives of slurry. With variation of concentration of water, citric acid and polyvinylalcohol(PVA), optimum forming conditions were determined from viscosity and density. To compare with dry process, density and microstructure of sintered body formed by uniaxial die pressing were observed.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.50.1-50
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• 2001

Dynamic optimization with partially structured model in a slurry-phase HDPE reactor is implemented by the modified hierarchical dynamic optimization. Optimal trajectories of MI and density of HDPE are calculated as controlled variables and optimal profiles of the concentrations of ethylene, hydrogen and comonomer are calculated as manipulated variables in dynamic optimization. MI, density, the concentrations of ethylene, hydrogen and comonomer are used as controlled variables and flow rates of ethylene, hydrogen and comonomer are sued as manipulated variables in control implementation. Two-level hierarchical method is applied in dynamic optimization to reduce computation time. In the upper level formulation ...

• Journal of the Korean Ceramic Society
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• v.53 no.5
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• pp.557-562
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• 2016

Pyrophyllite granule powders for thermal spray coating were successfully prepared through spray drying process. To produce a stable slurry, commercial pyrophyllite powder of $45{\mu}m$ in size was ball-milled for reduction of the size to $2{\sim}3{\mu}m$ and a dispersant was added to control the viscosity. Dense and spherical granules (average granule size : $59{\mu}m$) were prepared under conditions of 12,500 rpm for rotation velocity of the atomizer and 100 cps for slurry viscosity. The granules were then heat treated at $1,200^{\circ}C$ for proper handling strength and flow properties. The final granules had an apparent density of $0.725g/cm^3$ and a flow rate of 2.5 g/sec, which represent excellent properties to be used as the granule powder for thermal spray coatings.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2001.07a
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• pp.287-292
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.29-29
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• 1999

• Transactions on Electrical and Electronic Materials
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• v.3 no.4
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• pp.5-9
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• 2002

Chemical mechanical polishing (CMP) has become the preferred planarization method for multilevel interconnect technology due to its ability to achieve a high degree of feature level planarity. Especially, to achieve the higher density and greater performance, shallow trench isolation (STI)-CMP process has been attracted attention for multilevel interconnection as an essential isolation technology. Also, it was possible to apply the direct STI-CMP process without reverse moat etch step using high selectivity slurry (HSS). In this work, we determined the process margin with optimized process conditions to apply HSS STI-CMP process. Then, we evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions. The wafer-to-wafer thickness variation and day-by-day reproducibility of STI-CMP process after repeatable tests were investigated. Our experimental results show, quite acceptable and reproducible CMP results with a wafer-to-wafer thickness variation within 400$\AA$.