• Journal of Institute of Control, Robotics and Systems
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• v.15 no.2
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.906-908
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• 2009

AVI (Automatic Vision Inspection) systems automatically detect defect features and measure their sizes via camera vision. It is important to predict the performance of an AVI to meet customer's specification in advance. Also the prediction can indicate the level of current performance of an AVI system. In this paper, we propose a statistical method for prediction of false alarm rate regarding inconsistency of defect size measurement process. For this purpose, only simple experiments are needed to measure the defect sizes for certain number of times. The statistical features from the experiment are utilized in the prediction process. Therefore, the proposed method is swift and easy to implement and use. The experiment shows a close prediction compared to manual inspection results.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.64-66
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• 2005

In this paper, some automatic inspection algorithms for LCD module are suggested. Human eyes are very good for the inspection in many industrial areas. However, very bright LCD back lighting may cause permanent damage to the human eyes. Also, the growing size of the LCD make it more difficult for the human inspectors. Therefore, using camera set, automatic inspection process becomes very essential for the future LCD industry.

• Journal of Mechanical Science and Technology
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• v.17 no.5
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• pp.629-636
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• 2003

This paper introduces the developed geometry PIG (Pipeline Inspection Gauge), one of several ILI (In-Line Inspection) tools, which provide a full picture of the pipeline from only single pass, and has compact size of the electronic device with not only low power consumption but also rapid response of sensors such as calipers, IMU and odometer. This tool is equipped with the several sensor systems. Caliper sensors measure the pipeline internal diameter, ovality and dent size and shape with high accuracy. The IMU (Inertial Measurement Unit) measures the precise trajectory of the PIG during its traverse of the pipeline. The IMU also provide three-dimensional coordination in space from measurement of inertial acceleration and angular rate. Three odometers mounted on the PIG body provide the distance moved along the line and instantaneous velocity during the PIG run. The datum measured by the sensor systems are stored in on-board solid state memory and magnetic tape devices. There is an electromagnetic transmitter at the back end of the tool, the transmitter enables the inspection operators to keep tracking the tool while it travels through the pipeline. An experiment was fulfilled in pull-rig facility and was adopted from Incheon LT (LNG Terminal) to Namdong GS (Governor Station) line, 13 km length.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• Journal of Korea Society of Digital Industry and Information Management
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• v.15 no.4
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• pp.63-70
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• 2019

The subject of the simultaneous measuring system of base pattern and deposition pattern is a new research topic on a defect inspection of OLED. In this paper, we propose a new OLED inspection method that simultaneously measures standard and deposition pattern images. This method reduces unnecessary processes and tac time during OLED inspection. For an additional reduction of the tac time during pattern measurement, the ROI was configured to measure only in the designated ROI area instead of measuring the entire area of an image. During the ROI set-up, the value of effective deposition pattern area is included so that if the deposition pattern is out of the ROI zone, it would be treated as a defect before measuring the size and center point of the pattern. As a result, the tac time and inspection process could be shortened. The proposed method also could be applied to the OLED manufacturing process. Production of OLED could be increased by reducing tac time and inspection process.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2007.04a
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• pp.645-650
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• 2007

According to most studies, assessment of aging structure is trend to detect flaw size by sensor than using existing subjective evaluation by expert for objective evaluation. But Uncertainties existing in the sensor make difference between measured flaw size and actual flaw size, In this paper, Probability of Detection(POD) have been used to quantify the uncertainties and POD is updated by relationship measured flaw size and actual flaw size (Heasler, 1990), also we proposed probabilistic updating approach method to improve measurement accuracy(the difference of measured PDF and actual PDF) by using updated POD.

• Journal of the Korea institute for structural maintenance and inspection
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• v.5 no.4
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• pp.155-160
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• 2001

KS-code(KS B 0896) for nondestructive ultrasonic testing classifies the quality level by relative flaw size only. But flaw position is more important than the flaw size. Test blocks having artificial holes near surface show lower yield load than the blocks having deeply located holes from the surface. So, level calibration table was proposed for classifying the quality level of welded steel structures.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.157-161
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• 2007

There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.7-11
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• 2015

In this paper, an automatic focusing method has been proposed for speedy and reliable measurement and inspection in industry. It is very difficult to determine focusing step size and moving direction in one camera autofocusing. The proposed method can improve speed and accuracy of focusing by using the optical axis interval of two cameras, which is automatically set up as focusing step size. Also, it can determine moving direction from focus value comparisons of two cameras, and then solve ambiguity of one camera focusing. Its performance is verified by experiments. It is expected that it can apply to optical system for measurement and inspection in industry fields.