• 한국주조공학회지
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• 제40권2호
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• pp.25-33
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• 2020

The effects of mold variable and main alloying element on the mechanical properties of ductile cast iron poured into shell stack mold were investigated. The strength and hardness of with the smaller cross-section of the diameter of 6.25mm were higher than those of 12.50mm. On the other hand, the elongation of the former was lower than that of the latter. The strength and hardness of the specimens obtained from the center layer in the 5-story stack mold were the lowest and those for other specimens were increased with increased distance from the center. The elongation of those were the highest of all. The strength and hardness of the specimens obtained from the center layer were decreased the elongation was increased with the increased number of layers. The strength and hardness were increased and the elongation was decreased roughly with the increased amounts of reaidual magnesium and carbon content added, respectively. The strength and hardness were increased and the elongation was decreased roughly with the increased amounts of silicon content added to 2.45wt% and rather decreased with that to 2.85wt%. The effect of silicon content showed the opposite tendency to those of residual magnesium and carbon content.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.35-39
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• 2018

광결합 효율(Fiber coupling efficiency)을 개선하기 위해서는 Laser diode에서 넓은 각도로 방출된 빛을 광섬유의 중심(Core) 부분으로 모아주는 집광렌즈(Collimating lens)가 필수적이다. 현재 사용되는 집광렌즈는 형틀(Mold)을 이용한 글래스 몰드(Glass mold) 공법이 널리 사용되고 있다. 이 방식은 생산단가가 저렴하지만, 정교한 성형이 어렵고 구면수차와 같은 품질문제가 있다. 본 연구는 기존의 글래스 몰드 공법을 반도체 공정으로 대체함으로써 표면 가공의 정밀도를 높이고, 렌즈의 재질 또한 반도체 공정에 적합한 실리콘으로 변경하였다. 반도체공정은 PR을 이용한 포토리소그래피(Photolithography) 공정과 플라즈마를 이용한 건식 식각(Dry etching) 공정으로 구성된다. 광결합 효율은 실리콘 렌즈의 광학적 특성을 평가하기 위해 초정밀 정렬 시스템을 사용하여 측정되었다. 그 결과, 렌즈 직경 $220{\mu}m$ 일 때의 최대 광결합 효율은 50%로 측정되었고, 렌즈 직경 $210-240{\mu}m$ 범위에서는 최고 광결합 효율 대비 5% 이하의 광결합 특성저하를 보여줌을 확인하였다.

• 해부∙생물인류학
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• 제31권4호
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• pp.151-158
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• 2018

척추사이구멍은 인접한 두 척추뼈와 그 사이의 척추사이원반으로 구성된다. 이전의 척추사이구멍에 대한 연구들은 다양한 방법으로 수행이 되었다. 이번 연구에서는 실리콘 주형을 이용해서 척추사이구멍의 특징을 알아보았다. 시신18구를 해부하여 허리의 척추사이구멍을 해부하였다. 첫째로는 척수신경의 위치를 측정하였다. 둘째로는 척추사이구멍을 덮고있는 모든 조직을 제거하여 척추사이구멍 단면의 가장 좁은 부위를 측정하였다. 조직이 제거된 척추사이구멍은 실리콘주형으로 채워졌다. 실리콘주형이 굳어진 다음에는 구멍에서 분리되었다. 단면으로 잘린 실리콘주형을 종이 위에 도장처럼 찍고, 그것을 컴퓨터에 저장하였다. 척추사이구멍의 주형의 면적, 둘레, 높이, 폭이 컴퓨터에서 분석되었다. 허리의 다섯 개 척추사이구멍에서 면적과 둘레는 통계학적인 차이를 보이지 않았다. 하지만 둘째에서 다섯째 허리뼈에 걸쳐서 높이는 낮아지는 경향, 폭은 넓어지는 경향을 보였다. 또한 높이와 폭은 다섯째 구멍에서 유의미한 차이가 있었다. 높이는 다른 구멍들 중에서 가장 낮았고, 폭은 가장 넓었다. 척수신경은 첫째에서 넷째허리뼈에서는 척추사이원반 근처를 지나갔고, 다섯째허리뼈에서는 척추사이원반 아래쪽으로 지나갔다. 이번 연구는 척추사이구멍의 3차원적 입체 구조를 실리콘주형으로 확인하였다. 기존의 평면적 연구에서 관찰되지 않았던 다른 성질들을 확인할 수 있었다. 즉, 허리척추뼈에서 척추사이구멍의 면적과 둘레는 일정하였으나 높이와 폭은 전체적으로 변화하는 양상을 보였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.126-129
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• 2009

In this study, it was aimed to develop the re-use technology of ultra-fine silicon powders, by-products during the current production process of high purity poly-Si feedstock. For this goal, the compacts of the silicon powders were tried to fabricate by CIP (Cold Isostatic Pressing) method using silicon rubber mold without chemical binder materials. The density ratio of the silicon powder compacts reached 74%. In order to simulate the actual handling and charging conditions of feedstock material in casting process, a shaking test was carried out and mass loss measured. Finally, the silicon powder compacts were melted using a cold crucible induction melting method and the purity assessment was conducted by Hall effect measurement.

• 센서학회지
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• 제28권4호
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• 제어로봇시스템학회논문지
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• 제14권4호
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• pp.332-335
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• 2008

PMMA light guiding plate with nano pattern was fabricated by nano imprint lithography method. A silicon mold for electroplating of nickel was fabricated by conventional photolithography process. A nickel stamp for nano imprint lithography was fabricated by electroplating process using silicon mold. The nano imprint lithography was performed on PMMA plate at $140^{\circ}C$ under pressure of 20kN. The nano pattern on PMMA plate was investigated using FE-SEM. It is shown that the patterns were well transferred for several steps and the nano imprint lithography method could be applied for fabricating patterns of light guiding plate.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.743-746
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• 2000

Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were $125{\mu}m$ and over 3.0, respectively.

• 대한기계학회논문집A
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• 제25권8호
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• pp.1242-1245
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• 2001

Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were 125$\mu\textrm{m}$ and over 3.0, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.414-415
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• 2007

PMMA light guiding plate with nano pattern was fabricated by nano imprinting technology. Silicon mold was fabricated by conventional photolithography. A nickel stamper was fabricated by electroplating process using silicon mold. Nano imprinting was performed on PMMA plate at $140^{\circ}C$ under pressure of 20kN. The nano pattern on PMMA plate was investigated using FE-SEM.

• 한국생산제조학회지
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• 제22권3_1spc호
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• pp.504-508
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• 2013

This paper describes in detail the life prediction models and simulations of thermal fatigue under different mold compounds and chip sizes for wafer-level embedded SiP. Three-dimensional finite element models are built to simulate the viscoplastic behaviors for various mold compounds and chip sizes. In particular, the bonding parts between a mold and silicon nitride (Si3N4) are carefully modeled, and the strain distributions are studied. Three different chip sizes are used, and the effects of the mold compounds are observed. Through the numerical studies, it is found that type-C, which has a relatively lower Young's modulus and higher CTE, has a better fatigue life than the other mold compounds. In addition, the $4{\times}4$ chip has a shorter life than the $6{\times}6$ and $8{\times}8$ chips.