• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2006.10a
• /
• pp.198-201
• /
• 2006

In this paper, we fabricated drag force type and pressure difference type gas flow sensor with dry etching technology which used Deep RIE(reactive ion etching) and etching stop technology which used SOI(silicon-on-insulator). we fabricated four kinds of sensor, which are cantilever, paddle type, diaphragm, and diaphragm with orifice type. Both cantilever and paddle type flow sensors have similar sensitivity as 0.03mV/V kPa. Sensitivity of the fabricated diaphragm and diaphragm with orifice type sensor were relatively high as about 3.5mV/V kPa, 1.5mV/V kPa respectively.

• Proceedings of the IEEK Conference
• /
• 2001.06b
• /
• pp.37-40
• /
• 2001

The semiconductor's design rule becomes more stringent, hence the silicon-dioxide etching technique is important issue. In this work we compared the etching characteristics of different three types of Plasma source, Normal ICP, magnetized ICP and E-IC $P^{TM}$. The E-IC $P^{TM}$ source shows higher etch rate at lower pressure and this is advantageous for the fine pattern process. The etching characteristics were varied with external magnetic field frequency at I-lCP and this is examined with Nanospe $c^{TM}$ and SEM. We designed Langmuir probe system for time resolved diagnosis. ion density of E-ICP is varying periodically with the applied external magnetic field frequencyquency

• Current Photovoltaic Research
• /
• v.5 no.3
• /
• pp.75-82
• /
• 2017

High efficiency thin film solar cells require an absorber layer with high absorption and low defect, a transparent conductive oxide (TCO) film with high transmittance of over 80% and a high conductivity. Furthermore, light can be captured through the glass substrate and sent to the light absorbing layer to improve the efficiency. In this paper, morphology formation on the surface of glass substrate was investigated by using HF, mainly classified as random etching and periodic etching. We discussed about the etch mechanism, etch rate and hard mask materials, and periodic light trapping structure.

• Journal of the Korean Magnetics Society
• /
• v.5 no.5
• /
• pp.538-542
• /
• 1995

The etching characteristics of magnetic thin films of permalloy and Fe-based alloys are investigated. The thin films are fabricated by rf magnetron sputtering and the substrates used are silicon and glass. Etching is done by ion beam technique and the main process parameters investigated are beam voltage, beam current and accelerating voltage. The etch rate of the magnetic films is proportional to the beam current, but it is not directly related to the accelerating voltage and beam voltage. The dependence of etch rate on the process parameters can be explained by ion current density. It is found that the ion beam etching is effective in obtaining well-developed micro-patterns on the permalloy and Fe- based magnetic thin films.

• 한국연소학회:학술대회논문집
• /
• 2006.10a
• /
• pp.235-241
• /
• 2006

Catalytic combustion is one of the suitable methods for micro power source due to high energy density and no flame quenching. Catalyst loading in the micro structured combustion chamber is one of the most important issues in the development of micro catalytic combustors. In this research, to coat catalyst on the chamber wall, two methods were investigated. First, $Al_2O_3$ was selected as a support of Pt and $Pt/Al_2O_3$ was synthesized through the alumina sol-gel procedure. To improve the coating thickness and adhesion between catalyst and substrate, heat resistant and water solvable organic-inorganic hybrid binder was used. Porous silicon was also investigated as a catalyst support for platinum. Through the parametric studies of current density and etching time, fabrication process of $1{\sim}2{\mu}m$ of diameter and about $25{\mu}m$ depth pores was confirmed. Coated substrates were test in the micro channel combustor which was fabricated by the wet etching and machining of SUS 304. Using $Pt/Al_2O_3$ coated substrate and Pt coated porous silicon substrate, conversion rate of fuel was over 95% for $H_2$/Air premixed gas.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.48.1-48.1
• /
• 2010

Mono-crystalline silicon solar cell is fabricated by using alkali metals. These alkali metal, used in wet etching process, must be removed for the high efficiency solar cell. As wet etching process has been adapted due to its low cost. But lots of alkali metals like potassium remains on the silicon surface and acts as impurities. To remove these alkali metals many of cleaning process have to be applied when solar cell manufacturing process. In terms of alkali metal removal, modified etchant solution is required for concise cleaning process. In this paper ethylenediamine was used and proposed for the substituion of postassium hydroxide.

• Applied Microscopy
• /
• v.45 no.4
• /
• pp.195-198
• /
• 2015

Gas-assisted etching (GAE) with focused ion beam (FIB) was applied to prepare plan-view specimens of Cu thin-layer on a silicon substrate for transmission electron microscopy (TEM). GAE using $XeF_2$ gas selectively etched the silicon substrate without volume loss of the Cu thin-layer. The plan-view specimen of the Cu thin film prepared by FIB milling with GAE was observed by scanning electron microscopy and $C_S$-corrected high-resolution TEM to estimate the size and microstructure of the TEM specimen. The GAE with FIB technique overcame various artifacts of conventional FIB milling technique such as bending, shrinking and non-uniform thickness of the TEM specimens. The Cu thin film was uniform in thickness and relatively larger in size despite of the thickness of <200 nm.

• Journal of Sensor Science and Technology
• /
• v.16 no.1
• /
• pp.62-67
• /
• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.16 no.12 s.117
• /
• pp.1272-1278
• /
• 2006

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Journal of the Korean Society of Combustion
• /
• v.11 no.2
• /
• pp.7-14
• /
• 2006

Catalytic combustion is one of the suitable methods for micro power source due to high energy density and it can be applied to micro structured chamber without consideration of quenching since it is flameless combustion. Catalyst loading in the micro structured combustion chamber is one of the most important issues in the development of micro catalytic combustors. In this research, to coat catalyst on the chamber wall, two methods were investigated. First, $Al_2O_3$ was selected as a support of Pt and $Pt/Al_2O_3$ was synthesized through the alumina sol-gel procedure. To improve the coating thickness and adhesion between catalyst and substrate, heat resistant and water solvable organic-inorganic hybrid binder was used. Porous silicon was also investigated as a catalyst support for platinum. Through the parametric studies of current density and etching time, fabrication process of $1{\sim}2{\mu}m$ of diameter and about $25{\mu}m$ depth pores was confirmed. Coated substrates were test in the micro channel combustor which was fabricated by the wet etching and machining of SUS 304. Using $Pt/Al_2O_3$ coated substrate and Pt coated porous silicon substrate, conversion rate of fuel was over 95 % for $H_2/Air$ premixed gas.