• 제목/요약/키워드: Silicon Oxide Film

검색결과 402건 처리시간 0.025초

오존/자외선에 의한 실리콘 웨이퍼의 정밀세정에 관한 연구 (A Study on the Contaminants Precision Cleaning of Etched Silicon Wafer by Ozone/UV)

  • 박현미;이창호;전병준;윤병한;임창호;송현직;김영훈;이광식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 하계학술대회 논문집 C
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    • pp.1820-1822
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    • 2004
  • In this study, major research fields are classified as ozone generation system for dry cleaning wafer of etched silicon wafer, dry cleaning process of etched silicon wafer which includes SEM analysis and ESCA analysis. The following results are deduced from each experiment and analysis. The magnitudes of carbon and silicon were similar to the survey spectrum of silicon wafer which does not cleaning, but magnitude of oxygen was much bigger Because UV light activates oxygen molecules in the oxide film on the silicon wafer.

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Al-Si계 피스톤 합금의 경질양극산화피막의 특성에 관한 연구 (A Study on the Charactristics od Hard Anodizing fikm of Al-Si Pistom Alloys)

  • 문종환;이진형;권혁상
    • 한국표면공학회지
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    • 제23권1호
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    • pp.34-43
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    • 1990
  • Al-Si piston alloys such as AlS10CuMg have been anodized to examine apossibility of forming a hard film aat relatively higher temperatures compard with those in conventional sulfuric acid processes. Three types of electrolytes have been employed in this study ; electrolyte A(15% H2SO4, $0^{\circ}C$), electrolyte B(12% H2SO4, 1% oxalic, $10^{\circ}C$), electrolyte C(tartaric acid 125g/L+oxalic 75g/L+aluminum sulfate 225g/L, $25^{\circ}C$). Hard anodisine process in electrolyte B at a current density of 1.54A/dm2 produced a harder film of VHN 396 at a relatibely low film forming voltage compared with those obtained in other electrolyte at equivalent current density. A liner relationship between hardness and abrasion resistance exists for Al-Si piston alloys. The hardness of anodized film decreasees with increasing silicon content in Al-Si alloys and also with bath temperature. The film hardeness of Na-modified alloy os higher than that of P-modified alloy due to its finer microstructre. The film on the silicon phase in Al-Si alloys is observed to be formed by lateral growth of oxide film nucleated at surroundings.

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Poly-crystalline Silicon Thin Film Transistor: a Two-dimensional Threshold Voltage Analysis using Green's Function Approach

  • Sehgal, Amit;Mangla, Tina;Gupta, Mridula;Gupta, R.S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제7권4호
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    • pp.287-298
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    • 2007
  • A two-dimensional treatment of the potential distribution under the depletion approximation is presented for poly-crystalline silicon thin film transistors. Green's function approach is adopted to solve the two-dimensional Poisson's equation. The solution for the potential distribution is derived using Neumann's boundary condition at the silicon-silicon di-oxide interface. The developed model gives insight into device behavior due to the effects of traps and grain-boundaries. Also short-channel effects and drain induced barrier lowering effects are incorporated in the model. The potential distribution and electric field variation with various device parameters is shown. An analysis of threshold voltage is also presented. The results obtained show good agreement with simulated results and numerical modeling based on the finite difference method, thus demonstrating the validity of our model.

RF 마그네트론 스퍼터링에서 증착거리와 증착온도가 무기 액정 배향막의 물리적 성질에 미치는 영향에 대한 연구 (Influences of Target-to-Substrate Distance and Deposition Temperature on a-SiOx/Indium Doped Tin Oxide Substrate as a Liquid Crystal Alignment Layer)

  • 박정훈;손필국;김기범;박혁규
    • 한국재료학회지
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    • 제18권10호
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    • pp.521-528
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    • 2008
  • We present the structural, optical, and electrical properties of amorphous silicon suboxide (a-$SiO_x$) films grown on indium tin oxide glass substrates with a radio frequency magnetron technique from a polycrystalline silicon oxide target using ambient Ar. For different substrate-target distances (d = 8 cm and 10 cm), the deposition temperature effects were systematically studied. For d = 8cm, oxygen content in a-$SiO_x$ decreased with dissociation of oxygen onto the silicon oxide matrix; temperature increased due to enlargement of kinetic energy. For d = 10 cm, however, the oxygen content had a minimum between $150^{\circ}\;and\;200^{\circ}$. Using simple optical measurements, we can predict a preferred orientation of liquid crystal molecules on a-$SiO_x$ thin film. At higher oxygen content (x > 1.6), liquid crystal molecules on an inorganic liquid crystal alignment layer of a-$SiO_x$ showed homogeneous alignment; however, in the lower case (x < 1.6), liquid crystals showed homeotropic alignment.

Advances in Zinc Oxide-Based Devices for Active Matrix Displays

  • Mann, Mark;Li, Flora;Kiani, Ahmed;Paul, Debjani;Flewitt, Andrew;Milne, William;Dutson, James;Wakeham, Steve J.;Thwaites, Mike
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.389-392
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    • 2009
  • Metal oxides have been proposed as an alternative channel material to hydrogenated amorphous silicon in thin film transistors (TFTs) because their higher mobility and stability make them suitable for transistor active layers. Thin films of indium zinc oxide (IZO) were deposited using a High Target Utilization Sputtering (HiTUS) system on various dielectrics, some of which were also deposited with the HiTUS. Investigations into bottom-gated IZO TFTs have found mobilities of 8 $cm^2V\;^1s^{-1}$ and switching ratios of $10^6$. There is a variation in the threshold voltage dependent on both oxygen concentration, and dielectric choice. Silica, alumina and silicon nitride produced stable TFTs, whilst hafnia was found to break down as a result of the IZO.

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고 전력 DMOSFET 응용을 위한 트렌치 게이트 형성에 관한 연구 (A Study on the Formation of Trench Gate for High Power DMOSFET Applications)

  • 박훈수;구진근;이영기
    • 한국전기전자재료학회논문지
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    • 제17권7호
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    • pp.713-717
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    • 2004
  • In this study, the etched trench properties including cross-sectional profile, surface roughness, and crystalline defects were investigated depending on the various silicon etching and additive gases, For the case of HBr$He-O_2SiF_4$ trench etching gas mixtures, the excellent trench profile and minimum defects in the silicon trench were achieved. Due to the residual oxide film grown by the additive oxygen gas, which acts as a protective layer during trench etching, the undercut and defects generation in the trench were suppressed. To improve the electrical characteristics of trench gate, the hydrogen annealing process after trench etching was also adopted. Through the hydrogen annealing, the trench corners might be rounded by the silicon atomic migration at the trench corners having high potential. The rounded trench corner can afford to reduce the gate electric field and grow a uniform gate oxide. As a result, dielectric strength and TDDB characteristics of the hydrogen annealed trench gate oxide were remarkably increased compared to the non-hydrogen annealed one.

Effect of Particle Size of Ceria Coated Silica and Polishing Pressure on Chemical Mechanical Polishing of Oxide Film

  • Kim, Hwan-Chul;Lim, Hyung-Mi;Kim, Dae-Sung;Lee, Seung-Ho
    • Transactions on Electrical and Electronic Materials
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    • 제7권4호
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    • pp.167-172
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    • 2006
  • Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

산화물반도체 박막트랜지스터 제작 및 전기적 특성 분석 (Fabrication and Charaterization of Oxide Thin Film Transistor)

  • 이상렬
    • 한국전기전자재료학회논문지
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    • 제26권4호
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    • pp.275-277
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    • 2013
  • Thin-film transistors(TFTs) with silicon zinc tin oxide(SZTO) channel layer are fabricated by solution-process. The threshold voltage ($V_{th}$) shifted toward positive directly with increasing Si contents in SZTO system. Because the Si has a lower standard electrode potential (SEP) than Sn, Zn, thus degenerate the oxygen vacancy (VO). As a result, the Si act as carrier suppressor and oxygen binder in the SZTO as well as a $V_{th}$ controller.

고품질 실리콘 박막을 이용한 저가 고효율 실리콘 박막 및 a-Si:H/c-Si 이종접합 태양전지 개발 (Development of low cost and high efficiency silicon thin-film and a-Si:H/c-Si hetero-junction solar cells using low temperature silicon thin-films)

  • 이정철;임충현;안세진;윤재호;김석기;김동섭;양수미;강희복;이보영;이준신;송진수;윤경훈
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2005년도 춘계학술대회
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    • pp.113-116
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    • 2005
  • In this paper, silicon thin-film solar cells(Si- TFSC) and a-Si/c-Si heterojunction solar cells(HJ-cell) are investigated. The Si-TFSC was prepared on glass substrate by depositing $1-3{\mu}m$ thin-film silicons by glow discharge method. The $a-Si:H/{\mu}c-Si:H$ tandem solar cells on textured ZnO:A1 TCO (transparent conducting oxide) showed improved Jsc in top and bottom cells than that on $SnO_2:F$ TCO. This enhancement of jsc resulted from improved light trapping effect by front textured ZnO:A1. The a-Si/c-Si HJ-cells with simple structure without high efficiency features are suffering from low Voc and Jsc. The improvement of front nip and back interface properties by adopting high quality silicon-films at low temperature should be done both for increasing device performances and production cost.

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선결정화법을 이용한 금속 유도 일측면 결정화에 의해 제작된 다결정 실리콘 박막 트랜지스터 소자 및 회로의 전기적 특성 개선 효과 (Dynamic Characteristics of Metal-induced Unilaterally Crystallized Polycrystalline Silicon Thin-film Transistor Devices and Circuits Fabricated with Precrystallization)

  • 황욱중;강일석;김영수;양준모;안치원;홍순구
    • 한국진공학회지
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    • 제17권5호
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    • pp.461-465
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    • 2008
  • 적층 박막 내에서의 상변화는 주변 층에 영향을 준다. 결정화가 게이트 절연층에 주는 영향이 제거된 선결정화법(precrystallization)이 금속 유도 일측면 결정화(metal-induced unilateral crystallization)에 의해 제작된 다결정 실리콘 박막 트랜지스터 소자 및 회로의 전기적 특성에 미치는 영향에 대하여 연구하였다. 이 방법으로 만들어진 소자는 일반적인 후 결정화(postcrystallization) 소자에 비하여 높은 전류 구동력을 보였다. 여기에 본 연구는 DC bias에 의한 ring oscillator의 특성 변화를 연구하였다. 선결정화된 실리콘 박막을 이용하여 제작한 PMOS inverter는 후결정화된 실리콘 박막을 이용하여 제작한 inverter에 비하여 매우 동적(dynamic)이고도 안정적인 특성을 보였다.