• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.805-808
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• 2002

A carbon monoxide gas sensor utilizing Pt-SiC, Pt-SnO2-SiC diode structure was fabricated. Since the operating temperature for silicon devices in limited to 200oC, sensor which employ the silicon substrate can not at high temperature. In this study, CO gas sensor operating at high temperature which utilize SiC semiconductor as a substrate was developed. Since the SiC is the semiconductor with wide band gap. the sensor at above $700^{\circ}C$. Carbon monoxide-sensing behavior of Pt-SiC, Pt-SnO2-SiC diode is systematically compared and analyzed as a function of carbon monoxide concentration and temperature by I-V and ${\Delta}$I-t method under steady-state and transient conditions.

• 한국전기전자재료학회논문지
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• 제29권7호
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• pp.394-399
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• 2016

The silicon dioxide ($SiO_2$) was deposited using various gas as oxygen and nitrous oxide ($N_2O$) in nowadays. In order to improve electrical characteristics and the interface state density ($D_{it}$) in low temperature, It was deposited with carbon dioxide ($CO_2$) and silane ($SiH_4$) gas by inductively coupled plasma chemical vapor deposition (ICP-CVD). Each $D_{it}$ of $SiO_2$ using $CO_2$ and $N_2O$ gas was $1.30{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$ and $3.31{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$. It showed $SiO_2$ using $CO_2$ gas was about 2.55 times better than $N_2O$ gas. After 10 years when the thin film was applied to metal/insulator/semiconductor(MIS)-nonvolatile memory(NVM), MIS NVM using $SiO_2$($CO_2$) on tunneling layer had window memory of 2.16 V with 60% retention at bias voltage from +16 V to -19 V. However, MIS NVM applied $SiO_2$($N_2O$) to tunneling layer had 2.48 V with 61% retention at bias voltage from +20 V to -24 V. The results show $SiO_2$ using $CO_2$ decrease the $D_{it}$ and it improves the operating voltage.

• 한국세라믹학회지
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• 제32권11호
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• pp.1246-1254
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• 1995

A numerical model for fabrication and deposition of ultrafine SiO2 particles were proposed in the simplified horizontal MCVD apparatus using tube furnace reactor. The model equations such as energy and mass balance equations and the 0th, 1st and 2nd moment balance equations of aerosols were considered in the reactor. The phenomena of SiCl4 chemical reaction, SiO2 particle formation and coagulation, diffusion and thermophoresis of SiO2 particles were included in the aerosol dynamic equation. The profiles of gas temperature, SiCl4 concentration and SiO2 particle volume were calculated for standard conditions. The concentrations, sizes and deposition efficiencies of SiO2 particles were calculated, changing the process conditions such as tube furnace setting temperature, total gas flow rate and inlet SiCl4 concentration.

• 센서학회지
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• 제19권3호
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• pp.197-201
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• 2010

This paper describes the fabrication and characteristics of a NO sensor using ZnO thin film integrated 3C-SiC micro heater based on polycrystalline 3C-SiC thin film of operation in harsh environments. The sensitivity, response time, and operating properties in high temperature and voltages of NO sensors based SiC MEMS are measured and analyzed. The sensitivity of device with pure ZnO thin film at the heater operating power of 13.5 mW ($300^{\circ}C$) is 0.875 in NO gas concentration of 0.046 ppm. In the case of Pt doping, the sensitivity of at power consumption of 5.9 mW ($250^{\circ}C$) was 1.92 at same gas flow rate. The ZnO with doped Pt was showed higher sensitivity, lower working temperature and faster adsorption characteristics to NO gas than pure ZnO thin film. The NO gas sensor integrated SiC micro heater is more strength than others in high voltage and temperature environments.

• 한국전기전자재료학회논문지
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• 제26권6호
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• pp.441-445
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• 2013

ZnO nanowires on the a-, c- and m-plane oriented 4H-SiC substrates were grown by using a high temperature tube furnace. Ti/Au electrodes were deposited on ZnO nanowires and a-, c- and m-plane 4H-SiC substrates, respectively. The shape and density of the ZnO nanowires were investigated by field emission scanning electron microscope. It was found that the growth direction of nanowires depends strongly on growth parameters such as growth temperature and pressure. In this work, The sensitivity of nanowires formed a-, c- and m-plane oriented 4H-SiC gas sensor was measured at $300^{\circ}C$ with CO gas concentration of 80%. The nanowires grown on a-plane oriented 4H-SiC show improved sensing performance than those on c- and m-plane oriented 4H-SiC due to the increased density of nanowire on a-plane 4H-SiC.

• Korean Chemical Engineering Research
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• 제43권1호
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• pp.66-70
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• 2005

IS 프로세스의 HI 분해 반응에서의 적용을 위해 고분자재료(폴리이미드)를 이용하여 탄화 막을 제작하고, 이 탄화막에 SiO를 처리함으로써 SiC 막을 제작하였다. 폴리이미드의 탄화에 의한 중량 감소는 약 50% 정도이고, 탄화 온도가 증가할수록 중량감소도 증가하였다. 탄화막은 탄화온도가 상승하면 가스 투과속도가 감소하고 막의 치밀화가 진행되었다. SiC 막은 SiO의 처리 농도가 증가하면 가스 투과 속도는 증가하고, 기체 투과 메커니즘은 활성화에너지 흐름에서 Knudsen 흐름으로 변화한다는 것을 알 수 있었다.

• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.299-304
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• 2004

In recent years, silicon carbide has emerged as an important material for MEMS application. In order to fabricate an SiC film based MEMS structure by using chemical etching method, high operating temperature is required due to high chemical stability Therefore, dry etching using plasma is the best solution. SiC film was deposited by thermal CVD at the temperature of 100$0^{\circ}C$ and pressure of 10 torr. SiC was dry etched with a reactive ion etching (RIE) system, using SF$_{6}$/O$_2$ and CF$_4$/O$_2$ gas mixture. Etch rate has been investigated as a function of oxygen concentration in the gas mixture, rf power, working pressure and gas flow rate. Etch rate was measured by surface profiler and FE-SEM. SF$_{6}$/O$_2$ gas mixture showed higher etch rate than CF$_4$/O$_2$ gas mixture. Maximum etch rate appeared at RF Power of 450W. $O_2$ dilute mixtures resulted in an increasing of etch rate up to 40％, and the superior anisotropic cross section was observe

• 멤브레인
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• 제14권4호
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• pp.312-319
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• 2004

졸겔법에 의해 Si(OC$_2$$H_5$/)$_4$-($CH_3$O)$_3$B-C$_2$$H_5$OH-$H_2O$계로부터 다공성의 SiO$_2$-B$_2$O$_3$ 막을 제조하였다. SiO$_2$-B$_2$O$_3$막의 특성을 BET, IR spectrophotometer, X-ray diffractometer, SEM 과 TEM을 사용하여 조사하였다. $700^{\circ}C$에서 얻어진 SiO$_2$-B$_2$O$_3$ 막의 평균 기공직경은 0.0048 $\mu\textrm{m}$이고, 표면적은 354.398 $m^2$/g이었으며, 입자의 크기는 7 nm인 무정형의 다공체이었다. SiO$_2$-B$_2$O$_3$ 막의 수소/질소 혼합 기체 분리 특성은 기체분리 압력을 달리하여 조사하였다. $25^{\circ}C$, ΔP 155.15cmHg에서 수소/질소 혼합 기체를 분리하여 본 결과 SiO$_2$-B$_2$O$_3$ 막의 수소에 대한 real separation factor($\alpha$)는 4.68이었다. 그리고 투과셀의 압력차(ΔP)값이 증가할수록 real separation factor($\alpha$), head separation factor($\beta$), tail separation factor((equation omitted))값이 증가하였다.

• 한국재료학회지
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• 제24권3호
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• pp.152-158
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• 2014

We report the effect of the fabric of the surface microstructure on the CO gas sensing properties of $SnO_2$ thin films deposited on self-assembled Au nanodots ($SnO_2$/Au) that were formed on $SiO_2/Si$ substrates. We characterized structural and morphological properties, comparing them to those of $SnO_2$ thin films deposited directly onto $SiO_2/Si$ substrates. We observed a significant enhancement of CO gas sensing properties in the $SnO_2$/Au gas sensors, specifically exhibiting a high maximum response at $200^{\circ}C$ and quite a low detection limit of 1 ppm level in dry air. In particular, the response of the $SnO_2/Au$ gas sensor was found to reach the maximum value of 32.5 at $200^{\circ}C$, which is roughly 27 times higher than the response (~1.2) of the $SnO_2$ gas sensor obtained at the same operating temperature of $200^{\circ}C$. Furthermore, the $SnO_2/Au$ gas sensors displayed very fast response and recovery behaviors. The observed enhancement in the CO gas sensing properties of the $SnO_2/Au$ sensors is mainly ascribed to the formation of a nanostructured morphology in the active $SnO_2$ layer having a high specific surface-reaction area by the insertion of a nanodot form of Au nucleation layer.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권2호
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• pp.95-102
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• 2001

Hafnium oxide thin films for gate dielectric were deposited at $300^{\circ}C$ on p-type Si (100) substrates by plasma enhanced chemical vapor deposition (PECVD) and annealed in $O_2$ and $N_2$ ambient at various temperatures. The effect of hydrogen treatment in 4% $H_2$ at $350^{\circ}C$ for 30 min on the electrical properties of $HfO_2$for gate dielectric was investigated. The flat-band voltage shifts of $HfO_2$capacitors annealed in $O_2$ambient are larger than those in $N_2$ambient because samples annealed in high oxygen partial pressure produces the effective negative charges in films. The oxygen loss in $HfO_2$films was expected in forming gas annealed samples and decreased the excessive oxygen contents in films as-deposited and annealed in $O_2$ or $N_2$ambient. The CET of films after hydrogen forming gas anneal almost did not vary compared with that before hydrogen gas anneal. Hysteresis of $HfO_2$films abruptly decreased by hydrogen forming gas anneal because hysteresis in C-V characteristics depends on the bulk effect rather than $HfO_2$/Si interface. The lower trap densities of films annealed in $O_2$ambient than those in $N_2$were due to the composition of interfacial layer becoming closer to $SiO_2$with increasing oxygen partial pressure. Hydrogen forming gas anneal at $350^{\circ}C$ for samples annealed at various temperatures in $O_2$and $N_2$ambient plays critical role in decreasing interface trap densities at the Si/$SiO_2$ interface. However, effect of forming gas anneal was almost disappeared for samples annealed at high temperature (about $800^{\circ}C$) in $O_2$ or $N_2$ambient.