• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.7
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• pp.85-94
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• 1994

A high-resolution transmission electron microscopy study of the solid phase crystallization of the amorphous silicon thin films, deposited on SiOS12T at 52$0^{\circ}C$ by low pressure chemical vapor deposition and annealed at 55$0^{\circ}C$ in a dry N$_{2}$ ambient was carried out so that the arrangement of atoms in the crystalline silicon and at the amorphous/crystalline interface of the growing grains could be understood on an atomic level. Results show that circular crystalline silicon nuclei have formed and then the grains grow to an elliptical or dendritic shape. In the interior of all the grains many twins whose{111} coherent boundaries are parallel to the long axes of the grains are observed. From this result, it is concluded that the twins enhance the preferential grain growth in the <112> direction along {111} twin planes. In addition to the twins. many defect such as intrinsic stacking faults, extrinsic stacking faults, and Shockley partial dislocations, which can be formed by the errors in the stacking sequence or by the dissociation of the perfect dislocation are found in the silicon grain. But neither frank partial dislocations which can be formed by the condensation of excess silicon atoms or vacancies and can form stacking fault nor perfect dislocations which can be formed by the plastic deformation are observed. So it is concluded that most defects in the silicon grain are formed by the errors in the stacking sequence during the crystallization process of the amorphous silicon thin films.

• Korean Journal of Materials Research
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• v.17 no.11
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• pp.574-579
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• 2007

Amorphous $BaTi_4O_9$ ($BT_4$) film was deposited on Pt/Si substrate by RF magnetron sputter and their dielectric properties and electrical properties are investigated. A cross sectional SEM image and AFM image of the surface of the amorphous $BT_4$ film deposited at room temperature showed the film was grown well on the substrate. The amorphous $BT_4$ film had a large dielectric constant of 32, which is similar to that of the crystalline $BT_4$ film. The leakage current density of the $BT_4$ film was low and a Poole-Frenkel emission was suggested as the leakage current mechanism. A positive quadratic voltage coefficient of capacitance (VCC) was obtained for the $BT_4$ film with a thickness of <70 nm and it could be due to the free carrier relaxation. However, a negative quadratic VCC was obtained for the films with a thickness ${\geq}96nm$, possibly due to the dipolar relaxation. The 55 nm-thick $BT_4$ film had a high capacitance density of $5.1fF/{\mu}m^2$ with a low leakage current density of $11.6nA/cm^2$ at 2 V. Its quadratic and linear VCCs were $244ppm/V^2$ and -52 ppm/V, respectively, with a low temperature coefficient of capacitance of $961ppm/^{\circ}C$ at 100 kHz. These results confirmed the potential suitability of the amorphous $BT_4$ film for use as a high performance metal-insulator-metal (MIM) capacitor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.617-620
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• 1999

In this study, the polarization e(fecal and the birefringence effect of amorphous germanium (a-Ge) thin films were investigated by using linearly polarized He-Ne laser beam. The a-7e thin films were deposited on the quarts substrate by plasma enhanced chemical vapor deposition (PECVD) and thermal vacuum evaporation In order to obtain the optimum grating arrays, inorganci resists such as Si$_3$N$_4$ and a-Se$_{75}$ Ge$_{25}$ , were prepared with the optimized thickness by Monte Carlo (MC) simulation. As the results of MC simulation, the thickness ofa-Se$_{75}$ Ge$_{25}$ resist was determined with Z$_{min}$ of 360$\AA$ . The resists were exposed to Ga$^{+}$-FIB with accelerating energies of 50 keV, developed by wet etching, and a-Ge thin film was etched by reactive ion-etching (RIE). Finally, we were obtained grating arrays which grating width and linewidth are 0.8${\mu}{\textrm}{m}$, respectively and we studied the polarization and birefringence effect in transmission grating array made of high refractive amorphous material, and the applicability as waveplates and polarizers in optical device.e.e.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.25.1-25.1
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• 2009

Pattern 웨이퍼 상의 오염입자 제거는 반도체 산업의 주된 과제 중 하나이다. Pattern의 선폭이 좁아짐에 따라 Pattern에 손상을 가하지 않고 오염입자를 제거 하는 것은 더욱 어려워지고 있다. 그뿐만 아니라 기존 습식세정 공정에서의 화학액에 의한 환경오염 및 박막의 손실도 문제가 되기 시작했다. 이러한 문제를 해결하기 위해 기존 세정공정에서 화학액의 농도를 낮추고 Megasonic 등을 이용하여 세정력을 보완하는 방법들이 연구되고 있다. 하지만 습식세정의 경우 강한 화학작용으로 인한 표면 손상 및 물 반점의 문제는 여전히 이슈가 되고 있다. 이러한 단점을 극복하기 위하여 건식 세정법이 제시되고 있으며 이 중 레이저 충격파는 레이저를 집속시켜 발생된 충격파를 이용하여 입자를 제거하기 때문에 국부적인 세정이 가능하며 세정력 조절이 가능하여 손상이 세정을 할 수 있다. 그러나 Pattern의 구조에 의해 전되는 세정력의 차이가 발생하고 Trench 내부의 오염입자제거 문제점이 발생할 수 있다. 시편은 Si STI Pattern을 100 nm PSL Particle (Red Fluorescence, Duke Scientific, USA) 을 50ppm 농도로 희석시킨 IPA에 dipping 하여 오염시킨 후 N2 Gas를 이용하여 건조하여 준비하였다. 그리고 레이저 충격파 세정 시스템은 최대 에너지 1.8 J까지 가능한 레이저를 발생하는 1,064 nm Nd:YAG 레이저를 이용하여 실험하였다. 레이져 충격파 실험은 충격파와 시편사이의 거리, gap distance와 에너지를 변환하여 세정효율을 관찰하였다. 세정효율은 세정 전후의 입자 감소량을 현광현미경 (LV-150, Nikon, Japan)를 이용하여 측정하였다. 그 결과, Trench 내부의 오염입자의 경우 Trench 밖의 오염입자에 비해 세정효율이 떨어지는 것으로 나타났으나 시편과 레이저 초점과의 거리가 가까워짐에 따라 Trench 내부의 오염입자에 대한 세정 효율을 증가시킬 수 있었다.

• Journal of the Korean Ceramic Society
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• v.49 no.6
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• pp.620-624
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• 2012

The role of moisture remaining inside the deposition chamber during the formation of the cubic boron nitride (c-BN) phase in BN film was investigated. BN films were deposited by an unbalanced magnetron sputtering (UBM) method. Single-crystal (001) Si wafers were used as substrates. A hexagonal boron nitride (h-BN) target was used as a sputter target which was connected to a 13.56 MHz radiofrequency electric power source at 400 W. The substrate was biased at -60 V using a 200 kHz high-frequency power supply. The deposition pressure was 0.27 Pa with a flow of Ar 18 sccm - $N_2$ 2 sccm mixed gas. The inside of the deposition chamber was maintained at a moisture level of 65% during the initial stage. The effects of the evacuation time, duration time of heating the substrate holder at $250^{\circ}C$ as well as the plasma treatment on the inside chamber wall on the formation of c-BN were studied. The effects of heating as well as the plasma treatment very effectively eliminated the moisture adsorbed on the chamber wall. A pre-deposition condition for the stable and repeatable deposition of c-BN is suggested.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.189-189
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• 2010

ZnO nanorods 구조는 광소자 및 태양광 소자의 성능을 향상시키기 위해서 무반사계수, 광추출효율, 전기적, 열적 전도도를 개선시킬 수 있어, 매우 큰 관심을 가지고 왔다. 또한 Ag 나노입자는 표면 플라즈몬 효과를 이용하여 LED나 태양전지에 응용하여 소자의 성능이 향상됨을 이론적, 실험적으로 증명되어 왔으며, 현재에도 활발한 연구가 진행되고 있다. 이러한 ZnO nanorods 특성과 Ag 나노입자의 표면 플라즈몬 효과를 이용하기 위해서, 본 연구에서는 Ag 나노 입자를 형성된 ZnO seed층에 ZnO nanorods를 성장시켰다. 시료를 제작을 위해서 비교적 성장이 간단하고 저온성장이 가능한 화학적 합성방법을 이용하였다. Ag 나노입자가 형성된 ZnO seed층 제작을 위해서 먼저 Si 기판위에 RF magnetron 스퍼터를 이용하여 고진공, $N_2$ 분위기에서 일정한 두께로 증착을 하였으며, 이후 Ag 박막을 thermal evaporator로 10 nm 두께로 증착하였다. 그 다음, 크기가 다른 Ag 나노입자를 형성을 위해서 rapid thermal annealing (RTA)을 여러 가지 온도에서 수행하였다. 그리고 이러한 시료들를 이용하여, ZnO nanorods를 성장하기 위하여, $90-95^{\circ}$의 온도에서 zinc nitrate $Zn(NO_3)_2{\cdot}6H_2O$과 hexamethylentetramines (HMT)으로 혼합된 용액에 담가두어 ZnO nanorods를 성장시켰다. Ag 나노입자의 크기에 따라 ZnO nanorods의 구조와 형태에 대하여 어떠한 영향을 주는지를 관찰하기 위해 field emission scanning electron microscopy (FE-SEM)을 이용하여 측정하였으며, Ag와 ZnO의 성분분석과 결정성을 조사하기 위해 X-ray diffraction (XRD)을 이용하여 분석하였다. 그리고 표면 플라즈몬에 의한 영향에 대하여 조사하기 위해, ZnO nanorods와 Ag 나노입자가 형성된 ZnO nanorods를 UV-Vis-NIR spectrophotometer을 이용하여 흡수계수와 반사계수를 비교하여 측정하였으며. 태양전지의 성능향상을 수 있음을 이론적으로 계산하였다. 그리고 또한 photoluminescence (PL) 분석을 수행하여 ZnO nanorods의 구조에 대하여 Ag 나노입자의 영향에 대한 광특성을 측정하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.400-406
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• 2024

Next-generation wide-bandgap semiconductors such as SiC, GaN, and Ga2O3 are being considered as potential replacements for current silicon-based power devices due to their high mobility, larger size, and production of high-quality wafers at a moderate cost. In this study, we investigate the gradual modulation of chemical composition in multi-stacked metal oxide semiconductor thin films to enhance the performance and bias stability of thin-film transistors (TFTs). It demonstrates that adjusting the Ga ratio in the indium gallium oxide (IGO) semiconductor allows for precise control over the threshold voltage and enhances device stability. Moreover, employing multiple deposition techniques addresses the inherent limitations of solution-processed amorphous oxide semiconductor TFTs by mitigating porosity induced by solvent evaporation. It is anticipated that solution-processed indium gallium oxide (IGO) semiconductors, with a Ga ratio exceeding 50%, can be utilized in the production of oxide semiconductors with wide band gaps. These materials hold promise for power electronic applications necessitating high voltage and current capabilities.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.134-140
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• 2007

Optical structure of $V_{2}O_{5}$ thin films were analyzed and confirmed, the films were deposited in oxygen partial pressure 0% and 10% by RF magnetron sputtering system. Measurements of the elliptic constants were made in the range of $0.75{\sim}4.0\;eV$ by using phase modulated spectroscopic ellipsometer. The elliptic constants of the thin films were analyze by Double Amorphous dispersion relation. The calculated n, k spectra of $V_{2}O_{5}$ layer were obtained over the range of $0.75{\sim}4.0\;eV$ photon energy. SEM and XRD measurements were also made to validate the ellipsometric analysis and they give good agreement with the structural properties of the films. It was found that optical structure of the $V_{2}O_{5}$ layer has a 3 phase(roughness/film/substrate) and optical absorption properties are greatly depend on the partial pressure of the oxygen.

• Journal of the Korean Magnetics Society
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• v.11 no.4
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• pp.141-145
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• 2001

The Mn$\_$80/Ir$\_$18.1/Pt$\_$1.9/ exchange bias layers (EBLs), which have a small amounts of Pt, exhibit a high value of H$\_$ex/. The Si/Ni-Fe/Mn$\_$80/Ir$\_$18.1/Pt$\_$1.9/ EBL shows the largest H$\_$ex/ of 187 Oe, which is equivalent to a exchange energy (J$\_$ex/) of 0.146 erg/cm$^2$. Mn$\_$80/Ir$\_$18.1/Pt$\_$1.9/ EBLS are estimated to have blocking temperature of about 250 $\^{C}$, which is higher than those of Mn-Ir EBLs and Mn-Ir-Pt EBLs with higher Pt contents. This result implies that a little addition of Pt element promotes thermal stability in the Mn-Ir-Pt EBLs. The chemical stability of Mn-Ir-Pt EBLs was characterized by potentiodynamic test, which was performed in 0.001 M NaCl solution. The current density of Mn-Ir-Pt films was gradually reduced with increasing Pt content. The present results indicate that the Mn-Ir-Pt with a small amount of Pt is suitable for an antiferromagnetic material for a reliable spin valve giant magnetoresistance device.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.83-89
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• 2020

For the past few decades, as part of efforts to protect the environment where fossil fuels, which have been a key energy resource for mankind, are becoming increasingly depleted and pollution due to industrial development, ecofriendly secondary batteries, hydrogen generating energy devices, energy storage systems, and many other new energy technologies are being developed. Among them, the lithium-ion battery (LIB) is considered to be a next-generation energy device suitable for application as a large-capacity battery and capable of industrial application due to its high energy density and long lifespan. However, considering the growing battery market such as eco-friendly electric vehicles and drones, it is expected that a large amount of battery waste will spill out from some point due to the end of life. In order to prepare for this situation, development of a process for recovering lithium and various valuable metals from waste batteries is required, and at the same time, a plan to recycle them is socially required. In this study, we introduce a nanoscale pattern transfer printing (NTP) process of Li2CO3, a representative anode material for lithium ion batteries, one of the strategic materials for recycling waste batteries. First, Li2CO3 powder was formed by pressing in a vacuum, and a 3-inch sputter target for very pure Li2CO3 thin film deposition was successfully produced through high-temperature sintering. The target was mounted on a sputtering device, and a well-ordered Li2CO3 line pattern with a width of 250 nm was successfully obtained on the Si substrate using the NTP process. In addition, based on the nTP method, the periodic Li2CO3 line patterns were formed on the surfaces of metal, glass, flexible polymer substrates, and even curved goggles. These results are expected to be applied to the thin films of various functional materials used in battery devices in the future, and is also expected to be particularly helpful in improving the performance of lithium-ion battery devices on various substrates.