• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.423-423
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• 2007

In this study, the effects of annealing conditions on the structural and optical properties of ZnO films were investigated. ZnO oxide (ZnO) films were deposited onto $SiO_2$/Si substrates by RF magnetron sputtering from a ZnO target. The substrate was not heated during deposition. ZnO films were annealed in temperature ranges of $500{\sim}650^{\circ}C$ in the $O_2$ flow for 5 ~ 20 min. The film average thicknesses were in the range of 291 nm. The surface morphologies and structures of the samples were characterized by SEM and XRD, respectively. The optical properties were evaluated by PL measurement at room temperature using a He-Cd 325 nm laser. According to the results, the optimal annealing conditions for the best photoluminescence (PL) characteristics were found to be oxygen fraction, ($O_2/O_2+Ar$) of 20%, RF power of 240W, substrate temperature of RT (room temperature), annealing condition of $600^{\circ}C$ for 20 min, and sputtering pressure of 20 mTorr. The obtained wavelength of light emission was found at 379 nm (ultraviolet-UV region). However, the optimal parameters for the best PL characteristics of ZnO thin films were not consistent with those obtained from the (002) intensities of XRD analyses. As a result, XRD pattern was not considered as the key issue concerning the intensity of PL of ZnO thin film. The intensity of the emitted UV light will correspond to the grain size of ZnO film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.2
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• pp.159-163
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• 2005

This paper gives characterization of ZnO thin film deposited by RF magnetron sputtering method, which is concerned in deposition process and device fabrication process, to fabricate solidly mounted resonator(SMR)-type film bulk acoustic resonator(FBAR). A piezoelectric layer of 1.1${\mu}{\textrm}{m}$ thick ZnO thin films were grown on thermally oxidized SiO$_2$(3000 $\AA$)/Si substrate layers by RF magnetron sputtering at the room temperature. The highly c-axis oriented ZnO thin film was obtained at the conditions of 265 W of RF power, 10 mtorr of working pressure, and 50/50 of Ar/O$_2$ gas ratio. The piezoelectric-active area was 50 ${\mu}{\textrm}{m}$${\times}$50${\mu}{\textrm}{m}$, and the thickness of ZnO film and Al-3 % Cu electrode were 1.4 ${\mu}{\textrm}{m}$ and 180${\mu}{\textrm}{m}$, respectively. Its series and parallel frequencies appeared at 2.128 and 2.151 GHz, respectively, and the qualify factor of the resonator was as high as 401.8$\pm$8.5.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.309-310
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• 2006

In this paper, frequency characteristic of FBAR was studied as a function of annealing temperature. we have used Li dopant to enhance electrical properties of ZnO thin film. Li:ZnO thin film was deposited on Al(300 nm)/$SiO_2$(500 nm)/Si($500\;{\mu}m$) and each layer was patterned. Thermal treatment was executed in range of between 300 and $600^{\circ}C$ in $O_2$ ambient. We observed that the resistivity of ZnO is enhanced under the influence of Li doping and return loss in FBAR frequency properties is improved through annealing.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1262-1265
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• 2005

The picture quality of a plasma display panel is very sensitive to the phosphor characteristics such as decay time, surface state, and even longevity of phosphor material in itself. In this work, material characteristics of $Zn_2SiO_4:Mn$, $Y_2O_3-coated$ $Zn_2SiO_4:Mn$, and $YBO_3:Tb$, which are dominant in commercial application, were examined for investigating the aging characteristics of green PDP phosphors. It was found that $Y_2O_3-coated$ $Zn_2SiO_4:Mn$ are easily degraded at high temperature. However, all the samples were very weak after vacuum annealing. The luminescence intensity was decreased by order of one magnitude.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.180-180
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• 2010

Thin film transistors (TFTs) based on oxide semiconductors have emerged as a promising technology, particularly for active-matrix TFT-based backplanes. Currently, an amorphous oxide semiconductor, such as InGaZnO, has been adopted as the channel layer due to its higher electron mobility. However, accurate and repeatable control of this complex material in mass production is not easy. Therefore, simpler polycrystalline materials, such as ZnO and $SnO_2$, remain possible candidates as the channel layer. Inparticular, ZnO-based TFTs have attracted considerable attention, because of their superior properties that include wide bandgap (3.37eV), transparency, and high field effect mobility when compared with conventional amorphous silicon and polycrystalline silicon TFTs. There are some technical challenges to overcome to achieve manufacturability of ZnO-based TFTs. One of the problems, the stability of ZnO-based TFTs, is as yet unsolved since ZnO-based TFTs usually contain defects in the ZnO channel layer and deep level defects in the channel/dielectric interface that cause problems in device operation. The quality of the interface between the channel and dielectric plays a crucial role in transistor performance, and several insulators have been reported that reduce the number of defects in the channel and the interfacial charge trap defects. Additionally, ZnO TFTs using a high quality interface fabricated by a two step atomic layer deposition (ALD) process showed improvement in device performance In this study, we report the fabrication of high performance ZnO TFTs with a $Si_3N_4$ gate insulator treated using plasma. The interface treatment using electron cyclotron resonance (ECR) $O_2$ plasma improves the interface quality by lowering the interface trap density. This process can be easily adapted for industrial applications because the device structure and fabrication process in this paper are compatible with those of a-Si TFTs.

• Electrical & Electronic Materials
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• v.8 no.4
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• pp.400-405
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• 1995

ZnO films have been grown easily with the conventional thermal evaporation method on SiO$\_$2/ coated Si wafers. Anhydrous zinc acetate has been used as evaporation source. Zinc-acetate was directly heated in the laboratory-made brass boat. Zinc-acetate was sublimed at the boat temperature of about 220.deg. C. The substrates were heated to 600.deg. C with home made tantalium heater. Oxygen has been flowed into the deposition chamber to change the partial pressure of oxygen. X-ray diffraction patterns showed all the films to be amorphous. The films deposited at high oxygen pressure exhibit higher resistivity than films at low pressure. Energy dispersive spectroscopy(EDS) and rutherford backscattering spectrometry(RBS) were conducted on the films to reveal the composition of the ZnO films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.259-259
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• 2010

교류 전기장에 의해 배열된 ZnO 나노선 기반의 광다이오드를 제작하고 자외선 광특성을 조사하였다. ZnO 나노선은 dielectrophoresis (DEP) force와 토크 (T)에 의하여 두 전극사이에 배열되며, silicon (Si)나노선과 접합을 하여 p-n 접합을 형성한다. 형성된 p-n 접합은 정류작용을 하는 다이오드 특성을 보이며, 자외선 입사시 전류 점멸비 (on/off ratio) $10^1{\sim}10^2$을 보이는 광다이오드(photodiode)로서 동작한다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.165-165
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• 2010

GaInZnO는 투명 비정질 산화물 반도체로서 태양전지, 평판 액정 디스플레이, 잡음방지 코팅, 터치 디스플레이 패널, 히터, 광학 코팅 등 여러 응용에 쓰인다. 이 논문에서는 투명전자소자로 관심을 모으고 있는 GaInZnO의 전자적 그리고 전기적 특성을 측정하였다. GaInZnO 박막은 $SiO_2$ (100)/Si 기판위에 RF 마그네트론 스퍼터링 증착법으로 $Ga_2O_3:In_2O_3:ZnO$의 조성이 2:2:1로 된 타겟을 가지고 박막을 성장시켰다. 성장한 후에 RTP를 이용하여 30분간 열처리 하였다. GaInZnO의 전자적 특성을 나타내는 띠틈 및 실리콘 기판과의 원자가 띠 오프셋 값을 측정하였으며, 이 값들을 통해 GaInZnO박막과 실리콘 기판과의 띠 정렬도 수행하였다. 띠틈은 반사 전자 에너지 손실 분광법(REELS)을 이용하여 측정하였고, 원자가 띠 오프셋은 광전자 분광법(XPS)을 이용하여 측정하였다. 열처리 온도가 $400^{\circ}C$까지는 띠틈의 변화 및 XPS 결합에너지의 변화가 없는 것으로 보아 열적안정성이 우수함을 알 수 있다. 반면 $450^{\circ}C$에서의 띠틈이 감소하는 것으로 보아 $450^{\circ}C$에서는 열적안정성이 깨지는 것을 알 수 있다. GaInZnO 박막을 채널 층으로 하고 전극은 알루미늄(Al)으로 된 TFT를 제작하여 전기적 특성을 조사하였다. TFT 특성 결과 이동도가 약, subthreshold swing(S.S)이 약 1.5 V/decade, 점멸비가 약 $10^7$으로 측정되었다. 유리 위에 증착시킨 GaInZnO 박막의 투과율을 측정해본 결과 모든 시료가 가시광선 영역에서 80%이상의 투과율을 갖는 것으로 보아 투명전극소자로 응용이 가능하다는 것을 알 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.841-846
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• 2016

ZnO nanorods were grown on $SiO_2$ coated Si wafers and glass by the hydrothermal method. The structural and optical properties variation of ZnO nanorods as a function of growing time was studied. ~10 nm-thick ZnO thin films deposited on substrates by rf magnetron sputtering were employed as seed layers. Zinc nitrate hexahydrate (0.05 M) and hexamethylenetetramine (0.05 M) mixed in DI water were used as a reaction solution. ZnO nanorods were respectively grown for 30 min, 1 h, 2 h, 3 h, and 4 h by maintaining the reactor at $90^{\circ}C$. Crystallinity of ZnO nanorods was analyzed by X-ray diffraction, and the morphology of nanorods was observed by a field emission scanning electron microscope. Transmittance and absorbance were measured by a UV-Vis spectrophotometer, and energy band gap and urbach energy were obtained from the data. Photoluminescence measurements were carried out using Nd-Yag laser (266 nm).

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.319.1-319.1
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• 2016

Recently, the Al-doped ZnO (ZnO:Al) films are intensively used in thin film a-Si solar cell applications due to their high transmittance and good conductivity. The textured ZnO:Al films are used to enhance the light trapping in thin film solar cells. The wet etch process is used to texture ZnO:Al films by dipping in diluted acidic solutions like HCl or HF. During that process the glass substrate could be damaged by the acidic solution and it may be difficult to apply it for the inline mass production process since it has to be done outside the chamber. In this paper we report a new technique to control the surface morphology of RF-sputtered ZnO:Al films. The ZnO:Al films are textured with vaporized HF formed by the mixture of HF and H2SiO3 solution. Even though the surface of textured ZnO:Al films by vapor etching process showed smaller and sharper surface structures compared to that of the films textured by wet etching, the haze value was dramatically improved. We achieved the high haze value of 78% at the wavelength of 540 nm by increasing etching time and HF concentration. The haze value of about 58% was achieved at the wavelength of 800 nm when vapor texturing was used. The ZnO:Al film texture by HCl had haze ratio of about 9.5 % at 800 nm and less than 40 % at 540 nm. In addition to low haze ratio, the texturing by HCl was very difficult to control etching and to keep reproducibility due to its very fast etching speed.