• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.593-596
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• 1999

This paper presents a process optimization of antireflectiun (AR) coating on crystalline Si solar cells. Theoretical and experimental investigations were performed on a doble-layer AR(DLAR) coating of MgF$_2$/CeO$_2$, We investigated CeO$_2$ films as an All layer because they hale a proper refractive index of 2.46 and demonstrate the same lattice constant as Si substrate. RF sputter grown CeO$_2$ film showed strong dependence on a deposition temperature. The CeO$_2$ film deposited at 400 $^{\circ}C$ exhibited a strong (111) preferred orientation and the lowest surface roughness of 6.87 $\AA$. Refractive index of MgF$_2$ film was measured as 1.386 for the most of growth temperature. An optimized DLAR coating showed a reflectance as low as 2.04 % in the wavelengths ranged from 0.4 7m to 1.1 7m. We achieved the efficiencies of solar cells greater than 15% with 3.12 % improvement with DLAR coatings . Further details on MgF$_2$, CeO$_2$ films, and cell fabrication Parameters are presented in this paper.

• Proceedings of the IEEK Conference
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• 2004.06a
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• pp.213-216
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• 2004

This paper describes design and implementation of the 5.5 GHz VCO with parallel-branch inductors using 0.8${\mu}m$ SiGe HBT process technology. The proposed parallel-branch inductor shows $12 \%$ improvement in quality factor in comparison with the conventional inductor. A phase noise of -93 dBc/Hz is measured at 100 kHz offset frequency, and the harmonics in the VCO are suppressed less than -23 dBc. The single-sided output power of the VCO is -6.5$\pm$1.5 dBm. The manufactured VCO consumes 15.0 mA with 2.5 V supply voltage. Its chip areas are 1.8mm ${\times}$ 1.2mm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.657-662
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• 2003

This paper presents a new fabrication method of selective SiGe epitaxial growth at 650 $^{\circ}C$ on (100) silicon wafer with oxide patterns by reduced pressure chemical vapor deposition. The new method is characterized by a cyclic process, which is composed of two parts: initially, selective SiGe epitaxy layer is grown on exposed bare silicon during a short incubation time by SiH$_4$/GeH$_4$/HCl/H$_2$system and followed etching step is achieved to remove the SiGe nuclei on oxide by HCl/H$_2$system without source gas flow. As a result, we noted that the addition of HCl serves not only to reduce the growth rate on bare Si, but also to suppress the nucleation on SiO$_2$. In addition, we confirmed that the incubation period is regenerated after etching step, so it is possible to grow thick SiGe epitaxial layer sustaining the selectivity. The effect of the addition of HCl and dopants incorporation was investigated.

• Journal of the Korean Magnetics Society
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• v.21 no.4
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• pp.127-131
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• 2011

In this paper, we study the electronic and magnetic properties of Cr substituted SiTe in the rock-salt structure compound using the full potential linearized augmented plane wave method within the generalized gradient approximation to the exchange correlation potential. Two stoichiometries are studied: $CrSi_3Te_4$ with 25 %, and $CrSiTe_2$ with 50 % Cr substitution. We found, from the total energy calculations, that the equilibrium lattice constant for cubic $CrSi_3Te_4$ is 11.64 a.u. and a = 7.89 a.u. and c = 11.13 a.u. for tetragonal $CrSiTe_2$. The integer value of the calculated magnetic moment per unit cell, $4{\mu}_B$ for $CrSiTe_2$ suggests that this compound is halfmetallic. The magnetic moment per unit cell for $CrSi_3Te_4$ is slightly larger than $4{\mu}_B$. The magnetic moment on Cr atoms are 3.61 and $3.62{\mu}_B$ in the $CrSi_3Te_4$ and $CrSiTe_2$, respectively. The presence of Cr atoms causes that the other atoms become slightly magnetized in both compounds. The electronic properties and the magnetism are discussed with the calculated spin-polarized density of states.

• Transactions on Electrical and Electronic Materials
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• v.11 no.6
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• pp.261-265
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• 2010

In this paper, we attempt to improve the electrical characteristics of epoxy resin at high temperature (above $80^{\circ}C$) by adding magnesium oxide (MgO), which has high thermal conductivity. Scanning electron microscopy (SEM) of the dispersion of specimens with added MgO reveals that they are evenly dispersed without concentration. The dielectric breakdown characteristics of $SiO_2$ and MgO nanocomposites are tested by measurements at different temperatures to investigate the filler's effect on the dielectric breakdown characteristics. The dielectric breakdown strength of specimens with added $SiO_2$ decreases slowly below $80^{\circ}C$ (low temperature) but decreases rapidly above $80^{\circ}C$ (high temperature). However, the gradient of the dielectric breakdown strength of specimens with added MgO is slow at both low and high temperatures. The dielectric breakdown strength of specimens with 0.4 wt% $SiO_2$ is the best among the specimens with added $SiO_2$, and that of specimens with 3.0 wt% and 5.0 wt% MgO is the best among those with added MgO. Moreover, the dielectric strength of specimens with 3.0 wt% MgO at high temperatures is approximately 53.3% higher than that of specimens with added $SiO_2$ at $100^{\circ}C$, and that of specimens with 5.0 wt% of MgO is approximately 59.34% higher under the same conditions. The dielectric strength of MgO is believed to be superior to that of $SiO_2$ owing to enhanced thermal radiation because the thermal conductivity rate of MgO (approximately 42 $W/m{\cdot}K$) is approximately 32 times higher than that of $SiO_2$ (approximately 1.3 $W/m{\cdot}K$). We also confirmed that the allowable breakdown strength of specimens with added MgO at $100^{\circ}C$ is within the error range when the breakdown probability of all specimens is 40%. A breakdown probability of up to 40% represents a stable dielectric strength in machinery and apparatus design.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.42 no.1
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• pp.64-73
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• 2010

This study was conducted to modify the surface properties of papers by formation of hydrophobic self-assembled monolayer(SAM) on paper surface with silanes. A base paper I(0.5% AKD) and base paper II(1.0-1.5% AKD) were reacted with silanes(PFDTES, DMDCS, MODDCS) by immersion method and vapor deposition method. Hydrophobic SAMs(contact angle value>$120^{\circ}C$) were obtained on all papers after treatment with $10^{\mu}l$ PFDTES for 15min, with $50^{\mu}l$ DMDCS for 30min, with $50^{\mu}l$ MODDCS for 300min. When applying PFDTES to paper surface, lower silane concentration and shorter reaction time were required, whereas MODDCS with long alkyl chain required the longest reaction time of 300min. The st$\ddot{o}$ckight sizing degree of silane treated papers were increased between 105sec(base paper I) and 130sec(base paper II). The wet tensile strength of PFDTES-treated base papers(I, II) increased by 10-34% after SAM formation. However, the wet tensile strength of the DMDCS-treated base paper(I) was found to decrease from 0.067kN/m to 0.038kN/m; this may due to the cellulose degrading as a result of generated hydrogen chloride when hydroxyl group of cellulose were reacted with DMDCS. No apparent changes of PPS roughness on silane-treated papers are observed. The ATR-IR spectrum showed absorption peak located at 465 and 1200cm-1 which can be assigned to the Si-O-C asymmetric stretching and Si-O-C bonds, respectively.

• Journal of Welding and Joining
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• v.32 no.6
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• pp.29-34
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• 2014

This paper has an purpose to study the effect of C on the toughness of YS 460 MPa FCAW weld metal. These effects were evaluated by charpy impact and CTOD test about 4 FCAW weld metal containing various C and Si content in relation to microstructure. Increase of C content was helpful to increase AF volume fraction and reduce PF(G) and FS volume fraction by increasing super cooling rate for ferrite transformation. Also, Increase of C content up to 0.045wt% made the strength and impact toughness higher by increasing AF volume fraction. The weld metal containing higher C content indicated higher CTOD value. It is because the volume fraction of PF(G) and FS, can play a role as crack initiation site, was reduced. Effect of C on the strength and elongation of weld metal was higher with an increase of Si contents.

• IE interfaces
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• v.13 no.3
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• pp.431-437
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• 2000

This paper refers to the flow of products from supplier to discount retailers(DRs). Discount retailers prefer frequent delivery of small amount because of limited storage space, while suppliers prefer less frequent delivery of larger amount in order to save transportation cost. In this paper we propose a heuristic algorithm to determine the amount of order and the frequency of delivery which decreases the expected length of stockout. We also evaluate various order policies for Vendor Managed Inventory(VMI) system using simulation with real data.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.514-519
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• 2000

This paper describes on the temperature characteristics of a SDB(silicon-wafer direct bonding) SOI(silicon-on-insulator) Hall sensor. Using the buried oxide $SiO_2$as a dielectrical isolation layer a SDB SOI Hall sensor without pn junction has been fabricated on the Si/ $SiO_2$/Si structure. The Hall voltage and the sensitivity of the implemented SOI Hall sensor show good linearity with respect to the applied magnetic flux density and supplied current. In the temperature range of 25 to 30$0^{\circ}C$ the shifts of TCO(temperature coefficient of the offset voltage) and TCS(temperature coefficient of the product sensitivity) are less than $\pm$6.7$\times$10$_{-3}$ and $\pm$8.2$\times$10$_{-4}$$^{\circ}C$ respectively. These results indicate that the SDB SOI structure has potential for the development of a silicon Hall sensor with a high-sensitivity and high-temperature operation.

• Journal of the Korean Solar Energy Society
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• v.36 no.2
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• pp.53-63
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• 2016

Building Integrated Photovoltaic (BIPV) is one of the best ways to generate electric power using the solar energy, which is clean and inexhaustible energy resources. The most of BIPV modules have the form of GtoG (Glass to Glass) photovoltaic in building applications. Degradation leading to failure in photovoltaic modules is very important factor in BIPV modules. This paper analyzed the performance of various BIPV modules through outdoor exposure tests. Performance of three BIPV modules(c-Si type, a-Si type and DSSC type) with three installation angles influenced by sun light, outdoor temperature, and wind velocity was monitored and analyzed. As a result, c-Si type BIPV module outperforms other BIPV modules(a-Si type). In terms of power efficiency of the module, the installed angle of $45^{\circ}$ is better than others(90 degree, 0 degree). In addition, more realistic data of various BIPV system performance could be available through the field test and integrated building test. In this study, relationship of the BIPV system is identified module's installation angle, power generation, architectural performance, etc.