• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.55-55
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• 2009

Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility (${\sim}900cm^2/Vs$). These electronic properties allow high breakdown voltage, high frequency, and high temperature operation compared to Silicon devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances. the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. In this paper, we report the effect of the interface states ($Q_s$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. The result is a low-loss transient characteristic at low $Q_s$. Based on the simulation results, the DMOSFETs exhibit the turn-on time of 10ns at short channel and 9ns at without the interface charges. By reducing $SiO_2/SiC$ interface charge, power losses and switching time also decreases, primarily due to the lowered channel mobilities. As high density interface states can result in increased carrier trapping, or recombination centers or scattering sites. Therefore, the quality of $SiO_2/SiC$ interfaces is important for both static and transient properties of SiC MOSFET devices.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1555-1558
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• 2002

This paper presents deposition and characterizations of microcrystalline silicon(${\mu}c$-Si:H) films prepared by hot wire chemical vapor deposition at substrate temperature below $300^{\circ}C$. The $SiH_4$ Concentration$[F(SiH_4)/F(SiH_4)+F(H_2)]$ is critical parameter for the formation of Si films with microcrystalline phase. At 6% of silane concentration, deposited intrinsic ${\mu}c$-Si:H films shows sufficiently low dark conductivity and high photo sensitivity for solar cell applications. P-type ${\mu}c$-S:H films deposited by Hot-Wire CVD also shows good electrical properties by varying the rate of $B_2H_6$ to $SiH_4$ gas. The solar cells with structure of Al/nip ${\mu}c$-Si:H/TCO/glass was fabricated with sing1e chamber Hot-Wire CVD. About 3% solar efficiency was obtained and applicability of HWCVD for thin film solar cells was proven in this research.

• Transactions on Electrical and Electronic Materials
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• 제18권4호
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• pp.199-202
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• 2017

Silicon carbide (SiC) is being spotlighted as a next-generation power semiconductor material owing to the characteristic limitations of the existing silicon materials. SiC has a wider band gap, higher breakdown voltage, higher thermal conductivity, and higher saturation electron mobility than those of Si. When using this material to implement Schottky barrier diode (SBD) devices, SBD-state operation loss and switching loss can be greatly reduced as compared to that of traditional Si. However, actual SiC SBDs exhibit a lower dielectric breakdown voltage than the theoretical breakdown voltage that causes the electric field concentration, a phenomenon that occurs on the edge of the contact surface as in conventional power semiconductor devices. Therefore in order to obtain a high breakdown voltage, it is necessary to distribute the electric field concentration using the edge termination structure. In this paper, we designed an edge termination structure using a field plate structure through oxide etch angle control, and optimized the structure to obtain a high breakdown voltage. We designed the edge termination structure for a 650 V breakdown voltage using Sentaurus Workbench provided by IDEC. We conducted field plate experiments. under the following conditions: $15^{\circ}$, $30^{\circ}$, $45^{\circ}$, $60^{\circ}$, and $75^{\circ}$. The experimental results indicated that the oxide etch angle was $45^{\circ}$ when the breakdown voltage characteristics of the SiC SBD were optimized and a breakdown voltage of 681 V was obtained.

• 한국전기전자재료학회논문지
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• 제18권7호
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• pp.594-599
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• 2005

In this paper, we report the properties of Mo metal employed as PMOS gate electrode. Mo on $SiO_2$ was observed to be stable up to $900^{\circ}C$ by analyzing the Interface with XRD. C-V measurement was performed on the fabricated MOS capacitor with Mo Bate on $SiO_2$. The stability of EOT and work-function was verified by comparing the C-V curves measured before and after annealing at 600, 700, 800, and $900^{\circ}C$. C-V hysteresis curve was performed to identify the effect of fired charge. Gate-injection and substrate-injection of carrier were performed to study the characteristics of $Mo-SiO_2$ and $SiO_2-Si$ interface. Sheet resistance of Mo metal gate obtained from 4-point probe was less than $10\;\Omega\Box$ that was much lower than that of polysilicon.

• 한국생산제조학회지
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• 제23권6호
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• pp.547-554
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• 2014

CVD SiC is a perfect material used for molds/dies in hot press molding of glass lens. In its fabrication process, nano-precision polishing is essential finally. For this purpose, a novel polishing method using MCF (Magnetic Compound Fluid) slurry is proposed. In this method, MCF slurry is supplied into a given gap between the workpiece and a MCF slurry carrier, and constrained within the polishing zone by magnetic forces from permanent magnet. In this paper, after an experimental rig used to actually realize the proposed method has been constructed, the fundamental polishing characteristics of CVD SiC such as the effects of process parameters including MCF slurry composition on work-surface roughness were experimentally investigated. As a result, nano-precision surface finish of CVD SiC was successfully attained with MCF slurry and the optimum process parameters for obtaining the smoothest work-surface were determined.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.409-412
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• 2004

Edge termination technique is essential fer the fabrication of high volage devices. A proper edge termination technique is also needed in the fabrication of Silicon Carbide power devices for obtaining a stable high blocking voltage properties. Among the many techniques, the field plate formation is the easiest one that can utilize it for commercial usage. The growth of thick thermal oxide is difficult for SiC, however. In this paper, 6A grade SiC schottky barrier diodes(SBD) were fabricated with field plate edge termination. The oxides which is field plate were formed various methods such as dry oxidation, 10% $N_2O$ nitrided oxidation and PECVD deposition. The reverse characteristics of the SiC SBD with various oxide field plate were investigated.

• 전기전자학회논문지
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• 제23권3호
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• pp.756-761
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• 2019

본 논문에서는 기존 4H-SiC SJ UMOSFET 구조의 p-pillar을 기존 UMOSFET의 shielding 영역 아래로 배치시키는 SC-SJ(Shielding Connected-Super Junction) UMOSFET 구조를 제안한다. 제안한 SC-SJ UMOSFET의 경우 p-pillar와 shielding 영역이 공존하여 산화막에서 전계에 의한 항복이 발생하지 않도록 하며, 이는 pillar의 도핑 농도 상승을 가능하게 한다. 결과적으로 온저항을 낮춤으로서 소자의 정적 특성을 개선한다. Sentaurus TCAD 시뮬레이션을 통해 기존 구조와 제안한 구조의 정적 특성을 비교, 분석하였다. 제안한 SC-SJ UMOSFET은 기존 구조에 비해 항복전압의 변화 없이 50% 감소된 온저항을 얻을 수 있다.

• 한국진공학회지
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• 제11권3호
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• pp.135-140
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• 2002

본 논문에서는 p-type (100)Si, (100)MgO 그리고 MgO/si 기판 위에 RF Magnetron sputtering 법으로 $Ba_{0.5}Sr_{0.5}TiO_3$(BST)박막을 증착하였다. BST 박막 증착 후 RTA(Rapid Thermal Annealing)를 이용하여 $600^{\circ}C$에서 산소분위기로 1분간 고온 급속 열처리를 하였다. 증착된 BST박막의 결정화를 조사하기 위해 XRD(X-Ray Diffraction)측정을 한 결과 모든 기판에서 (110) $Ba_{0.5}Sr_{0.5}TiO_3$(의 주피크가 관찰되어졌고, 열처리 후 재결정화에 기인하여 피크 세기가 증가함을 관찰할 수 있었다. Al 전극을 이용한 커패시터 제작 후 측정한 C-V(Capacitance-Voltage) 특성에서 각각의 기판에서 측정된 커패시턴스 값으로 계산된 유전율은 120(bare Si), 305(Mgo/Si) 그리고 310(MgO)이었다. 누설 전류 특성에서는 0.3 MV/cm이내의 인가전계에서 1 $\mu\textrm{A/cm}^2$ 이하의 안정된 값을 보여주었다. 결론적으로 MgO 버퍼층을 이용한 기판이 BST 박막의 증착을 위한 기판으로써 효과적임을 알 수 있었다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권5호
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• pp.339-343
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• 1999

This paper reports the characteristics of poly-Si TFT unitary CMOS circuits fabricated with various techniques, in order to investigate the optimum process conditions. The active films were deposited by PECVD and LPCVD using $SiH_4\; and\; Si_2H_6$ as source gas, and annealed by SPC and ELA methods. The impurity doping of the oource and drain electrodes was performed by ion implantation and ion shower. In order to investigate the AC characteristics of the poly-Si TFTs processed with various methods, we have examined the current driving characteristics of the polt-Si TFT and the frequency characteristics of 23-stage CMOS ring oscillators. Ithas been observed that the circuits fabricated using $Si_2H_6$ with low-temperature process of ELA exhibit high switching speed and current driving performances, thus suitable for real application of large area electronics.

• Nuclear Engineering and Technology
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• 제52권1호
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• pp.1-13
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• 2020

At present, the Department of Energy (DOE) in Unite State are directing the efforts of developing accident tolerant fuel (ATF) technology. As the first barrier of nuclear fuel system, the material selection of fuel rod cladding for ATFs is a basic but very significant issue for the development of this concept. The advanced cladding is attractive for providing much stronger oxidation resistance and better in-pile behavior under sever accident conditions (such as SBO, LOCA) for giving more coping time and, of course, at least an equivalent performance under normal condition. In recent years, many researches on in-plie or out-pile physical properties of some suggested cladding materials have been conducted to solve this material selection problem. Base on published literatures, this paper introduced relevant research backgrounds, objectives, research institutions and their progresses on several main potential claddings include triplex SiC, FeCrAl and MAX phase material Ti3SiC2. The physical properties of these claddings for their application in ATF area are also reviewed in thermohydraulic and mechanical view for better understanding and simulating the behaviors of these new claddings. While most of important data are available from publications, there are still many relevant properties are lacking for the evaluations.