• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.3
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• pp.139-144
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• 2003

A flat type micro gas sensor was fabricated on the p-type silicon wafer with low stress Si$_3$N$_4$, whose thickness is 2 ${\mu}{\textrm}{m}$, using MEMS technology. WO$_3$ thin film as a sensing material for detection of NO$_2$ gas was deposited using a tungsten target by sputtering method, followed by thermal oxidation at several temperatures (40$0^{\circ}C$-$600^{\circ}C$) for one hour. NO$_2$ sensitivities were investigated for the WO$_3$ thin films with different annealing temperatures. The highest sensitivity was obtained for the samples annealed at $600^{\circ}C$ when it was operated at 20$0^{\circ}C$. The results of XRD analysis showed the annealed samples had polycrystalline phase mixed with triclinic and orthorhombic structures. The sample exhibits higher sensitivity when the system has less triclinic structure. The sensitivities, $R_{gas}/R_{air},$ operating at 20$0^{\circ}C$ to 5 ppm NO$_2$ of the sample annealed at $600^{\circ}C$ were approximately 90.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.335-335
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• 2013

최근 다기능 소재의 개발이 필요함에 따라 서로 상반되는 2가지 이상의 물성을 동시에 구현할 수 있는 소재의 개발이 요구되고 있다. 4 성분계 물질을 단일 타겟으로 제조함으로써 다수의 타겟을 이용하는 기존 PVD 방법의 복잡성과 재형성 등의 문제점을 해결하고 다기능성을 구현할 수 있는 코팅막을 제조할 수 있게 된다. 본 연구에서는 제조된 4 성분계 모물질을 UBM 최근 다기능 소재의 개발이 필요함에 따라 서로 상반되는 2가지 이상의 물성을 동시에 구현할 수 있는 소재의 개발이 요구되고 있다. 4 성분계 물질을 단일 타겟으로 제조함으로써 다수의 타겟을 이용하는 기존 PVD 방법의 복잡성과 재형성 등의 문제점을 해결하고 다기능성을 구현 할 수 있는 코팅막을 제조할 수 있게 된다. 본 연구에서는 제조된 4 성분계 모물질을 UBM 스퍼터링법을 이용하여 질화 공정을 도출하였고 질소 함량에 따른 물리적 특성 및 박막의 특성에 대해 연구하였다. BMG (Bulk Metallic Glass) 타겟을 이용하여 마그네트론 스퍼터링법으로 박막을 코팅하였다. 시편은 Si wafer, SUS 그리고 부식 특성 평가를 실시하기 위하여 냉연강판을 사용하였다. 시편은 아세톤, 알코올로 각각 10분간 초음파 세척한 후 진공장비에 장착하여 Ar 분위기에서 글로우 방전으로 청정을 30분간 실시하였다. 시편청정이 끝나면 ~$10^{-6}$ Torr까지 진공 배기를 실시하고 Ar 가스를 주입하여 2.5 mTorr로 진공도를 유지하여 스퍼터링으로 박막 코팅을 실시하였다. 스퍼터링 파워는 약 0.6 kW (2.0 A)으로 고정하였고 질소 유량은 0~10 SCCM으로 변화시켜 BMG 박막을 코팅하였다. 질소가 첨가된 BMG 박막에서는 시편의 색상이 노란빛으로 나타났으며 이것은 타겟의 조성 중 가장 많이 함유되어있는 Zr이 질화되어 색상의 변화가 일어난 것으로 판단된다. BMG 코팅을 위해서 진공용기로 주입한 질소의 유량이 소량인 경우에도 BMG 코팅층에 비교적 많은 양의 질소가 존재하였고 일정량 이상에서는 BMG 코팅층에 존재하는 질소의 양이 포화되는 현상을 보였다. 질소 유량 3, 4 SCCM의 BMG 코팅층에서 ZrN (111), ZrN (200) Peak이 관찰되었다. BMG 코팅층의 경도 측정결과 Bias 50 V 인가 시 ~22 Gpa로 경도가 가장 높았다. BMG 코팅층의 내부식 특성을 평가하기 위해 염수분무 시험을 실시하였고 ~$10{\mu}m$의 두께를 갖는 BMG 코팅층에서 염수분무 시작 후 48시간 만에 적청이 발생하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.116-117
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• 2006

We investigated selective emitter effect of Porous Silicon (PSI) as antireflection coatings (ARC). The thin PSi layer, less than 100nm, was electrochemically formed by electrochemical method in about $3{\mu}m$ thick $n^+$ emitter on single crystalline silicon wafer (sc-Si). The appropriate PSi formations for selective emitter effect were carried out a two steps. A first set of samples allowed to be etched after metal-contact processing and a second one to evaporate Ag front-side metallization on PSi layer, by evaluating the I-V features The PSi has reflectance less than 20% in wavelength for 450-1000nm and porosity is about 60%. The cell made after front-contact has improved cell efficiency of about in comparison with the one made after PSi. The observed increase of efficiency for samples with PSi coating could be explained not only by the reduction of the reflection loss and surface recombination but also by the increased short-circuit current (Isc) within selective emitter. The assumption was confirmed by numerical modeling. The obtained results point out that it would be possible to prepare a solar cell over 15% efficiency by the proposed simple technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.624-627
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• 2003

The BLT thin-films were one of the promising ferroelectric materials with a good leakage current and degradation behavior on Pt electrode. The BLT target was sintered at $1100^{\circ}C$ for 4 hours at the air ambient. $Bi_{3.25}La_{0.75}Ti_3O_{12}$ (BLT) thin-film deposited on $Pt/Ti/SIO_2/Si$ wafer by rf magnetron sputtering method. At annealed $700^{\circ}C$, (117) and (006) peaks appeared the high intensity. The hysteresis loop of the BLT thin films showed that the remanent polarization ($2Pr=Pr^+-Pr^-$) was $16uC/cm^2$ and leakage current density was $1.8{\times}10^{-9}A/cm^2$ at 50 kV/cm with coersive electric field when BLT thin-films were annealed at $700^{\circ}C$. Also, the thin film showed fatigue property at least up to $10^{10}$ switching bipolar pulse cycles under 7 V. Therefore, we induce access to optimum fabrication condition of memory device application by rf-magnetron sputtering method in this report.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.4
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• pp.342-349
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• 2009

This study investigated the growth characteristics of carbon nanotubes (CNTs) by changing a period of annealing time and a $C_{2}H_{2}/H_2$ flow ratio at temperature as low as $450^{\circ}C$ with inductively coupled plasma chemical vapor deposition. The 1-nm-thick Fe-Ni-Co alloy thin film served as a catalyst layer for the growth of CNTs, which was thermally evaporated on the 15-nm-thick Al underlayer deposited on the 50-nm-thick Ti diffusion barrier. The annealing at low temperature of $450^{\circ}C$ brought about almost no granulation of the catalyst layer, and the CNT growth was not affected by a period of annealing time. A study of changing the flow rate of $C_{2}H_{2}$ and $H_2$ showed that as the ratio of the $C_{2}H_{2}$ flow rate to the $H_2$ flow rate was lowered, the CNTs were grown to be longer With further decreasing the flow ratio, the length of CNTs reached the maximum and then became shorter. Under the optimized gas flow rates, we successfully synthesized CNTs with a uniform length over a 4-inch Si wafer at $450^{\circ}C$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.3 s.94
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• pp.253-259
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• 2005

In this paper, BaSrTiO$_{3}$(BST) thin film tunable interdigital capacitor using low cost silicon substrate instead of expensive single-crystalline substrate is presented. The tunable capacitor in which BST thin film is deposited by PLD has operation frequency and applied bias up to 4 GHz and 50 V, respectively. The maximum tunability in capacitance is found to be 30$\%$, for an applied field of 5 kV/cm at a bias of 50 V. Therefore, it has been shown that the BST microwave tunable capacitor can be integrated onto Si substrate.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.29-38
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• 1998

In this paper, we have induced a model for the growth and dissolution of oxygen precipitates which is generated during arbitrary thermal treatments or VLSI processes in CZ-grown silicon. Based on diffusion-limited growth law and detailed balance equilibrium theory, growth and dissolution rates are induced and inserted into a set of chemical rate equations and a Fokker-Planck equation. Then this is solved by numerical analysis. And because phenomenon at the silicon surface must be considered differently in various annealing conditions, in particular in $O_2$ ambient we have considered the growth model of SiO$_2$ at the surface of silicon wafer and the enhancement of oxygen solubility. By this method, oxygen depth profile and density distribution of oxygen precipitates are calculated more accurately than the other simulation results.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.135-135
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• 1999

It is well known that Raman spectroscopy is powerful tool in analysis of sp3/sp3 bonding fraction in diamond-like carbon(DLC) films. Raman spectra of DLC film is composed of D-peak centered at 1350cm-1 and G-peak centered at 1530cm-1. The sp3/sp3 fraction is qualitatively acquired by deconvolution method. However, in case of DLC film, it is generally observed that G-peak position shifts toward low wavenumber as th sp3 fraction increases. However, opposite results were frequently observed in ta-C films. ta-C film has much higher residual compressive stress due to its high sp3 fraction compared to the DLC films deposited by CVD method. Effect of residual stress on G-peak position is most recommendable parameter in Raman analysis of ta-C, due to its smallest fitting error among many parameters acquired by peak deconvolution of symmetric spectra. In current study, the effect of residual stress on Raman spectra was quantitatively evaluated by free-hang method. ta-C films of different residual stress were deposited on Si-wafer by modifying DC-bias voltage during deposition. The variation of the G-peak position along the etching depth were observed in the free-hangs of 20~30${\mu}{\textrm}{m}$ etching depth. Mathematical result based on Airy stress function, was compared with experimental results. The more reliable analysis excluding stress-induced shift was possible by elimination of the Raman shift due to residual compressiove stress.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.91-91
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• 1999

광소자 기술은 정보 전달 및 저장 기술의 지속적인 증가 요구에 따라 발전을 거듭하여 왔다. 특히 광통신 및 저장 기술에서 광원으로 사용되는 레이저 다이오드는 안정되면서 쉽게 제작할 수 있어야 한다. 이온 주입 방법은 반도체 공정에서 광범위하게 사용되는 공정이며 이미 소자측면에서 안정성이 확보되었다고 볼 수 있으나 대부분 메모리 등의 실리콘 반도체에서 이용되어 왔다. 최근에는 화합물 반도체 분야에서도 적용하는 예가 증가되고 있으나 광원으로 사용되는 레이저 다이오드의 경우는 우수한 품질의 반도체 층이 요구되며 따라서 damage가 큰 이온 주입 방법을 이용한 연구는 아직 많이 이루어져 있지 않다. 본 연구에서는 레이저 다이오드 구조의 성장측에 국부적으로 Fe 이온을 주입하여 도파로를 형성하여 광을 구속하여 도파시키는 동시에 전기적으로도 도파로 부분으로만 다이오드가 형성되도록 하고자 한다. 먼저 p층의 전기적 절연에 필요한 조건을 확보하기 위하여 CBE를 사용하여 Fe가 doping 된 SI-InP wafer 위에 p-InP (Be:5x1017 cm-3)층을 1.2$mu extrm{m}$ 성장한 후 ohmic 층으로 p-InGaAs (Be:1x1019 cm-3)을 0.1$\mu\textrm{m}$ 성장한 시료에 고에너지 이온 주입 장치를 사용하여 Fe 이온을 1MeV, 1.6meV의 에너지에 각각 1x1014cm-2, 2x1014cm-2 의 dose로 전면에 implant 하였다. 이 시료를 tube furnace에서 500, 600, $700^{\circ}C$각각 10분씩 annealing 한 후 재성장을 확인하기 위하여 DCXRD을 측정하였다. 그림 1은 DCXRD rocking curve로 annealing 하기 전 후의 In rich에서 side peak의 감소를 확인 할 수 있었는데 이는 damage가 어느 정도 복구되었음을 의미한다. 또한 절연 특성을 확인하기 위하여 ohmic metal을 증착하여 Hall 효과를 측정하였다. 그림 2에 보이는 것과 같이 annealing 온도가 증가함에 따라 면저항이 크게 증가함을 볼 수 있으며 이온 주입하기 전의 시료에 비해 104 이상의 저항을 갖을 수 있다. 향후 이러한 결과를 바탕으로 1.55$\mu\textrm{m}$ LD 구조에서 발진 특성을 관찰할 계획이다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.