• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.26-29
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• 2004

High density plasma fluorinated silicate glass (HDP FSG) is used as a gap fill film for metal-to-metal space because of many advantages. However, FSG films can cause critical problems such as bonding issue of top metal at package, metal contamination, metal peel-off, and so on. It is known that these problems are caused by fluorine penetration out of FSG film. To prevent it, FSG capping layers such like SRO (Silicon Rich Oxide) are needed. In this study, their characteristics and a capability to block fluorine penetration for various FSG capping layers are investigated. Normal stress and High stress due to denser film. While heat treatment to PETEOS caused lower blocking against fluorine penetration, it had insignificant effect on SiN. Compared with other layers, SRO using ARC chamber and SiN were shown a better performance to block fluorine penetration.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.9
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• pp.449-454
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• 2002

A rectangular straight microchannel, integrated with the resistance temperature detectors(RTDs) for temperature sensing and a micro-heater for generating the Temperature gradient along the channel, was fabricated. Its dimension is 57${\mu}{\textrm}{m}$(H)$\times$200${\mu}{\textrm}{m}$(W)$\times$48,050${\mu}{\textrm}{m}$(L), and RTDs were placed at the inner-channel wall. Si wafer was used as a substrate. For the fabrication of RTDs, 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, the glass wafer was bonded with Si wafer by anodic bonding, so that the RTDs are located inside the microchannel. Temperature coefficient of resistance(TCR) values of the fabricated Pt-RTDs were 2800~2950ppm$^{\circ}C$ and the variation of TCR value In the range of O~10$0^{\circ}C$ was less than 0.3％. Therefore, it was proved that the fabricated Pt-RTDs without annealing were excellent as temperature sensors. The temperature distribution in the microchannel was investigated as a function of mass flow rate and heating power. The temperature increase rate diminished with decreasing the applied power and increasing the mass flow rate. It was confirmed from the comparison with the simulation results that the temperature measured inside the microchannel is more accurate than measuring the temperature measured at the outer wall. The proposed temperature sensing method and microchannel are expected to be useful in microfluidics researches.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1921-1923
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• 2001

In this work, an array of resistance temperature detector(RTD) was fabricated inside the microchannel in order to investigate in-situ flow characteristics. A rectangular straight microchannel, integrated with RTD's for temperature sensing and a heat source for generating the temperature gradient along the channel. were fabricated with the dimension of $200{\mu}m(W){\times}{\mu}m(D){\times}$48mm(L), while RTD measured precise temperatures at the inside-channel wall. 4" $525{\pm}25{\mu}m$ thick P-type <100> Si wafer was used as a substrate. For the fabrication of RTDs. 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, glass wafer was bonded with Si wafer by anodic bonding, therefore RTD was located inside the microchannel. The temperature distribution inside the fabricated microchannel was obtained from 4 point probe measurements and Dl water is used as a working fluid. Temperature distribution inside the microchannel was measured as a function of mass flow rate and heat flux. As a result, precise temperatures inside the microchannel could be obtained. In conclusion, this novel temperature distribution measurement system will be very useful to the accurate analysis of the flow characteristics in the microchannel.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.479-486
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• 2007

Four point bending is used to study the dependences of bond strength of benzocyclobutene(BCB) bonded wafers and BCB thickness, the use of an adhesion promoter, and the materials being bonded. The bond strength depends linearly on BCB thickness, due to the thickness-dependent contribution of the plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The bond strength increases by about a factor of two with an adhesion promoter for both $2.6{\mu}m$ and $0.4{\mu}m$ thick BCB, because of the formation of covalent bonds between adhesion promoter and the surface of the bonded materials. The bond strength at the interface between a silicon wafer with deposited oxide and BCB is about a factor of three higher than that at the interface between a glass wafer and BCB. This difference in bond strength is attributed to the difference in Si-O bond density at the interfaces. At the interfaces between plasma enhanced chemical vapor deposited (PECVD) oxide coated silicon wafers and BCB, and between thermally grown oxide on silicon wafers and BCB, 12~13 and $15{\sim}16bonds/nm^2$ need to be broken. This corresponds to the observed bond energies, $G_0s$, of 18 and $22J/m^2$, respectively. Maximum 7~8 Si-O $bonds/nm^2$ are needed to explain the $5J/m^2$ at the interfaces between glass wafers and BCB.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.217-217
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• 2016

The amorphous InGaZnO (a-IGZO) is widely accepted as a promising channel material for thin-film transistor (TFT) applications owing to their outstanding electrical properties [1, 2]. However, a-IGZO TFTs have still suffered from their bias instability with illumination [1-4]. Up to now, many researchers have studied the sub-gap density of states (DOS) as the root cause of instability. It is well known that defect states can influence on the performances and stabilities of a-IGZO TFTs. The defects states should be closely related with the deposition condition, including sputtering power, and pressure. Nevertheless, it has not been reported how these defects are created during conventional RF magnetron sputtering. In general, during conventional RF magnetron sputtering process, negative oxygen ions (NOIs) can be generated by electron attachment in oxygen atom near target surface and then accelerated up to few hundreds eV by a self-bias; at this time, the high energy bombardment of NOIs induce defects in oxide thin films. Recently, we have reported that the properties of IGZO thin films are strongly related with effects of NOIs which are generated during the sputtering process [5]. From our previous results, the electrical characteristics and the chemical bonding states of a-IGZO thin films were depended with the bombardment energy of NOIs. And also, we suggest that the deep sub-gap states in a-IGZO as well as thin film properties would be influenced by the bombardment of high energetic NOIs during the sputtering process.In this study, we will introduce our novel technology named as Magnetic Field Shielded Sputtering (MFSS) process to prevent the NOIs bombardment effects and present how much to be improved the properties of a-IGZO thin film by this new deposition method. We deposited a-IGZO thin films by MFSS on SiO2/p-Si and glass substrate at various process conditions, after which we investigated the morphology, optical and electrical properties of the a-IGZO thin films.

• Korean Journal of Materials Research
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• v.22 no.2
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• pp.71-77
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• 2012

When a new bonding agent using coal ash is utilized as a substitute for cement, it has the advantages of offering a reduction in the generation of carbon dioxide and securing the initial mechanical strength such that the agent has attracted strong interest from recycling and eco-friendly construction industries. This study aims to establish the production conditions of new hardening materials using clean bottom ash and an alkali activation process to evaluate the characteristics of newly manufactured hardening materials. The alkali activator for the compression process uses a NaOH solution. This study concentrated on strength development according to the concentration of the NaOH solution, the curing temperature, and the curing time. The highest compressive strength of a compressed body appeared at 61.24MPa after curing at $60^{\circ}C$ for 28 days. This result indicates that a higher curing temperature is required to obtain a higher strength body. Also, the degree of geopolymerization was examined using a scanning electron microscope, revealing a micro-structure consisting of a glass-like matrix and crystalized grains. The microstructures generated from the activation reaction of sodium hydroxide were widely distributed in terms of the factors that exercise an effect on the compressive strength of the geopolymer hardening bodies. The Si/Al ratio of the geopolymer having the maximum strength was about 2.41.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.44 no.3
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• pp.211-218
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• 2018

Instant face lifting cosmetics contain various film forming agents for stretching the wrinkles on the skin surface. But, most of the film-forming polymers have sticky feels. And they are easily scrubbed out when skin is rubbed on. In this study, we focused on the influence of sodium silicate that has rapid film forming effect on skin surface and immediate wrinkle reducing effect. Sodium silicate, also known as water glass or soluble glass, is a compound containing sodium oxide and silica. Sodium silicate is a white powder that is readily soluble in water, producing an alkaline solution. Sodium silicate is stable in neutral and alkaline solutions. The sodium silicate solution hardens by drying in air and rapidly forms a thin film. When the solution is applied to the skin, the fine membrane coating is formed by water evaporation and ionic bond re-formation. It also makes the strong siloxane (Si-O) bonding on the skin surface. When these fixation properties are applied to cosmetics, they can give remarkable skin tightening effect. The sodium silicate solution can provide the lifting effect by forming a film on skin at a proper concentration. But, skin irritation may be caused with too high concentration of sodium silicate. We studied a desirable range of the sodium silicate concentration and combination with other fixatives for skin care formulation that has no sticky feels and no scrubbing out phenomenon. Immediate lifting gel was developed by using sodium silicate and various thickening systems. Among of the various thickeners, aluminum magnesium silicate showed the best compatibility with sodium silicate for rapid lifting effect. This instant physical lifting gel was confirmed as a low stimulating formula by skin clinical test.