Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2004.04b
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- Pages.26-29
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- 2004
Fluorine Penetration Characteristics on Various FSG Capping Layers
FSG Capping 레이어들에서의 플루오르 침투 특성
- Lee, Do-Won (Chung-Ang University) ;
- Kim, Nam-Hoon (Chung-Ang University) ;
- Kim, Sang-Yong (DongbuAnam Semiconductor) ;
- Eom, Joon-Chul (Seoul-Jeongsu Polytechnic College) ;
- Chang, Eui-Goo (Chung-Ang University)
- Published : 2004.04.24
Abstract
High density plasma fluorinated silicate glass (HDP FSG) is used as a gap fill film for metal-to-metal space because of many advantages. However, FSG films can cause critical problems such as bonding issue of top metal at package, metal contamination, metal peel-off, and so on. It is known that these problems are caused by fluorine penetration out of FSG film. To prevent it, FSG capping layers such like SRO (Silicon Rich Oxide) are needed. In this study, their characteristics and a capability to block fluorine penetration for various FSG capping layers are investigated. Normal stress and High stress due to denser film. While heat treatment to PETEOS caused lower blocking against fluorine penetration, it had insignificant effect on SiN. Compared with other layers, SRO using ARC chamber and SiN were shown a better performance to block fluorine penetration.