• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.126-132
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• 2011

Fatigue cracks of the turbocharger are often observed for high performance engines under thermal shock tests. Maximum exhaust gas temperature of recently developed gasoline engines could reach approximately $950^{\circ}C$. It's very important to estimate transient temperature histories during thermal shock cycles to predict the stress and the fatigue life of the turbocharger. With these temperature profiles, temperature-dependent material properties and boundary conditions, we could identify critical locations by the application of finite element simulation technologies. In this paper, we applied the reliable analysis approach to the actual turbocharger to predict the weak locations due to the repetitions of plastic strains and compared the results with the crack locations under physical engine test.

• Journal of Applied Reliability
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• v.13 no.3
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Proceedings of the KSEE Conference
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• 2006.10a
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• pp.119-140
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• 2006

The rock excavation work by doing blasting breaks the rock by using a shock pressure and gas pressure produced when explosive explodes and the shock wave by shock pressure propagated three-dimensionally from the exploding center is on the decrease notably to the distance, however, $0.5{\sim}20%$ of energy produced by blasting propagates into the ground outside a crack zone by the shape of an elastic wave, on the ground it appears as a ground vibration with a seismic amplitude and a seismic cycle, it is called a blasting vibration. on the other side, what propagated in the air is called a blasting sound. The blasting sound of both means the things which the shock sound within the range the audible frequency($20{\sim}20000Hz$) of the elastic wave in the air influences the response system of a human body, it doesn't harm physically to any structures but influences unreasonably a work accomplishment, such as a work discontinuance due to the outbreak of a public complaint by a mental pain, reduction of a blasting scale, etc.. So, this study is examined at about 20 sites on the installation time and method of soundproofing facilities for reduction of the sound accompanied with a tunnel blasting work.

• Journal of the Korean Ceramic Society
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• v.28 no.1
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• pp.11-18
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• 1991

A precipitation method, one of the most effective liquid phase reaction methods, was adopted in order to prepare high-tech Al2O3/ZrO2 composite ceramics, and the effects of stress-induced phase transformation of ZrO2 on thermal shock behavior of Al2O3-ZrO2 ceramics were investigated. Al2(SO4)3.18H2O, ZrOCl2.8H2O and YCl3.6H2O were used as starting materials and NH4OH as a precipitation agent. Metal hydroxides were obtained by single precipitation(process A) and co-precipitation(process B) method at the condition of pH=7, and the composition of Al2O3-ZrO2 composites was fixed as Al2O3-15v/o ZrO2(+3m/o Y2O3). Critical temperature difference showing rapid strength degradation by thermal shock showed higher value in Al2O3/ZrO2 composites(process A : 20$0^{\circ}C$, process B : 215$^{\circ}C$) than in Al2O3(175$^{\circ}C$). The improvement of thermal shock property for Al2O3/ZrO2 composites was mainly due to the increase of strength at room temperature by adding ZrO2. The strength degradation was more severe for the sample with higher strength at room temperature. Crack initiation energies by thermal shock showed higher values in Al2O3/ZrO2 composites than in Al2O3 ceramics due to increase of fracture toughness by ZrO2.

• Structural Engineering and Mechanics
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• v.33 no.6
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• pp.697-708
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• 2009

Stresses are solved for two parallel cracks in an infinite orthotropic plate during passage of incoming shock stress waves normal to their surfaces. Fourier transformations were used to reduce the boundary conditions with respect to the cracks to two pairs of dual integral equations in the Laplace domain. To solve these equations, the differences in the crack surface displacements were expanded to a series of functions that are zero outside the cracks. The unknown coefficients in the series were solved using the Schmidt method so as to satisfy the conditions inside the cracks. The stress intensity factors were defined in the Laplace domain and were inverted numerically to physical space. Dynamic stress intensity factors were calculated numerically for selected crack configurations.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.47-52
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.1453-1458
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• 2006

KTX Railway rolling stock wheel run its course to corrode, deteriorate and wear away through out the time. So it is natural that the performance and ability of wheel gets declined. The frequency characteristic analysis were accomplished to above trend and shock wave flow to wheels were examined. The result will be used to find Railway rolling stock wheel crack and maintenance method hereafter.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.29-33
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• 2002

In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.