• Journal of Electrical Engineering and Technology
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• v.1 no.3
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• pp.308-312
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• 2006

The inductance difference between conducting layers of high-Tc superconducting (HTSC) power transmission cable causes the current sharing of each conducting layer to be unequal, which decreases the current transmission capacity of HTSC power cable. Therefore, the design for even current sharing in HTSC power transmission cable is required. In this paper, we investigated the current distribution of HTSC power cable with a shield layer dependent on the pitch length and the winding direction of each layer. To analyze the effect of the shield layer on the current sharing of the conducting layers of HTSC power cable, the current distribution of HTSC power cable without a shield layer was compared with the case of HTSC power cable with a shield layer. It could be found through the analysis from the computer simulations that the shield layer of HTSC power cable could be contributed to the improvement of current distribution of conducting layers at the specific pitch length and the winding direction of conducting layer. The result and discussion for the current distribution calculated for HTSC power transmission cable with a shield layer were presented and compared with the cable without a shield layer.

• Journal of Astronomy and Space Sciences
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• v.41 no.1
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• pp.17-23
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• 2024

The safety of electronic components used in aerospace systems against cosmic rays is one of the most important requirements in their design and construction (especially satellites). In this work, by calculating the dose caused by proton beams in geostationary Earth orbit (GEO) orbit using the MCNPX Monte Carlo code and the MULLASSIS code, the effect of different structures in the protection of cosmic rays has been evaluated. A multi-layer radiation shield composed of aluminum, water and polyethylene was designed and its performance was compared with shielding made of aluminum alone. The results show that the absorbed dose by the simulated protective layers has increased by 35.3% and 44.1% for two-layer (aluminum, polyethylene) and three-layer (aluminum, water, polyethylene) protection respectively, and it is effective in the protection of electronic components. In addition to that, by replacing the multi-layer shield instead of the conventional aluminum shield, the mass reduction percentage will be 38.88 and 39.69, respectively, for the two-layer and three-layer shield compared to the aluminum shield.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.3
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• pp.273-279
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• 2006

High-$T_c$ superconducting (HTSC) power cable is one of the interesting parts in power application using HTSC wire. However, its stacked structure makes the current distribution between conducting layers non-uniform due to difference between self inductances of conducting layers and mutual inductances between two conducting layers, which results in lower current transmission capacity of HTSC power cable. In this paper, the transport current distribution between conducting layers was investigated through the numerical analysis for the equivalent circuit of HTSC power cable with a shield layer, and compared with the case of without a shield layer. The transport current distribution due to the increase of the contact resistance in each layer was improved. However, its magnetization loss increased as the contact resistance increased. It was confirmed from the analysis that the shield layer was contributed to the improvement of the current distribution between conducting layers if the winding direction and the pitch length were properly chosen.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.535-538
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• 2004

Superconducting transmission power cable is one of interesting parts in power application using high temperature superconducting wire. One of important parameters in high-temperature superconduting (HTSC) cable design is transport current distribution because it is related with current transmission capacity and AC loss. In this paper, the transport current distribution at conducting layers was investigated through the analysis of the equivalent circuit for HTSC power cable with shield layer and compared with the case of without shield layer. The transport current distribution due to the pitch lenght was improved in the case of HTSC power cable with shield layer from the analysis.

• Proceedings of the KIEE Conference
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• 2004.04a
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• pp.12-14
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• 2004

Superconducting transmission power cable is one of interesting parts in power application using high temperature superconducting wire. One of import ant parameters in high-temperature superconduting (HTSC) cable design is transport current distribution because it is related with current transmission capacity and AC loss. In this paper, the transport current distribution at conducting layers was investigated through the analysis of the equivalent circuit for HTSC power cable with shield layer and compared with the case of without shield layer. The transport current distribution due to of the contact resistance and the pitch was improved in the case of HTSC power cable with shield layer from the analysis.

• Geomechanics and Engineering
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• v.36 no.2
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• pp.131-143
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• 2024

Shield tunneling construction commonly crosses underground pipelines in urban areas, resulting in soil loss and followed deformation of grounds and pipelines nearby, which may threaten the safe operation of shield tunneling. This paper investigated the pipeline deformation caused by double curved shield tunnels in soil-rock composite stratum in Nanjing, China. The stratum settlement equation was modified to consider the double shield tunneling. Moreover, a three dimensional finite element model was established to explore the effects of hard-layer ratio, tunnel curvature radius, pipeline buried depth and other influencing factors. The results indicate the subsequent shield tunnel would cause secondary disturbance to the soil around the preceding tunnel, resulting in increased pipeline and ground surface settlement above the preceding tunnel. The settlement and stress of the pipeline increased gradually as buried depth of the pipeline increased or the hard-layer ratio (the ratio of hard-rock layer thickness to shield tunnel diameter within the range of the tunnel face) decreased. The modified settlement calculation equation was consistent with the measured data, which can be applied to the settlement calculation of ground surface and pipeline settlement. The modified coefficients a and b ranged from 0.45 to 0.95 and 0.90 to 1.25, respectively. Moreover, the hard-layer ratio had the most significant influence on the pipeline settlement, but the tunnel curvature radius and the included angle between pipeline and tunnel axis played a dominant role in the scope of the pipeline settlement deformation.

• 한국초전도학회:학술대회논문집
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• v.14
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• pp.47-47
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• 2004

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.4
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• pp.470-480
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• 2016

The reversal of a silicon chip to find out its security structure is common and possible at the present time. Thanks to reversing, it is possible to use a probing attack to obtain useful information such as personal information or a cryptographic key. For this reason, security-related blocks such as DES (Data Encryption Standard), AES (Advanced Encryption Standard), and RSA (Rivest Shamir Adleman) engines should be located in the lower layer of the chip to guard against a probing attack; in this regard, the addition of a silicon-surface-protection layer onto the chip surface is a crucial protective measure. But, for manufacturers, the implementation of an additional silicon layer is burdensome, because the addition of just one layer to a chip significantly increases the overall production cost; furthermore, the chip size is increased due to the bulk of the secure logic part and routing area of the silicon protection layer. To resolve this issue, this paper proposes a practical silicon-surface-protection method using a metal layer that increases the security level of the chip while minimizing its size and cost. The proposed method uses a shift register for the alternation and variation of the metal-layer data, and the inter-connection area is removed to minimize the size and cost of the chip in a more extensive manner than related methods.

• Proceedings of the Korean Geotechical Society Conference
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• 2002.10a
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• pp.319-326
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• 2002

During the construction period of submarine shield tunnel, which is built firstly in very soft marine clay layer 40m deep in Korea, wide range problems were encountered such as safe launching against high earth pressure at shield entrance, technique of shield face pressure control when passing through complex multi-layered soils This paper introduces successful construction practice through development of state-of-the-art construction method and field monitoring.

• Proceedings of the KSR Conference
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• 2010.06a
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• pp.1500-1505
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• 2010

The objective of this study is controlling of the large diameter Shield TBM excavation for subway tunnels. In this paper, it will focus on the selection of Shield TBM and the problems of excavation due to unusual abrasion of the Disk Cutters and the distorted Cutter Mounts, in mixed layer of soil in below and hard rock in above, and in rock layer. And also, it will be discussed that the type of ground improvement to change and repair the Disk Cutters and the distorted Cutter Mounts, Advance Rate, Cutter Torque, etc. The results of this study will be using controlling of the excavation in various large diameter Shield TBM for subway tunnels.