• 센서학회지
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• 제24권3호
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• pp.208-213
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• 2015

The purpose of this study is to optimize the design of a capacitive pressure sensor element using the simulation of electrical characteristics. The simulation of the ceramic sensor diaphragm ($Al_2O_3$) was performed by permitting pressure to change the curvature of the diaphragm. The pressure capacitance ($C_P$) was increased from 19.63 pF to 15.26 pF by applying pressure because the distance between the electrodes has been changed from $30{\mu}m$ to $15{\mu}m$. When the thickness of the diaphragm was changed to 0.46~0.52 mm, a larger capacitance change showed in accordance with the reduced thickness, which means an increase of sensitivity. However, considering the viewpoint of the signal linearity, it was selected for the optimum thickness of the diaphragm to 0.50 mm. The designed sensor element based on simulated results was tested to measure the output characteristics. Comparing of simulated and measured results, there was a margin of error of approximately 2%.

• 센서학회지
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• 제20권6호
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• pp.393-399
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• 2011

In this paper, we designed and fabricated the novel air flow sensor using air drag force, which can be applied to the low air flow detection. To measure the low air flow, we should enlarge the air drag force and the output signal at the given air flow. The paddle structure is applied to the device, and the device is vertically located against the air flow to magnify the air drag force. We also adapt the corrugation structure to improve the output signals on the given air velocity. The device structure is made up of the silicon nitride layer and the output signal is measured with the piezoresistive layer. The output signals from the corrugated device show the better measurement sensitivity and the response time than that of flat one. The repeated measurement also shows the stabilized signals.

• 센서학회지
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• 제24권3호
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• pp.159-164
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• 2015

Solid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제7권5호
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• pp.967-979
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• 2013

Now a day, Wireless Sensor Networks (WSNs) are being widely used in different areas one of which is healthcare services. A wireless medical sensor network senses patient's vital physiological signs through medical sensor-nodes deployed on patient's body area; and transmits these signals to devices of registered medical professionals. These sensor-nodes have low computational power and limited storage capacity. Moreover, the wireless nature of technology attracts malicious minds. Thus, proper user authentication is a prime concern before granting access to patient's sensitive and private data. Recently, P. Kumar et al. claimed to propose a strong authentication protocol for healthcare using Wireless Medical Sensor Networks (WMSN). However, we find that P. Kumar et al.'s scheme is flawed with a number of security pitfalls. Information stored inside smart card, if extracted, is enough to deceive a valid user. Adversary can not only access patient's physiological data on behalf of a valid user without knowing actual password, can also send fake/irrelevant information about patient by playing role of medical sensor-node. Besides, adversary can guess a user's password and is able to compute the session key shared between user and medical sensor-nodes. Thus, the scheme looses message confidentiality. Additionally, the scheme fails to resist insider attack and lacks user anonymity.

• Smart Structures and Systems
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• 제16권4호
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• pp.607-621
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• 2015

Wireless sensor technology has been opened up numerous opportunities to advanced health and maintenance monitoring of civil infrastructure. Compare to the traditional tactics, it offers a better way of providing relevant information regarding the condition of building structure health at a lower price. Numerous domestic buildings, especially longer-span buildings have a low frequency response and challenging to measure using deployed numbers of sensors. The way the sensor nodes are connected plays an important role in providing the signals with required strengths. Out of many topologies, the dense and sparse topologies wireless sensor network were extensively used in sensor network applications for collecting health information. However, it is still unclear which topology is better for obtaining health information in terms of greatest components, node's size and degree. Theoretical and computational issues arising in the selection of the optimum topology sensor network for estimating coverage area with sensor placement in building structural monitoring are addressed. This work is an attempt to fill this gap in high-rise building structural health monitoring application. The result shows that, the sparse topology sensor network provides better performance compared with the dense topology network and would be a good choice for monitoring high-rise building structural health damage.

• 한국산학기술학회논문지
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• 제14권10호
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• pp.4799-4804
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• 2013

저탄소 녹색 환경 조성 및 성장을 위한 그린 IT 기술 개발은 미래형 신기술 분야이다. 따라서, 본 논문에서는 응용 RFID 모듈에 대한 보안 데이터를 생성하여 건물 환경에 대한 통합 감시 및 관리를 할 수 있는 스마트 그린빌딩 조성용 다기능 센서 통합 모듈 시스템을 개발하였다. 논문에서 구현한 다기능 센서 통합 모듈 시스템은 열 감지센서, 온도 감지센서, 스모그 감지센서, CO2 감지센서, O2 감지센서, 장력 감지센서 및 파손 감지센서를 통합 모듈로 개발하고 이를 실시간으로 모니터링 해줌으로써 건물 내부 환경에 대한 스마트 그린빌딩 환경을 구현할 수 있는 시스템을 설계, 개발하였다.

• International journal of advanced smart convergence
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• 제5권1호
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• pp.1-7
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• 2016

Recently, introduced a cloud computing technology to the IT industry, smart phones, it has become possible connection between mobility terminal such as a tablet PC. For dissemination and popularization of movable wireless terminal, the same operation have focused on a viable mobile cloud in various terminal. Also, it evolved Wireless Sensor Network(WSN) technology, utilizing a Body Sensor Network(BSN), which research is underway to build large Ubiquitous Sensor Network(USN). BSN is based on large-scale sensor networks, it integrates the state information of the patient's body, it has been the need to build a managed system. Also, by transferring the acquired sensor information to HIS(Hospital Information System), there is a need to frequently monitor the condition of the patient. Therefore, In this paper, possible sensor information exchange between terminals in a mobile cloud environment, by integrating the data obtained by the body sensor HIS and interoperable data DBaaS (DataBase as a Service) it will provide a base of mBodyCloud System. Therefore, to provide an integrated protocol to include the sensor data to a standard HL7(Health Level7) medical information data.

• 한국정보통신학회논문지
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• 제18권7호
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• pp.1721-1726
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• 2014

유비쿼터스 컴퓨팅의 핵심 기술인 센서 네트워크 기술이 각광을 받으면서 다양한 종류의 센서 노드로 구성된 센서 네트워크에 대한 연구가 활발히 진행되고 있다. 센서 네트워크 어플리케이션들의 주요 트래픽 패턴은 몇몇의 센서 노드들로부터 싱크 노드로 패킷을 전송하는 타입의 단일 방향성 데이터 수집형태로 구성되어있으며 소스 노드, 중간 노드, 싱크 노드에 이르기 까지 각각 자신의 상위 노드를 곧 바로 깨움으로써 지연의 감소와 에너지 효율성을 이끌어냈다. 본 논문에서는 센서 노드의 지연 감소를 위해 2계층 클러스터 구조를 제시하고 이에 기존에 사용한 라우팅 프로토콜을 네트워크 시뮬레이션을 통해 비교 분석하였다.

• 한국광학회지
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• 제21권6호
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• pp.230-234
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• 2010

큰 복굴절 값을 갖는 광자결정광섬유는 실리카 단일 물질로 구성되어 온도 민감성이 매우 낮다. 이를 이용하여 온도변화에 영향을 받지 않는 스트레인 및 구부림 센서를 구현하였다. 이때, 스트레인 변화에 따른 민감도는 $1.41\;pm/{\mu}{\varepsilon}$ 이고, 구부림에 대한 민감도는 타원코어 장축 방향과 단축 방향으로의 구부렸을 때 각각 $0.93\;nm/m^{-1}$, $-1.6\;nm/m^{-1}$ 로 차이가 있었다.

• 센서학회지
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• 제15권4호
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• pp.277-283
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• 2006

We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.