• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.3-5
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• 2000

1.8V,4Gb DDR SDRAM설계 및 제작을 수행하였다. DRAM동작 시 발생하는 Bit Line간 CouplingNoise를 보상하기 위한 Twisted Open Bit Line 구조를 제안하였다. Low Voltage Operation으로 인한 Bit Line Sense Amplifier 의 동작 저하를 보상하기 위한 BL S/A Pre-Sensing 방식 및 Reference Bit Line Voltage Calibration 구조를 제안하였다. Chip면적 증가로 인한 동작속도 감소의 보상을 위해 Repeater Driver 구조를 Core 및 Periphery Circuit에 적용하여 동작 대비 Chip 면적의 증가를 최소화 하도록 하였다.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.11a
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• pp.1089-1092
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• 2004

This paper deals with the development of a contact-type counting device using a piezoelectric polymer film as a sensor. The piezoelectric and vibration characteristics of the film under a bending vibration were investigated theoretically and experimentally. A counting device, which includes filters, an amplifier, an analog-digital converter, and a display, was designed and fabricated. The performance of the piezoelectric polymer sensor was evaluated in the sense of the responses to contact force, contact frequency, and contact speed. The life and the temperature effect were also investigated for the piezoelectric film sensor.

• Journal of IKEEE
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• v.24 no.1
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• pp.161-169
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• 2020

In order to reduce the manufacturing cost of MCU chips used in applications such as wireless chargers and USB-C, compared to DP-EEPROM (Double Poly EEPROM), which requires 3 to 5 additional process masks, it is even more necessary MTP(Multi-Time Programmable), which is less than one additional mask and have smaller unit cell size. In addition, in order to improve endurance characteristics and data retention characteristics of the MTP memory cell due to E/P(Erase / Program) cycling, the distribution of the V_TP(Program Threshold Voltage) and the V_TE(Erase Threshold Voltage) needs to be narrow. In this paper, we proposed a current-type BL S/A(Bit-Line Sense Amplifier) circuit, WM(Write Mask) circuit, BLD(BL Driver) circuit and a algorithm, which can reduce the distribution of program and V_T and erase V_T, through compare the target current by performing the erase and program pulse of the short pulse several times, and if the current specification is satisfied, the program or erase operation is no longer performed. It was confirmed that the 256Kb MTP memory fabricated in the Magnachip semiconductor 0.13㎛ process operates well on the wafer in accordance with the operation mode.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.4 s.247
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• pp.364-372
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• 2006

In this paper, we present a finger tip tactile sensor which can detect contact normal force as well as slip. The sensor is made up of two different materials, such as polyvinylidene fluoride (PVDF) known as piezoelectric polymer, and pressure variable resistor ink. In order to detect slip on the surface of the object, two PVDF strips are arranged along the normal direction in the robot finger tip and the thumb tip. The surface electrode of the PVDF strip is fabricated using silk-screening technique with silver paste. Also a thin flexible force sensor is fabricated in the form of a matrix using pressure variable resistor ink in order to sense the static force. The developed tactile sensor is physically flexible and it can be deformed three-dimensionally to any shape so that it can be placed on anywhere on the curved surface. In addition, a tactile sensing system is developed, which includes miniaturized charge amplifier to amplify the small signal from the sensor, and the fast signal processing unit. The sensor system is evaluated experimentally and its effectiveness is validated.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1808-1813
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• 2005

In this paper, we present the finger tip tactile sensor which can detect contact normal force as well as slip. The developed sensor is made of two different materials, such as polyvinylidene fluoride(PVDF) that is known as piezoelectric polymer and pressure variable resistor ink. In order to detect slip to surface of object, a PVDF strip is arranged along the normal direction in the robot finger tip and the thumb tip. The surface electrode of the PVDF strip is fabricated using silk-screening technique with silver paste. Also a thin flexible force sensor is fabricated in the form of a matrix using pressure variable resistor ink in order to sense the static force. The developed tactile sensor is physically flexible and it can be deformed three-dimensionally to any shape so that it can be placed on anywhere on the curved surface. In addition, we developed a tactile sensing system by miniaturizing the charge amplifier, in order to amplify the small signal from the sensor, and the fast signal processing unit. The sensor system is evaluated experimentally and its effectiveness is validated.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.165-168
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• 2002

As the demand for higher data-rate chip-to-chip communication such as memory-to-controller, processor-to-processor increases, low cost high-speed serial links\ulcorner become more attractive. This paper describes a 0.25-fm CMOS 1.6Gbps/pin 4-level transceiver using Stub Series Terminated Logic for high Bandwidth. For multi-gigabit/second application, the data rate is limited by Inter-Symbol Interference (ISI) caused by channel low pass effects, process-limited on-chip clock frequency, and serial link distance. The proposed transceiver uses multi-level signaling (4-level Pulse Amplitude Modulation) using push-pull type, double data rate and flash sampling. To reduce Process-Voltage-Temperature Variation and ISI including data dependency skew, the proposed high-speed calibration circuits with voltage swing controller, data linearity controller and slew rate controller maintains desirable output waveform and makes less sensitive output. In order to detect successfully the transmitted 1.6Gbps/pin 4-level data, the receiver is designed as simultaneous type with a kick - back noise-isolated reference voltage line structure and a 3-stage Gate-Isolated sense amplifier. The transceiver, which was fabricated using a 0.25 fm CMOS process, performs data rate of 1.6 ~ 2.0 Gbps/pin with a 400MHB internal clock, Stub Series Terminated Logic ever in 2.25 ~ 2.75V supply voltage. and occupied 500 * 6001m of area.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.791-794
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• 2003

The increasing computational capability of processors is driving the need for high bandwidth links to communicate and store the information that is processed. Such links are often an important part of multi processor interconnection, processor-to-memory interfaces and Serial-network interfaces. This paper describes a 0.11-${\mu}{\textrm}{m}$ CMOS 4 Gbp s/pin 3-Level transceiver using RSL/(Rambus Signaling Logic) for high bandwidth. This system which uses a high-gain windowed integrating receiver with wide common-mode range which was designed in order to improve SNR when operating with the smaller input overdrive of 3-Level. For multi-gigabit/second application, the data rate is limited by Inter-Symbol Interference (ISI) caused by low pass effects of channel, process-limited on-chip clock frequency, and serial link distance. In order to detect the transmited 4Gbps/pin with 3-Level data sucessfully ,the receiver is designed using 3-stage sense amplifier. The proposed transceiver employes multi-level signaling (3-Level Pulse Amplitude Modulation) using clock multi phase, double data rate and Prbs patten generator. The transceiver shows data rate of 3.2 ~ 4.0 Gbps/pin with a 1GHz internal clock.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.3
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• pp.1-9
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• 2009

In this paper proposed a new method which adaptively eliminates comparator offsets using the threshold voltage shift by the Fowler-Nordheim stress. The method evaluates the sign of comparator offset and gives the FN stress to the stronger MOSFETs of the comparator, leading to offset reduction. We have used an appropriate stressing operation, named 'stress-packet', in order to converge the offset value to zero. We applied the method to the latch-type comparator which is prevalently used for DRAM bitline sense amplifier, and verified through experiments that offsets of the latch-type comparators are nearly eliminated with the stress-packet operations. We also discuss about the reliability issues that must be guaranteed for field application of this method.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.6
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• pp.421-430
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• 2003

In the embedded system, EPROM is difficult to replace a mask ROM for the applications using battery, because the low voltage characteristic of an EPROM is inferior to that of a mask ROM. In this paper, the new circuits such as a word line voltage hoosier scheme and a sense amplifier without reference input for an embedded EPROM in MCU are proposed. The circuits can detect bit line voltage a predetermined level, which is caused by the degradation of the battery. We fabricated a MCU embedded 32Kbytes EPROM. The proposed circuits well operated at 1.5V supply voltage and thus the low voltage performance was improved by about 30%.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.11
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• pp.126-134
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• 1990

In order to implement high-speed data acquistion system in CMOS VLSI technology, means must be found to overcome the relatively low transconductance and large device mismatch characteristic of MOS device. Because of these device limitations, circuit design approaches tradition-ally used in high-speed bipolar analog-to-digital converter(ADC) are suited to CMOS implementation. Also the design of VLSI CMOS comparator wherein voltage comparision is accomplished by means of a pipelined cascade RSA (Regenerative Sense Amplifier). So, in this paper we designed the A/D converter incorporates the pipelined CMOS comparator.