• IE interfaces
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• v.25 no.2
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• pp.178-186
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• 2012

The DRAM module is an important part of servers, workstations and personal computer. Its malfunction causes a lot of damage on customer system. Therefore, customers demand the highest quality products. The company applies DRAM module Outgoing Quality Assurance Inspection(OQA) to secures the highest quality. It is the key process to decides shipment of products through sample inspection method with customer oriented tests. High fraction of defectives entering to OQA causes inevitable high quality cost. This article proposes the application of ensemble learning to classify the lot status to minimize the ratio of wrong decision in OQA, observing a potential in reducing the wrong decision.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.364-369
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• 2005

In the semiconductor and optical industry the non-contact transportation is required for reducing the damages. The ultrasonic levitation is the solution of the problem. In this paper, the ultrasonic levitation system and 3 disk-type stator for levitation various object are proposed. The vibration modes of disks are analyzed with FEM and designed with the analysis results. The 3D vibration profiles of the disks are measured by Laser scanning vibrometer for verifying the vibration characteristics of the system. The amplitudes of the disks and the levitation heights of object are measured for evaluating the performance.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.4
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• pp.35-41
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• 2008

R/In order to satisfy the customer's variant needs for a product quality in recent years, a demand for developing higher precision machining technologies in a lot of application areas such as automobile, cellular phone and semiconductor has been increased more and more. Magnetic abrasive polishing(MAP) process is one of these precision technologies. In this study, to verify the parameters' effect of the MAP process on the surface roughness improvement of the plane and the inclined workpiece, well planned experiments which was called the design of experiments were carried out. Considered polishing factors were spindle speed, supplied current, abrasive type and working gap between the workpiece and the solid tool. As a result, it was seen that the supplied current and the working gap greatly affected the surface roughness improvement.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.899-905
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• 2009

There are many different types of surface defects on semiconductor Integrated Chips (IC's) caused by various factors during manufacturing process, such as Scratch, Flash, Resin bleed, and Melting. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, Resin bleed and Melting are the most difficult ones to classify accurately. The brightness value and the shape of Resin bleed and Melting defects are so similar that normally it is difficult to classify the Resin bleed and Melting. In this paper, we propose a segmenting method and a set of features for detecting and classifying the Resin bleed and Melting defects.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.50 no.9
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• pp.417-422
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• 2001

The brushless DC motor(BLDCM) is widely used in many applications. One of the application of the BLDCM is the stage which is one of process in the semiconductor manufacturing processes. Very high performance is required in the stage process. In this paper, the 1 degree of freedom positioning system for the basic technology of the stage is studied. The linearization method is proposed to make the controller design procedures easy by measuring the thrust force ripple using the strain gauge. And through the experiments, it is proved that the inner velocity control loop is necessary to make more precise positioning control system.

• Proceedings of the KAIS Fall Conference
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• 2000.10a
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• pp.124-127
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• 2000

반도체 제조 공정의 진단 및 고장 예측 시스템을 개발하기 위해 PCA(Principal Component Analysis) 기법을 적용하여 데이터 분석을 하고자 하며, 이에 대한 이론적인 연구와 연구 수행 절차를 구체적으로 정립하였다. 비쥬얼 C++에서 MATLAB과 PLS_Toolbox 등을 연동하여 직관적이고 시각적이며 사용자가 효율적으로 공정 현장에 적용할 수 있는 시스템을 개발하고자 한다. 지금까지 PCA와 관련한 다양한 문헌 조사를 수행하였고, 이론적인 연구를 하였다. 비쥬얼 C++ 프로그램에서 MATLAB과 PLS_Toolbox 등을 연동하기 위해 필요한 환경 선정 등을 완료하였으며, 초기 단계의 간단한 모듈들을 개발하였다. 다음 단계의 모듈들은 좀 더 빠른 시간에 개발할 수 있을 것으로 기대한다. 이를 공정 현장에서 수집한 다양한 데이터에 적용하여 그 결과를 피드백하여 시스템을 수정하고 보완하고자 하며, 마지막으로 현장에 적용하고자 한다.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.338-344
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• 1996

This study was an investigation of plasma-induced damages on silicon substrate in the semiconductor manufacturing technology. The plasma-induced damage level on silicon substrate was analyzed and compared in various plasma etching systems. The analysis methods were therma wave, life-time recovery, SCA (Surface Charge Analyzer) and TRXF (Total Reflection X-ray Fluorescence) measurements, and the measured values were compared for each systems. In the comparison of the values which were obtained by a system that had low life-time recovery, there was not any differences in DC parameters. However, the reflesh time distribution of device of that system had decreased about 10 to 20m sec compared to a system which had high life-time recovery.

• Proceedings of the KIEE Conference
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• 2003.07b
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• pp.1006-1008
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• 2003

Position controls are very important in semiconductor manufacturing devices, machine tools precision measuring instruments, etc. to measure the distance of movement of moving objects in minute units and the accuracy of measurement for the moving distance in these devices affect the performance of the whole devices. Therefore, in those precision instruments, a sensing device that can measure the distance of movement with high-precision resolution is required. In this paper, a novel encoder of digital and analog hybrid type is proposed. It is shown that from this experiment a high-resolution angle measurement device can be designed by a low cost incremental encoder.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.11
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• pp.954-958
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• 2000

The characterization of zinc diffusion processes applied for high-speed avalanche photodiodes has been examined. The different diffusion process conditions for InP test structures were explored. The zinc diffusion profiles, such as the diffusion depth and the zinc dopant concentration, were examined using secondary ion mass spectrometry with varying the process variables and material parameters. It is observed that the diffusion profiles are severly impacted on the process parameters, such as the amount of Zn$_3$P$_2$ source and the diffusion time, as well as material parameters, such as doping concentration of diffusion layer. These results can be utilized for the high-speed avalanche photodiode fabrication.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.6
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• pp.45-54
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• 2004

Usually, according as accumulation degree of semi-conductor element increases, dynamic mistake test time increases sharply, and use of pattern generator is essential at manufacturing process to solve these problem. In this paper, we designed the PLD(Programmable Logic Device) circuit of pattern generator to examine dynamic mistake of semi-conductor element. Such all item got result that is worth verified action of return trip and function through simulation, and satisfy.